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Ads Pres Nov 14

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advanced system design, peter gonzalez

advanced system design, peter gonzalez

Published in: Business, Technology

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  • 1. Presented by: Peter Gonzalez November 14, 2008
  • 2. Overview
    • In business since 1994
    • IPC Certified Layout Designers
    • Clients: Harris Corporation, Motorola, Intersil, Raytheon, Lockheed Martin, Northrop Grumman, DRS, SAIC, L-3 Communications, etc.
    • Type of Work: Military, Aerospace, Medical, Commercial
    • 10 employees
  • 3. Services
  • 4. PCB LAYOUT SERVICES
    • High Density Multilayer, Blind/Buried vias, Microvias, HDI
    • High Speed Digital Designs
      • DDR, PCI Express, Gigahertz Ethernet
    • RF / Microwave Designs
    • Rigid Flex and Flex Designs
    • Backplanes, Power Supplies, VME, PMC,CPCI, PCI
    • Design for DFM and DFT
    • Constraints Rule Driven Designs
    • Controlled Impedance, Differential Pairs, Matched Length
    • MATERIALS:
      • FR4, Polyimide, Rogers, Arlon, Isola, Nelco, Getek
  • 5. ROUTING SERVICES
      • Manual Routing of critical Signals
      • Constraints Driven Auto-Routing
  • 6. SCHEMATIC ENTRY
    • Full CAD Data output, BOM, netlist
  • 7. LIBRARY DEVELOPMENT
      • Schematic Symbols
      • PCB Layout Footprints
  • 8. DOCUMENTATION
    • Mechanical &
    • Electrical CAD
    • Drafting support
  • 9. OTHER VALUE ADDED SERVICES
      • Reverse Engineering
      • Digital/Analog Circuit Designs Services
  • 10. Layout Process
  • 11. STEP 1: DATA PREP
    • Schematic
    • - Netlist
    • - Datasheets for all parts
    • - Parts List with MFG Part Numbers and description of parts
    • - Mechanical outline with keepouts and Height Restrictions
    • - Statement of Work
    • - Preliminary Component Placement
    • - Suggested Layer Stack-up
    • - Critical Routing, Impedances
  • 12. STEP 2: PLACEMENT
    • - Placement of Critical Components
    • - Layer Stack-up Setup
    • - Contraint Setup for critical routing
    • - Placement Review
  • 13. STEP 3: ROUTING
    • - Fanout, Plane Setup, Impedance Calculation
    • - Pre-routes of all critical signals
    • - Completion of routing (Manually or Auto-routing)
    • - Routing Review
    • - Back annotate Reference Designators
    • - Generation of Assembly and Fabrication Drawings
  • 14. STEP 4: POST PROCESS & DELIVERABLES
    • 1- XXXXXX_mfg.zip Everything the MFG needs to assemble the board.
    • XXXXXX.val CDS2FAB FILE FOR ASSEMBLY
    • data.file UNICAM FILE FOR ASSEMBLY
    • route.txt VALOUT FILES FOR ASSEMBLY
    • board.txt “
    • pad.txt “
    • symbol.txt “
    • testprep.log TEST POINT REPORT
    • XXX-ccam.cad CIRCUIT CAM FILE
    • 2- XXXXXX_art.zip Everything the Vendor needs to fabricate the bare board (Gerber Files).
    • ads-fab.art fabrication drawing
    • ads-l0X.art layer 01 thru however many layers there are.
    • ads-smt.art solder mask top
    • ads-smb.art solder mask bottom
    • ads-spt.art solder paste top
    • ads-spb.art solder paste bottom
    • ads-sst.art silk screen top
    • ads-ssb.art silk screen bottom
    • photoplot.log Photoplot/Gerber log file
    • art_aper.txt Aperture list
    • art_param.txt Gerber parameters
    • ADS-001.tap NC Drill file
    • nctape.log NC Drill count
    • testprep.log TEST POINT REPORT
    • XXXXXX.ipc IPC 356 NET LIST for E-Test
  • 15. POST PROCESS & DELIVERABLES (cont’d)
    • 3- XXXXXX_brd.zip CAD Database and reports for Archive
    • XXXXXX.brd ALLEGRO DATABASE BOARD FILE
    • net.rpt ALLEGRO NET LIST FILE.
    • place.rpt COMPONENT (X, Y POSITION)
    • sum.rpt ALLEGRO SUMMARY REPORT
    • testprep.log TEST POINT REPORT
    • 4- XXXXXX_dxf.zip DXF files for every layer.
    • asyt.dxf ASSEMBLY TOP DXF FILE
    • asyb.dxf ASSEMBLY BOTTOM DXF FILE
    • fab.dxf FABRICATION DRAWING DXF FILE
    • 5- XXXXXX_pdf.zip PDF files for every layer.
    • asyt.pdf ASSEMBLY TOP PDF FILE
    • asyb.pdf ASSEMBLY BOTTOM PDF FILE
    • fab.pdf FABRICATION DRAWING PDF FILE
    • 6- XXXXXX_odb.zip ODB++ Manufacturing files
    • Accreditations page:
  • 16. www.adspcb.com 321.676.6358

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