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Manufacturing Tolerances
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Manufacturing Tolerances

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Manufacturing Tolerances

Manufacturing Tolerances

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  • 1. Home / Quality / Manufacturing tolerances Manufacturing tolerances of our PCBs The production of printed circuit boards is carried out according to the valid IPC guidelines and standards and on the basis of following technical specifications. HDI or MFT boards can be produced with smaller tolerances. Differing requirements of the customer must be explicitly agreed! Pattern tolerances The hole pattern for vias (DK) goes through all the layers of the circuit and therefore serves as a location reference for the other patterns. Tolerance Drilling pattern (PTH) to conductive pattern outer layers ±0,10mm Drilling pattern (PTH) to conductive pattern inner layers ±0,15mm Drilling pattern (PTH) to milling pattern / contour ±0,10mm Drilling pattern (NPTH) to milling pattern / contour ±0,10mm Drilling pattern (PTH) to marking print ±0,15mm Conductive pattern to solder resist ±0,10mm Conductive pattern to marking print ±0,20mm Hole to hole, one pass* ±0,05mm PTH-PTH or NPTH-NPTH Hole to hole, two passes ±0,10mm PTH-NPTH * Also applies for PTH-NPTH if they are drilled in one run (e.g. location holes for SMD stencils) Vias & Drills Final-Ø Plated-through-holes (PTH) and component holes HAL surface ±0,10 chem. surface ±0,05mm Non-plated-through-holes (NPTH) ±0,05mm Cu thickness Cu thickness of throughplating Class 2 (standard) Class 3 Via (> 150µm) min. 20µm - 25µm 20µm - 25µm Microvia (≤ 150µm) min. 18µm - 20µm 20µm - 25µm Blind Via min. 10µm - 12µm 10µm - 12µm Buried Via min. 10µm - 12µm 10µm - 12µm Conductor Conductor Conductor width* min. 80% in comparsion to the data Conductor space* max. 30% (standard) reduction in comparsion to the data * acc. to IPC-6012C Impedance control see Impedance control Tolerance Impedance control 10% normal 5% extended Milling Tolerance Milling offset ±0,10mm Z-Axis milling depth ±0,20mm Scoring see scoring Tolerance Offset (to PCB center) ±0,10mm Drilling pattern (PTH) to scoring pattern ±0,15mm Drilling pattern (NPTH) to scoring pattern ±0,20mm PCB dimension x/y ±0,15mm Scoring depth ±0,20mm Base material Tolerance FR4 thickness ±10% The information about the base material thickness exclusively defines the thickness of the dielectric including base copper. The other layer structures such as electroplated Cu layers or solder resist layers result in increased final thickness. Bow & Twist Tolerance Manufacturing tolerances - Multi Circuit Boards http://www.multi-circuit-boards.eu/en/printed-circuit-quality/manufact... 1 of 2 24/07/2014 14:14
  • 2. For PCBs ≥ 0,8mm thickness 0,75% with SMD 1,50% without SMD Please note that the twist & bow value is increased above average, if the copper balance of the PCB is locally very unequal or if the circuit board is very thin. Available surfaces Surface HAL SnPB > 5µm approx. 12 months 5 HAL lead-free > 5µm approx. 12 months 5 Immersion tin > 1µm approx. 6 months 2 Immersion silver 0,2 - 0,3µm approx. 12 months 5 Immersion gold (ENIG) 3-6µm Ni 0,025-0,1µm Au approx. 12 months 5 ENEPIG (Ni/Pd/Au) 3-8µm Ni 0,05-0,15µm Pd 0,05-0,1µm Au approx. 12 months - Electroplated soft gold 4-6µm Ni > 1µm Au approx. 12 months - Electroplated hard gold 4-6µm Ni 0,1µm Au - 2µm Au* approx. 12 months < * on request - Values for shelf life and reflow cycles are guidelines from the process supplier! Solder-stop Thickness On the PCB > 10µm < 25µm On the conductor edge > 5µm < 25µm Dielectric strength min. 500VDC Delivery quantity Tolerance Excess or short deliveries of up to 10% Manufacturing tolerances - Multi Circuit Boards http://www.multi-circuit-boards.eu/en/printed-circuit-quality/manufact... 2 of 2 24/07/2014 14:14

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