NASSCOM Innovation Awards 2007, Anees Ahmed, CEO Texas Instruments,Mistral Software

Slide 2: Communications in Emerging Markets Growth Drivers New Subscribers and Upgrades Affordability Ease of use Industry Trends Affordability for high growth markets Weather Compelling feature-rich solutions Robust Infrastructure to support

Slide 3: More affordable is not low on features Penetration of Total Handsets Sold 90% Source: Strategy Analytics, April 2007 % of Global Handset Sales, all technologies 80% 70% 60% Mobile TV 50% FM Radio 40% Streaming Video Music 30% Camera 20% 10% 0% Source: iSuppli, 3Q07 2004 2005 2006 2007 2008 2009 2010 2011 Feature Penetration in Feature Penetration in 100 China Color Screen India 100 Color Camera Screen 80 Music 80 Source: iSuppli, February 2007 60 % Bluetooth 60 Camera Video ® FM Radio 40 FM Radio 40 Music Bluetooth® 20 20 0 2006 2007 2008 2009 2010 2011 0 2005 2006 2007 2008 2009 2010

Slide 4: It’s a connected world- Wired & Wireless GSM/GPRS/EDGE WiMAX/ Wireless Wi-Fi® Bluetooth® Infrastructure Software Defined Video/ aGPS DTV Radio Communications Infrastructure Media FM Radio NFC Gateway/ Triple IP Net Camera Play UMTS/HSxPA IP Video Phone

Slide 5: TI Works on System Solutions General Special Programmable Purpose Processors Purpose Processors Integration Low Power 90nm 90 n 65nm Differentiation m 65 n 45nm Seamless m Scalability Communi- cations Applications Power Management Silicon / Software & Integration Drive communications in the connected world

Slide 6: Texas Instruments – An Overview Texas Instruments Inc Then  Founded 1930 - Geophysical Services Inc.  Jack Kilby invented world’s first integrated circuit in 1958, 2000 Nobel Prize Now  World Leader in DSP & Analog  31,000 employees worldwide  $13.83B 2007 revenue, $2.2B annual R&D TI India- 22 Years of innovation from India Then  Started in 1985: TI begins the IT revolution in India 1985 Now  1350 employees.  R&D Operations in Bangalore & Chennai, Sales locations in Delhi, Pune, Hyderabad, Chennai  Adjudged Most Innovative Company in India by Dataquest in 2005 2007  Has the highest number of US Patents from India- 485  1000+ papers in international conferences

Slide 7: LoCosto Single Chip Phone 1,000 10 900 9  6-8 million new users each 800 8 month (Source: COAI) Handsets (M) 700 Percent Share 600 7  India government targets for 500 6 500M subscribers by 2010 400 5 300 4 TI’s LoCosto enables to 200 100 3 “connect the unconnected” 0 2 2004 2005 2006 2007 2008 2009 Global Handset Shipments India's Share in Global Shipments (Source: iSuppli) Additional space for Features like GPS, WLAN, Bluetooth, FM radio

Slide 8: Media Convergence by OMAP3 Industry’s highest S-video TV output performing/lowest power for video/image display processor 1st applications Outstanding gaming processor in 65nm capabilities First HD Quality camcorder Supports 12 Mega Pixel on phone Camera, < 1 Sec shot- shot delay Camera Video Music Music Internet Gaming High-level OS support – TV Linux®, Symbian OS™, Windows® Seamless connectivity to hard- Mobile disk drive devices

Slide 9: Infrastructure: Base Station/Media Gateway  C64x+ Architecture enables 802.20 Voice/Audio/Video Himalaya- Revolutionary Core Network “Soft” Baseband Voice, Data solution Multimedia – World’s fastest Programmable DSP 1.2GHz Base Station Voice Tomahawk- Media Gateway PSTN  6 x 500 MHz C64x+ Cores allow performance at lower Media Gateway voltage IP FAX  Lower Power => Lower Network Cooling Costs Voice (VoIP)  3X Channel Density IP Video Phone

Slide 10: Recognitions  1999 - EDN Asia Component Design Award for “Ankoor”  1999 - EDN Innovation of the Year Award “ xStream DSP”  1999 - EDN Top 100 Product of the Year Award “THS1206 ADC”  1999 - EDN Innovation of the Year Award “eXpress DSP”  2000 - EDN Asia Component Design Award “TLFD600”  2001 - EDN Asia Innovator of the Year Award  2002 - EDN Asia Innovation of the Year Award “Malhar”  2003 - MAIT Award for Excellence in Innovation  2003 - #1 Company to Work for in India – Business World  2004 - #2 Company to Work for in India (Behind FedEx), Business World  2004 - STPI Award for Exports  2005 - Dataquest Award for most Innovative Company  2005 - EE Times Annual Creativity in Engineering (ACE) Award: \"LoCosto\" Single Chip Cell Phone Processor  2006 - Semiconductor INSIGHT Award: \"LoCosto\" single-chip mobile phone platform - Most Innovative Baseband and/or Applications Processor  2006 - EDN Top Programmable Embedded Processor of the Year Award for Antara  2006 - PC Magazine's annual Technology Breakthroughs! TI OMAP3430  2007: STPI Award for #1 in Semiconductor Exports

Slide 11: Innovation: Our attempt to make it a culture  TI has a strong technical ladder & TI India engineers get peer elected to key rungs of TI Tech Ladder: – Member, Senior, Distinguished, Fellow, Senior Fellow, and Principal Fellow  Very close interaction with customers and customer’s customers  Connecting Product and End use of products to every engineer  Small Teams- Small Dreams  Multiple small companies inside TI  Systems company: leverage Analog, Digital, Hardware, Firmware, Software competencies to provide customer delight!

Slide 12: TI makes the world smarter, healthier, safer and more fun…