Physical vapor deposition

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Physical vapor deposition

  1. 1. By Muhammad Ali Asghar MUHAMMAD ALI ASGHAR VC&ML NINVAST
  2. 2. Michael Faraday used PVD in 1838 MUHAMMAD ALI ASGHAR VC&ML NINVAST
  3. 3. Deposition  Applying a thin film on a surface ranges from nano meters to micro meters.  Thin film is deposited on Substrates.  Different techniques are used for deposition PVD, CVD, sputtering, electroplating & coating. MUHAMMAD ALI ASGHAR VC&ML NINVAST
  4. 4. Physical vapor deposition  Physical coating process involve, condensation & evaporation of material  PVD is used for high melting point & low vapor pressure materials.  PVD is carried out at high temperature and vacuum.  In contrary to PVD, CVD is a method in which chemical adhesion or chemical deposition occurs. MUHAMMAD ALI ASGHAR VC&ML NINVAST
  5. 5. High temperature is required to vaporize the material Vacuum of different ranges is used which depends on the mean free path required in the system. MUHAMMAD ALI ASGHAR VC&ML NINVAST
  6. 6. PVD methods are commonly used in followings: Circuit & IC fabrications. Aerospace in TBC & transparent coatings. Reflectors and optics MUHAMMAD ALI ASGHAR VC&ML NINVAST
  7. 7. Evaporative deposition Electron beam vapor deposition Pulsed laser deposition Sputter deposition Ion induced deposition Cathode Arc Deposition MUHAMMAD ALI ASGHAR VC&ML NINVAST
  8. 8. Evaporative deposition  Resistive heating method is used.  deposition is performed at high temperature & low vacuum  Vacuum decreases the content of Contamination  Voltage & current is manually controlled.  Material is kept in boats. MUHAMMAD ALI ASGHAR VC&ML NINVAST
  9. 9. Resistive heating unit MUHAMMAD ALI ASGHAR VC&ML NINVAST
  10. 10. Electron beam is generated by tungsten filament. Material is placed in Graphite or tungsten crucible Deposition mechanism is same  deposition is carried out under high vacuum. Deposition is controlled, and Uniform MUHAMMAD ALI ASGHAR VC&ML NINVAST
  11. 11. MUHAMMAD ALI ASGHAR VC&ML NINVAST
  12. 12. Pulsed laser deposition  High power laser is used for deposition.  Argon or neon is used for inert atmosphere.  High vacuum is formed  laser is focused by lens, target decides the position of the deposition . MUHAMMAD ALI ASGHAR VC&ML NINVAST
  13. 13. Sputter deposition  Sputtering works on the bases of momentum principle, formed by the collision of the atoms and molecules.  Plasma glow, ion accelerator or radioactive emitting is used to evaporate material.  argon gas is used for inert atmosphere.  Types of sputtering  Chemical and etching sputtering  Electronic sputtering  Potential sputtering MUHAMMAD ALI ASGHAR VC&ML NINVAST
  14. 14.  In this process ions are deposited on the substrates.  This process is used for IC fabrication, micro circuit printing nano printing or pattering . & lithography.  It will be discussed in detail with nano pattering. MUHAMMAD ALI ASGHAR VC&ML NINVAST
  15. 15. PVD advantages & Disadvantages  Environment friendly then  Cooling systems are required. paint & electroplating.  Mostly high temperature and  more than one PVD vacuum control needs skill & technique can be used for experience. coating.  PVD coated materials has no  Usually topcoats are not chemical interaction with the required. surface that  Good strength and durability. MUHAMMAD ALI ASGHAR VC&ML NINVAST
  16. 16. MUHAMMAD ALI ASGHAR VC&ML NINVAST
  17. 17. MUHAMMAD ALI ASGHAR VC&ML NINVAST

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