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Advances in M2M Development
Advances in M2M Development
Advances in M2M Development
Advances in M2M Development
Advances in M2M Development
Advances in M2M Development
Advances in M2M Development
Advances in M2M Development
Advances in M2M Development
Advances in M2M Development
Advances in M2M Development
Advances in M2M Development
Advances in M2M Development
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Advances in M2M Development


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  • 1. Advances in M2M Development Sam Lucero Sr. Analyst, M2M Connectivity ABI Research
  • 2. Presentation Outline
    • Vendor Framework for Technology Evaluation
    • FOTA
    • Embedded SIMs
    • Module Form Factors
    • Reference Designs
    • Embedded Application Processing
    • Module Technology Integration
    • Application Development Platforms
    • Roaming
  • 3. Vendor Frameworks Customers Suppliers Vendors Application Development M2M Module Costs Connectivity Costs
  • 4. FOTA
    • FOTA: Remote updates for firmware, software components, and device management
    • Another handset technology that applies to M2M
      • For handsets, the benefit is customer convenience
      • For M2M, the benefits are operational efficiency and cost
    • FOTA implementation in the M2M market
      • Wavecom: self-developed as part of RDM Services
      • Red Bend: third-party supplier to Telit, Sierra Wireless, and Motorola
    • FOTA increasingly important, largely outsourced
  • 5. Embedded SIMs
    • Traditional external plastic GSM SIMs enable subscriber service portability, but…
      • Lack robustness for M2M relating to temperature, vibration, and humidity
      • SIMs can be (and frequently are) stolen
      • Necessitates more complex supply-chain
    • Embedded SIMs
      • NOT “Soft SIMs” – operators won’t allow software-only SIMs due to security concerns
      • Hardware SIM embedded into module package
      • Resolve challenges noted above
      • Standards process ongoing in ETSI; standard by early 2009?
      • Wavecom, Telit, Gemalto
  • 6. Module Form Factors
    • Decreasing size / increasing functionality
      • Wavecom WISMO 1 (1996) = 23.5 square centimeters
      • Wavecom Quik 26XX (2005) = 5 square centimeters
    • Connectorized versus BGA
      • Connectorized: flexibility, lower initial cost
      • BGA: size (!), robustness (!), manufacturability, lower production costs, increased I/O
    • MiniCard
      • An offering from the PC connectivity world
    • Bus interface trends
      • Mostly serial, some SPI, IIC, I2C, PCI Express, USB
  • 7. Reference Designs
    • From modem to DOB (Direct-On-Board)
    • Two levels of “reference design”
      • End application design services
      • Radio functionality (module) design
    • Who offers module reference design, and why?
      • Module vendor
      • Silicon vendor
    • Module reference designs versus DOB
      • DOB Pros: reduced BOM cost, reduced size, increased robustness
      • DOB Cons: higher initial costs, required expertise
      • Telematics is the “canary in the coal mine”
  • 8. Qualcomm inGeo Reference Design
  • 9. Module Technology Integration
    • Key technologies under consideration
      • SRW (ZigBee, Wi-Fi), GPS, Satellite
    • Integration rationale
      • Reduce BOM costs, design complexity, and supply-chain complexity for customer while increasing module differentiation and value
    • Integration challenges
      • Desire for “best-of-breed,” differing pace of technological innovation, which technologies to integrate?, customer lock-in
    • Module vendor responses
      • Integrate
      • Offer standalone
      • Optimize for third-party
  • 10. Onboard Application Processing
    • From bit-pipe to application processing board
      • Increase application processing power and memory
      • Integrate a second application processor
    • Application integration benefits and hurdles
      • Customer benefits: reduced solution costs, tighter integration
      • Module vendor benefits: increased differentiation and value
      • Customer hurdles: sunk costs, fear of vendor lock-in
      • Module vendor hurdles: cost-competitiveness
    • OS trends:
      • JAVA, Python, BREW, “Proprietary C/C++”, Linux
      • Embedded OS/RTOS – NOT Windows CE/Mobile, Symbian, Android, LiMo, ALEOS
  • 11. Application Platforms
    • Overcoming the application development challenge: Most M2M applications are complex, custom efforts
    • Differing vendor strategies
      • Cinterion Wireless Modules (M2M One)
      • Wavecom (Anyware/IDS)
      • SensorLogic (XpressIQ Service Suite)
    • Challenge to help customers without infringing on customers’ core competencies
  • 12. Roaming
    • Roaming is a challenge in the M2M world
      • M2M: remote batch deployments with high chance for roaming
      • Handsets: user-controlled devices mainly used locally
      • M2M challenges: roaming rates and SIM management
    • Recent European Union actions not a solution
      • Voice, not data – and still a premium
      • Regional rather than global in scope
    • Different approaches to a workable solution
      • Wyless: SIM management
      • Jasper Wireless: working with one service provider
      • BlueSlice / Wireless Maingate: enabling many service providers
  • 13. Thank you: Questions?