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Technical Objective Specification

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This template is a simple format to capture the basic requirements of the technical spec documentation for a new product development. It should be used alongside the Business Objective Plan (BOP) …

This template is a simple format to capture the basic requirements of the technical spec documentation for a new product development. It should be used alongside the Business Objective Plan (BOP) template when presenting a new product development for approval.

Published in: Business, Technology

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  • 1. Kay Associates LLC (www.kayassociates.org) Company Name Technical Objective Specification PRODUCT NAME PRODUCT NUMBER: X REVSION: X DATE: X PREPARED BY: X APPROVALS: PRODUCT PRODUCT EXECUTIVE PLANNING DEVELOPMENT OPERATIONS REVIEW DATE: DATE: DATE: DATE: COMPANY CONFIDENTIAL
  • 2. Kay Associates LLC (www.kayassociates.org) TABLE OF CONTENTS OVERVIEW..................................................................................................................................................................3 DATASHEET..........................................................................................................................................................................3 SUB-CONTRACTORS...............................................................................................................................................................3 TECHNOLOGY DATA...............................................................................................................................................4 PROCESS...............................................................................................................................................................................4 SPECIAL REQUIREMENTS........................................................................................................................................................4 FOUNDRY AND PACKAGING DATA....................................................................................................................5 DIE INFORMATION..................................................................................................................................................................5 PACKAGE REQUIREMENTS.......................................................................................................................................................5 SPECIAL REQUIREMENTS........................................................................................................................................................5 COSTS..................................................................................................................................................................................5 TEST PLAN..................................................................................................................................................................6 TESTER.................................................................................................................................................................................6 TEST FLOW...........................................................................................................................................................................6 Wafer Sort..............................................................................................................................................................6 Final Test...............................................................................................................................................................6 TEST COST...........................................................................................................................................................................6 QUALIFICATION PLAN...........................................................................................................................................7 PROCESS QUALIFICATION PLAN..............................................................................................................................................7 PACKAGE QUALIFICATION PLAN.............................................................................................................................................7 RELIABILITY DATA................................................................................................................................................................7 TOS Page 2 of 7
  • 3. Kay Associates LLC (www.kayassociates.org) OVERVIEW Datasheet The datasheet is attached. The format of the datasheet is XXXXXXX: Product Specification data is confirmed by the Product Development Group, but the Spec document is edited and controlled by Product Marketing Group Sub-Contractors Identified sub-contractors for this product are: Mask Shop Company: Contact: Tel number: Foundry: Company: Contact: Tel number: Packaging: Company: Contact: Tel number: Test: Company: Contact: Tel number: Other: Company: Contact: Tel number: TOS Page 3 of 7
  • 4. Kay Associates LLC (www.kayassociates.org) TECHNOLOGY DATA Process Special Requirements TOS Page 4 of 7
  • 5. Kay Associates LLC (www.kayassociates.org) FOUNDRY AND PACKAGING DATA Die information Package Requirements Special Requirements Costs TOS Page 5 of 7
  • 6. Kay Associates LLC (www.kayassociates.org) TEST PLAN Tester Test Flow Wafer Sort Final Test Test Cost TOS Page 6 of 7
  • 7. Kay Associates LLC (www.kayassociates.org) QUALIFICATION PLAN Process Qualification Plan Package Qualification Plan Reliability Data TOS Page 7 of 7

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