Toe Fillet Requirements on Gull Wing Components

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Toe Fillet Requirements on Gull Wing Components

Toe Fillet Requirements on Gull Wing Components

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  • 1. Chapter:Isatoefilletrequiredongullwingcomponents? 1 Toe Fillet Requirements on Gull Wing Components Is a toe fillet required on gull wing components? If it is not a requirement why is that so? We have some gull wing components that have no toe fillet, but all the other requirements for the solder connection are met. A.C. Experts Comments Per IPC-610, section 8.3.5 Flat Gull Wing Leads and section 8.3.6 Round or Flattened (coined) Gull Wing Leads, there is no requirement for toe fillets. The only requirement is that if the lead overhangs the pad or land area it does not violate the minimum electrical spacing requirements of the product. The reasoning for not having a requirement for toe solder fillets is that the method of manufacturing for the gull wing lead frames creates a condition on the end of the lead which may or may not be solderable. Therefore we did not create a criteria for a solder fillet at the end of the leads, if it happens it is ok and if it does not happen that is still acceptable. The strength of the solder joint for gull wing components is in the heel fillet of the component and the length of the component lead, so the solder joint at the toe of the component does not add anything to the strength and reliability of the solder joint. If all the other requirements are met except the toe fillet is missing as mentioned the condition is acceptable. I hope this answers your question. Leo Lambert Vice President, Technical Director EPTAC Corporation At EPTAC Corporation, Mr. Lambert oversees content of course offerings, IPC Certification programs and provides customers with expert consultation in electronics manufacturing, including RoHS/WEEE and lead free issues. Leo is also the IPC General Chairman for the Assembly/Joining Process Committee.
  • 2. Chapter:ExpertsComments 2 Per J-STD-001, there is no requirement:  There is no reference to a minimum toe fillet height (Class 1, 2, and 3)  Toe overhang is permitted where it does not violate electrical clearances (Class 1, 2 and 3), in which case by definition there is no toe fillet. While this may seem odd, we need to realize that the toe of a gull-wing lead is under little or no mechanical stress, because the component is attached at the heel end. In practice, nearly all failures of gull-wing joints begin at the heel and propagate toward the toe. In addition, the fact that most gull-wing leads are formed and cut after plating leaves the toe relatively unprotected from oxidation, and so getting a toe fillet may be difficult. Fritz Byle Process Engineer Astronautics Fritz's career in electronics manufacturing has included diverse engineering roles including PWB fabrication, thick film print & fire, SMT and wave/selective solder process engineering, and electronics materials development and marketing. Fritz's educational background is in mechanical engineering with an emphasis on materials science. Design of Experiments (DoE) techniques have been an area of independent study. Fritz has published over a dozen papers at various industry conferences. The NASA requirement is the width of the end solder joint (toe) must be greater than 75% of the lead width. Edward Zamborsky Regional Sales Manager OK International Inc. Mr. Zamborsky serves as one of OK's technology advisers to the Product Development group. Ed has authored articles and papers on topics such as; Low Volume SMT Assembly, Solder Fume Extraction, SMT Rework, BGA Rework, Lead Free Hand Soldering, Lead Free Visual Inspection and Lead Free Array Rework. There is a requirement to have the pad extend past the toe of the lead... however, the solder presence cannot be left to a toe fillet only. The design of the pads, coupled with the dynamics of the reflow will pull the solder from heel to toe and vice/versa. For this reason, the toe fill maximum requirement is often noted, but the minimum, due to control is not defined as a defect. Rodney Miller Capital Equipment Operations Manager Specialty Coating Systems Rodney is currently Operations manager at SCS coatings, Global Leader in Parylene and Liquid Coating equipment. Rodney applies his BS in Computer Integrated Manufacturing from Purdue University, along with 20+ years of Electronic manufacturing and Equipment Assembly, to direct the Equipment business at SCS Coatings. "We provide unique, value added coating equipment solutions for our customers". Including conformal, spin and Parylene coating expertise.
  • 3. Chapter:ExpertsComments 3 Structurally the most significant elements of a gull-wing solder joint are the solder between the pad and the bottom of the gull wing lead and the solder at the heel of the lead (heel fillet). Toe fillet can't be counted on nor does it add any appreciable strength. Many gull-wing devices are sheared from their lead-frames after lead-frame plating. This results in exposed basis material at the point of plating buss shearing. So if the basis is unsolderable or tough to solder, as most are, it may not wet during the soldering process. A good example of this would be a copper alloy lead-frame. Copper (sans OSP-coating) is notably difficult to flux with typical No-Clean flux formulations. Plating is added to such lead-frames to allow reasonable solderability during SMT processing. Alloy 42 (Kovar) is another lead-frame alloy this is not solderable without the addition of a plating. Therefore, there can be no expectation for toe fillet formation during soldering. Bottom Termination components (BTCs) are another class of component with sheared lead and no reasonable prospect for toe fillet formation. Lastly, recall that IPC 610 allows for some gull wing toe overhang beyond the PWB's solder land. Certainly on an overhanging lead one could not expect to have a toe fillet. Concentrate on getting the rest of the solder joint right, especially an in-spec (per -610) heel fillet. Gary Freedman President Colab Engineering A thirty year veteran of electronics assembly with major OEMs including Digital Equipment Corp., Compaq and Hewlett-Packard. President of Colab Engineering, LLC; a consulting agency specializing in electronics manufacturing, root-cause analysis and manufacturing improvement. Holder of six U.S. process patents. Authored several sections and chapters on circuit assembly for industry handbooks. Wrote a treatise on laser soldering for Laser Institute of America's LIA Handbook of Laser Materials Processing. Diverse background includes significant stints and contributions in electrochemistry, photovoltaics, silicon crystal growth and laser processing prior to entering the world of PCAs. Member of SMTA. Member of the Technical Journal Committee of the Surface Mount Technology Association. http://www.circuitnet.com/experts/86635.shtml