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Osnovna test oprema za elektronicara
Osnovna test oprema za elektronicara
Osnovna test oprema za elektronicara
Osnovna test oprema za elektronicara
Osnovna test oprema za elektronicara
Osnovna test oprema za elektronicara
Osnovna test oprema za elektronicara
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Osnovna test oprema za elektronicara

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  • 1. GENERAL-PURPOSE ELECTRONIC Introduction TEST EQUIPMENT Early electronic systems could be completely checked-out with general-purpose electronic test equipment (GPETE), mr Marinko Aleksić dipl.inž. such as multimeters, oscilloscopes, and signal generators. Using this equipment to individually test the microelectronics components in one of today's very complex electronic systems would be extremely difficult if not impossible. When no automatic means of accomplishing fault isolation is available, general-purpose electronic test equipment and good troubleshooting procedures is used; however, such fault diagnosis should be attempted only by experienced technicians. Misuse of electrical probes and test equipment may permanently damage boards or microelectronic devices attached to them. The proximity of leads to one another and the effects of interconnecting the wiring make the testing of boards extremely difficult; these factors also make drift or current leakage measurements 5/2/2003 1 practically impossible. 5/2/2003 2 Boards that have been conformally coated are Special care should be exercised when probing difficult to probe because the coating is often integrated circuits; they are easily damaged by too thick to penetrate for a good electrical excessive voltages or currents, and component contact. These boards must be removed for leads may be physically damaged. Precautions electrical probe testing. Many boards, however, concerning the use of test equipment for are designed with test points that can be troubleshooting equipments containing monitored either with special test sets or integrated circuits are similar to those that general-purpose test equipment. Another should be observed when troubleshooting method of obtaining access to a greater equipment containing semiconductor or other number of test points is to use extender cards voltage and current-sensitive devices. or cables. The use of extender cards or cables makes these test points easier to check. 5/2/2003 3 5/2/2003 4 Voltage and resistance tests of resistors, transistors, inductors, and so forth, are usually effective in locating REPAIR STATIONS complete failures or defects that exhibit large changes In addition to the requirements for special skills, from normal circuit characteristics; however, these the repair of electronic circuits also requires methods are time-consuming and sometimes special tools. Because these tools are delicate unsuccessful. The suspect device often must be desoldered, removed from the circuit, and then retested and expensive, they are distributed only to to verify the fault. If the defect is not verified, the device trained and certified repair technicians. Repair must be resoldered to the board again. If this procedure stations are equipped with electrical and has to be repeated several times, or if the board is mechanical units, tools, and general repair conformally coated, the defect may never be located. In materials. Such equipments are needed to fact, the circuit may be further damaged by the attempt make reliable repairs to miniature and to locate the fault. For these reasons, the device should never be desoldered until all possible in-circuit tests microminiature component circuit boards. are performed and the defect verified. 5/2/2003 5 5/2/2003 6
  • 2. REPAIR STATION REPAIR STATION POWER UNIT POWER UNIT The repair station power unit is a standardized system that provides controlled soldering and desoldering of all types of solder joint configurations. The basic unit houses the power supply, power level indicator, motor control switch, hand tool temperature controls, air pressure and vacuum controls with quick connect fittings, positive ground terminal, the mechanical power- drive for the rotary-drive machine, and a vacuum/pressure pump. A two-position foot pedal, to the left of the power unit, allows hand-free operation for all ancillary (additional) handpieces. The first detent on the pedal provides power to the voltage heating outputs. The second detent activates the motor drive or vacuum/pressure pump. 5/2/2003 7 5/2/2003 8 Low voltage Handpiece Motorized solder extrator This handpiece allows airflow application (at controlled temperatures) of a vacuum or pressure to the selected area. 5/2/2003 9 5/2/2003 10 Soldering iron Soldering and desoldering equipment 5/2/2003 11 5/2/2003 12
  • 3. ROTARY-DRIVE Rotary-drive MACHINE machine accessories 5/2/2003 13 5/2/2003 14 ELECTRIC CIRCUIT CARD HOLDER SCREWDRIVERS 5/2/2003 15 5/2/2003 16 SAFETY STEREOSCOPIC-ZOOM EQUIPMENT MICROSCOPE 5/2/2003 17 5/2/2003 18
  • 4. BASE BOARD REPAIR KIT Circuit Repair Specially designed tools crafted from surgical Repairing damaged base board quality chrome steel with tips hardened to Repairing damaged base board withstand the rigors of demanding detail work. corners and edges Tufted foam grips reduce operator fatigue. Repairing damaged tooling and mounting holes Repairing damaged coatings and solder mask 5/2/2003 19 5/2/2003 20 CASE WITH TOOLS CASE WITH TOOLS 5/2/2003 21 5/2/2003 22 Multimeter Magnetizer / Demagnetizer This automotive multimeter has all the features necessary to troubleshoot an entire automotive electrical system. Comes with an operators manual, test leads with test and alligator clips, holster style case and 5/2/2003 23 temperature probe. 5/2/2003 24
  • 5. Dual Trace Oscilloscope REPAIR STATION FACILITIES To be effective, electronic component repair must be performed under proper environmental conditions. Repair facility requirements, whether afloat or ashore, include adequate lighting, ventilation, noise considerations, work surface area, ESD (electrostatic discharge) protection, and adequate power availability. 5/2/2003 25 5/2/2003 26 LIGHTING VENTILATION Fumes from burning flux, coating materials, The recommended lighting for a work grinding dust, and cleaning solvents require surface is 100 footcandles from a direct adequate ventilation. The use of toxic, flammable substances, solvents, and coating lighting source. Light-colored compounds requires a duct system that vents overheads and bulkheads and off-white gasses and vapors.This type of system must be or pastel workbench tops are used to used to prevent contamination often found in complement the lighting provided. closed ventilation systems.This need is particularly important aboard ship. Vented hoods, ducts, or installations that are vented outside generally meet the minimum standards 5/2/2003 27 5/2/2003 28 NOISE CONSIDERATIONS WORK SURFACE AREA Work stations should have a minimum work Noise in the work area during normal work periods surface of at least 60-inches wide and 30-inches must be no greater than the acceptable level deep. Standard shipboard workbenches are approved for each activity involved. Because the acceptable; however, off-white or pastel-colored work is tedious and tiring, noise levels should heat-resistant tops should be installed on the be as low as possible. Ear protectors are workbenches. Chairs should be the type with required to be worn when a noise level exceeds backs and without arms. They should be 85 dB. Ear protectors should also be worn comfortably padded and of the proper height to anytime the technician feels distracted by, or match the work surface height. Drawers or other uncomfortable with, the noise level. suitable tool storage areas are usually provided. 5/2/2003 29 5/2/2003 30
  • 6. HIGH-RELIABILITY SOLDERING SOLDERING The most common types of miniature and The solder most commonly used in electronic microminiature repair involve the removal and assemblies is an alloy of tin and lead. Tin-lead replacement of circuit components. The key to alloys are identified by their percentage in the these repairs is a firm knowledge of solder solder; the tin content is given first. Solder and high-reliability soldering techniques. Solder is a metal alloy used to join two or marked 60/40 is an alloy of 60 percent tin and more metals with a metallic bond. The 40 percent lead. The two most common alloys bonding occurs when molten solder dissolves used in electronics are 60/40 and 63/37. a small amount of the metals and then cools to form a solid connection. 5/2/2003 31 5/2/2003 32 SOLDERING SOLDERING The melting temperature of tin-lead solder varies As the percentages of tin and lead are varied, the melting depending on the percentage of each metal. temperature increases. Alloy of 60/40 melts at 187 °C, and alloy of 70/30 melts at approximately 193 °C. Alloys, Lead melts at a temperature of 327 °C, and tin other than eutectic, go through a plastic or semiliquid melts at 232 °C. Combinations of the two metals state in their heating and cooling stages. Solder joints melt into a liquid at different temperatures. The that are disturbed (moved) during the plastic state will 63/37 combination melts into a liquid at 183 °C. result in damaged connections. For this reason, 63/37 At this temperature, the alloy changes from a solder is the best alloy for electronic work. Solder with 60/40 alloy is also acceptable, but it goes into a plastic solid directly to a liquid with no plastic or state between 183 °C and 187 °C. When soldering joints semiliquid state. An alloy with such a sharp with 60/40 alloy, you must exercise extreme care to changing point is called a EUTECTIC ALLOY. prevent movement of the component during cooling. 5/2/2003 33 5/2/2003 34 USE OF FLUX IN SOLDER BONDING Three groups Soldering fluxes Reliable solder connections can only be accomplished with clean surfaces. Using solvents and abrasives to CHLORIDE FLUX (commonly called clean the surfaces to be soldered is essential if you are to achieve good solder connections.In almost all cases, ACID), however, this cleaning process is insufficient because oxides form rapidly on heated metal surfaces. The rapid ORGANIC FLUX, formation of oxides creates a nonmetallic film that ROSIN FLUX prevents solder from contacting the metal. Good metal- to-metal contact must be obtained before good soldering joints may take place. Flux removes these surface oxides from metals to be soldered and keeps them removed during the soldering operation. Flux chemically breaks down surface oxides and causes the oxide film to loosen and break free from the metals being soldered. 5/2/2003 35 5/2/2003 36
  • 7. CHLORIDE FLUX ORGANIC FLUX Chloride fluxes are the most active of the three Organic fluxes are nearly as active as groups. They are effective on all common chloride fluxes, yet are less corrosive metals except aluminum and magnesium. and easier to remove than chloride Chloride fluxes, however, are NOT suitable for electronic soldering because they are highly fluxes. Also, these fluxes are NOT corrosive, electrically conductive, and are satisfactory for electronic soldering difficult to remove from the soldered joint. because they must be removed completely to prevent corrosion. 5/2/2003 37 5/2/2003 38 ROSIN FLUX Wire solder with cores of rosin flux Rosin fluxes ARE ideally suited to electronic soldering Most electronic solder, in wire form, is made with because of their molecular structure. The most one or more cores of rosin flux. When the joint common flux used in electronic soldering is a solution or connection is heated and the wire solder is of pure rosin dissolved in suitable solvent. This applied to the joint (not the iron), the flux flows solution works well with the tin- or solder-dipped onto the surface of the joint and removes the metals commonly used for wires, lugs, and oxide. This process aids the wetting action of connectors. While inert at normal temperatures, rosin the solder. With enough heat the solder flows fluxes break down and become highly active at and replaces the flux. Insufficient heat results soldering temperatures. In addition, rosin is in a poor connection because the solder does nonconductive. not replace the flux. 5/2/2003 39 5/2/2003 40 KRAJ 5/2/2003 41

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