Martin J. Pitasi
978-463-9495 (O) 42 Middle Road
978-270-1407 (M) Newbury, MA 01951
An accomplished, hands-on, Senior Mechanical Engineer with over 15+ yrs. of
experience in designing and developing solutions to challenging, mechanical, and
thermal-mechanical packaging requirements. A seasoned individual contributor with a
broad background in engineering fundamentals who iterates solutions based on hand
calculations/FEA studies and empirical validation techniques. A results-oriented listener,
speaker, and presenter who collaborates with teams and individuals to deliver cost-
Engineering Manager Thermal Management RF/Microwave Structures
Proposals & Reports Heat Transfer Materials Failure Analysis
System Architect Refrigeration FEA & CFD Analyst Inventor
Packaging Heat Exchangers Test Validation Microsoft Office
Owner/Senior Mechanical Engineer
HTE Associates, Inc., Newbury, MA 1999-Present
Introduced a state-of-the art liquid cooling technology that established a competitive
advantage in system power, weigh, and size-BAE
Led a BAE packaging team in developing a 1200w, 6Ux160mm PA/BF
RF/Microwave module and its 52kw system design for an advanced avionics radar
Managed the ProE exploratory packaging effort for a Novel airborne Phased Array
Radar system using VITA, VME, and COTs products and specifications-BAE
Investigated the packaging viability of integrating GaN RF amplifier technology with
POLYSTRATA microwave hardware using ANSYS-BAE
Matured the cryogenic cooling design of a novel airborne laser proof-of-concept
proposal that resulted in a funded proof-of-concept contract
Pioneered and developed the methodology of high efficiency, low cost, pumped-
refrigerant cooling systems used for precision thermal control.
Formulated the design of miniature surface-to-refrigerant heat exchangers that
demonstrated a cooling effectiveness in excess of 800 watt per square centimeter
Designed, built, and tested prototypes for 10kw computer system, 400w computer on
a chip, and 800w per square centimeter electro-optical coolers, etc.
Designed, built, instrumented, and calibrated a one-of-its-kind two-phase test bench
used for validating design concepts.
Collaborated between sales, engineering, and customer to facilitate a multi-million
dollar international sale of Teradyne‟s advanced 2½”disk drive testers.
Assessed the cooling capacity of a disk drive factory; designed and managed a plan
to increasing its capacity from 400 tons to 1600 tons.
Supported Teradyne‟s operations team in bring up the first on-site system.
Concurrently, identifying cost down mechanical packaging opportunities in excess of
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Martin J. Pitasi
Cadence Design, Chelmsford, MA 1995-1998
Assessed customer needs and facilitated contract negotiations.
Technical/marketing advisor during pre-sales round-table discussions and
Expert in the use of Cadence‟s DF/Thermax tool set.
Spearheaded Cadence/Alcatel international physical hardware performance
engineering team delivering As-Is assessment and To-Be proposal efforts.
Facilitated the sale of a million dollar Cadence design tool
Project Manager/Individual Contributor
Hewlett-Packard/Apollo, Chelmsford, MA 1988-1995
Provided thermal design consulting services to internal and external customers
Coached, developed, and supervised five direct reports and eight indirect reports.
Managed risks and exposures, and initiated solutions to meet high-speed computer
designs for commercial and harsh/hazardous military environments including RF.
Used HP “Hardware System Product Life Cycle” specification to deliver mechanical
packaging hardware system designed within budget, and on schedule.
Consultant to R&D senior management teams to plan, budget, and schedule system
Built, managed, and led cross-functional teams in power, cooling, acoustics,
mechanical, regulatory (EMI), marketing, and manufacturing phases.
Developed partnerships with organizations and vendors to ensure optimized delivery
Created mechanical packaging concepts for HP/Apollo Series 710, 720, 750, and
J100/9000 (Navy) workstation product lines
Anticipated future cooling needs and developed long-term cooling strategies for
Standardized thermal/acoustic test verification procedure
Streamlined application for Pacific Numerix's “PCB EXPLORER” thermal analyzer
(MCAD) and Flomerics flow analysis software (CFD) tools.
Project Manager/Individual Contributor
Teradyne, Inc., Boston, MA 1979-1988
Managed the development of lower cost high-speed thermal-mechanical packaging
Reviewed and made recommendations on variety of operational issues
Reduced manufacturing cost of critical mechanism by 84%.
Designed and developed a 7kw-refrigeration cooling system enabling the
development of an advanced ATE board test system.
Delivered solutions in the areas of mechanisms, materials, air conditioning and
refrigeration, and pressure/vacuum systems
Developed cooling concepts, performed feasibility studies, supervised the design,
fabrication, and evaluation of ATE VSLI in circuit and functional board test systems.
Provided thermal design support to PCB designers. Air cooling of PCB dissipating
400w was successfully managed at low velocities.
Conceived and evaluated a highly effective, low profile, low velocity CPGA heat
exchanger and CPGA/heat exchanger interface, in conjunction with AMD packaging
Martin J. Pitasi firstname.lastname@example.org Page 3 of 5
Designed and built the Teradyne heat transfer laboratory that included
instrumentation, data reduction hardware and software, and test automation
Senior Mechanical Engineer
American Science and Engineering, Cambridge, MA 1974-1979
Designed, developed, implemented, and evaluated passive and active thermal
control systems required by High Energy Astronomy Observatory satellite systems
(HEAO Missions 1 and 2).
Responsible for correlating test and analytical data needed to establish accurate
multi-mode computer models that represented the final flight hardware
Developed, generated, and verified design, fabrication and installation specifications
to ensure desired end-item thermal performance.
Supervised the thermal vacuum testing of payloads, including the development of
test procedures and instrumentation techniques.
Coordinated thermal data with customers and subcontractors to ensure meaningful
data flow between all contractual interfaces.
Monitored post-launch thermal performance and developed rationale to determine
basis for any observed thermal anomalies.
Designed, developed, and evaluated thermal mechanical sub-systems, such as low
heat transfer hinges, aspect sensor light shades, distortion free support brackets,
and material interfaces.
Designed, developed and evaluated state-of-the –art flat plate solar collectors, line
collectors, and point collectors.
Raytheon Missile Systems Division, Bedford, MA 1966-1974
Designed, implemented, and evaluated advanced airborne phased array radar
system. Duties included conduction and convection cooling of electronics packages
at the component and system levels. Performed FEA thermal evaluation using
radiation, convection, and conduction heat transfer for transient and steady state
Acted as field support and trouble shooter of various missile and ground support
radar cooling systems.
Developed, fabricated and evaluated test systems for simulating thermal nuclear
pulses, and evaluating advanced airborne phase array radar antenna hardware
Managed thermal test laboratory and performed tests to confirm design studies.
Supervised scheduling, manpower loading, scheduling, and cost estimations for
contracts and proposal efforts.
Bachelor of Science, Mechanical Engineering, Northeastern University, Boston, MA
Leadership in a Systems Organization, Hewlett Packard, Chelmsford .MA
Management Time, Packard, Chelmsford .MA
Project Management Fundamentals, Hewlett Packard, Chelmsford .MA
Decker Presentation Skills, Decker Communications Inc, Chelmsford .MA
Constructive Contention, The Bay Group, Chelmsford.
Introduction to Finite Element Analysis (ANSYS), ASME, Newbury, MA
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PROFESSIONAL AFFILIATIONS PUBLICATIONS
AMERICAN SOCIETY OF MECHANICAL ENGINEERING
Thermal Design and Performance of Two-Phase Meso-Scale Heat Exchanger,
Proceedings of the Heat Transfer Conference, Paper HT2005-727431
Pumped Liquid Multi Phase Cooling, Proceedings of the IMECE Conference, Paper
DEFENSE ADVANCED RESEARCH PROJECTS AGENCY
Ballistic Missile Innovative Radar and RF Products, Phase1 SBIR topic No MDA03-
A System Thermal Design Procedure, Proceedings of the Electronics Packaging and
Testing for ASIC Thermal Characteristics, Proceedings of the Design Technology
MASSACHUSETTS INSTITUTE OF TECHNOLOGY
Optimization of a PIN Fin Array Compact Heat Exchanger, Master of Science thesis advisor
PHOTO-OPTICAL INSTRUMENTATION ENGINEERS
A Flat Plate Multiple Pass Solar Collector Using Aqueous Optical Properties, vol. 161
A Parabolic Solar Reflector for Accurate and Economical Productivity, vol. 161
AMERICAN SOCIETY OF NONDESTRUCTIVE TESTING
Infrared and Thermal Evaluation of a Phased Array Antenna, Vol. XXIX, No. 9
5,293,930 - Pumped Liquid Cooling System Using a Phase Change Refrigerant
6,519,955 - Pumped Liquid Cooling System Using a Phase Change Refrigerant
6,508,301 - Cold Plate Utilizing Fin with Evaporative Refrigerant
5,293,930 - High Efficiency ASIC Surface-to-Air Heat Exchanger
4,482,269 - Ceramic/Metallic Air-to-Surface Pin Fin Heat Exchanger
Martin J. Pitasi firstname.lastname@example.org Page 5 of 5
Barbara Hazard, Regional Sales Manager, Flomerics (business partner) was with another
company when working with you
“Martin Pitasi has a vast experience base designing electronics cooling solutions for a wide
variety of applications.” December 29, 2008
Joe Wrinn, VP, Teradyne (colleague) managed you
“I have know Martin Pitasi for over 25 years. In that time, Marty has worked on the most complex
thermal problems I had. Our most recent project together involved working on a large, 125 KW
system that required precise, distributed thermal control. This system was also going to be
deployed in large numbers at our customer's facility. Marty was invaluable in getting our system
done to spec and on time. He has great knowledge in the thermal area as well as excellent
connections in the local fabrication infrastructure. In addition, Marty worked with our customer on
sizing their factory cooling infrastructure for accepting the large number of high power systems
they ordered. It is rare you find someone with the experience in thermal design and the work ethic
that Marty has. If we face similar problems in the future, I will be back on the phone to Marty.”
January 14, 2009
From: Villaume Associates LLC [email@example.com]
Sent: Tuesday, April 21, 2009 3:57 PM
To: Marty Pitasi
Subject: REFERENCE MATERIAL FOR MARTIN PITASI
We have dealt with Martin Pitasi professionally for more than fifteen years in a number of different
roles or capacities. He has proven himself to be not only very competent and innovative as a
mechanical engineer but an exceptional „good hands‟ person. This is a less and less common
trait for members of the engineering profession. In the final analysis our designs have to work well
and reliably for exceptionally long periods of time. As beautiful as computerized simulations can
be they are not working products. „Hands-on‟ analytical skills are the final check and Mr. Pitasi‟s
skills in this area are, in my experience, without peer. His in-depth skills and vast experience
allow him to get to the heart of a problem quickly and offer a solution that is very practical and in
almost every case the most cost effective.
Mr. Pitasi‟s professional skills in the mechanical engineering field are very broad clearly
demonstrating broad knowledge beyond the fixed boundaries of a mechanical engineer. He has
maintained his professional inquisitiveness into most of the related topics that would be
peripherally interesting to a practicing mechanical engineer such as materials and the
metallurgical problems that fringe on our projects.
Mr. Pitasi is a very challenging, interesting and accomplished-engineering associate.
Henry F. Villaume
Peter A. Villaume
Villaume Associates, LLC
Intervale NH 03845