Radsok Presentation Ipe

Connecting People and Technology Amphenol

Amphenol Industrial Operations World Wide Manufacturing Locations Shenzhen, CN Sidney, NY Nogales, MX Fraser, MI Guangzhou, CN

RADSOK® Technology What is it?
RADSOK® technology is based on a stamped and formed flat grid, uniquely twisted into a hyperbolic geometry to provide robust, high density contact to the mating pin contact. Unlike most other pin and socket solutions, the RADSOK® also utilizes the tensile strength properties of the flat, high conductivity alloy grid. This provides the high normal forces required for conductivity while also providing a large conductive surface area. Correspondingly, low voltage drop and low temperature rise are achieved while maintaining low insertion forces
Features:
RADSOK® = rad ial so c k et contact
Stamped and formed hyperbolic grid
High pin-to-socket interface ratio
Low mating forces
Low contact resistance
High current rating (50% greater than standard contacts)
Extreme durability (20,000+ mating cycles
Ultimate reliability

History of RADSOK®
The RADSOK® design was invented and patented by K&K Stamping located just outside of Detroit, Michigan.
After years of success in the automotive market, Amphenol took interest in the technology as a way to differentiate our standard products.
Amphenol acquired the RADSOK® rights from K&K Stamping on September 1, 2002 and is now considered one of Amphenol’s proprietary premium products.

Bringing Power to Printed Circuit Boards
Modern day electronics require significant increases in the amount of power needed for printed circuit board applications.
Conventional interconnects can not handle the higher power requirements.
The most common solution to increase power to the PCB is to increase the thickness of the copper layers in the board. This is usually very costly and traps heat within the PCB.
Other options are to bring additional wires to the board which creates a “Bundle” of wire. This option takes up space on the PCB and does not allow proper air flow, which can cause failures.
To simplify the application design, users incorporate busbars to bring power to the board.

The RADSOK® Solution
Amphenol Industrial Operations has developed three new
compact, high amperage connectors for high current,
single-point connections to printed circuit boards (PCB’s).
Our new interconnect products are:
RADSERT™ ,
PowerBlok™
PGY™
Each of these products uses our proprietary
RADSOK® technology to deliver more power
to the PCB and are ROHS Compliant

RADSERT™
RADSERTS ™ are available with either a 2.4mm or 3.6mm RADSOK®. 2.4mm is rated for up to 35 AMPS, 3.6mm is rated for up to 70 AMPS. Both are available in either a “Press-fit” or solder version.
The design of the board determines if the RADSERT™ will be connected during board manufacturing by a solder re-flow process or press-fit manually after manufacturing.
The press-fit RADSERT™ is designed for board thicknesses of .250” +/- .025”. The press-fit design consists of a RADSOK® and special RADSERT™ holder which are easily press-fit into plated through holes in the PCB.
The Solder version RADSERTS™ are available for a variety of board thicknesses and are connected to the board by a solder re-flow process. Refer to the Price Guideline page for detailed descriptions and sizes of our solder RADSERTs™.
Custom sizes can be designed for specific board applications.

POWERBLOK™
Housed in a small package of ½” x ½”
or (12.7mm X 12.7mm) PowerBlok’s™ provide up to 70 AMPS of power to a board.
The component’s backplane power interface uses compliant pins, which are press-fit into the board, enabling a solid connection and an even signal flow.
PowerBlok™ features a radial design that ensures many points of contact as well as a touch-proof cover for safer operation.
Available with a 3.0mm RADSOK® connector, the small footprint is a definite advantage for engineers who are limited in their PCB design with size and weight requirements.

PGY’S™
The PGY ™ is our orthogonal card edge connector available in two sizes, 3.6mm carrying up to 70 AMPS and 5.7mm carrying up to 120 AMPS, delivering the highest amperage in the smallest package.
The PGY™ is connected to the PCB through a solder reflow process.
The busbar pin will mate horizontally with the RADSOK® slightly above the board. The “legs” of the PGY™ dissipate high power evenly in the board.
PGY’s™ are very valuable to design engineers as they can achieve valuable size and weight reductions within their design without compromising the power needed for their board.

RADSOK ® Product Markets Board Level (H-P, Cisco, NEC) AAO Focus (Oshkosh, GDLS, BAE, DRS) Heavy Truck Hybrid (PACCAR, Freightliner) Heavy Equipment (CAT, John Deere, CNH) Rail/Mass Transit (Bombardier, GE- Loco, Kawasaki) Power Generation, Distribution, & Conditioning (NOV, Gamesa, APC, Homac) Communication & Infocom (Siemens, Lucent, Nortel) RADSOK® PowerBus

Target Market
RADSOK® Board level products are not limited to a specific market or special technology.
Manufacturers of PC’s, servers, and backplanes are all possible customers.
PCB manufactures and any users of PCB’s are potential customers for our current RADSERT™, PowerBlok™ and PGY™ products.
Currently our board level products are available up to 120 AMPS. As market opportunities become available, we would like to utilize our other RADSOK® sizes with higher AMPS to expand this product family. Bring us your custom high power applications!
Hewlett Packard, Cisco Systems and NEC, have achieved great success with designing these products into their applications.
*Any company designing, manufacturing or simply using
printed circuit boards, IS YOUR target market.

Radsok Presentation Ipe

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