RnRMarketResearch.com Offers “Flexible Applications Based on Printed ElectronicsTechnologies 2013 Report” Report US$7990 S...
as semiconductors move to the very small with 22nm critical dimension, printed electronics moves to theother end of the sp...
Helianthos, Nuvosun, NVC, NXP, Odersun, Optomec, Optony, Ormecon, Ormet, Osram, Panasonic,PEMCO, Pioneer, PixDro, Philips,...
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Flexible Printed Electronics Technologies Applications Market 2013

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Today flexible & printed electronics create a lot of hope. And a supply chain is being created to support an industrial infrastructure. In our report, we have identified and tracked the five main functionalities of flexible & printed electronics: displaying, sensing, lighting, energy generating and substrates.

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Transcript of "Flexible Printed Electronics Technologies Applications Market 2013"

  1. 1. RnRMarketResearch.com Offers “Flexible Applications Based on Printed ElectronicsTechnologies 2013 Report” Report US$7990 Single User License. The report gotpublished in May 2013 & Contain 200 Pages.Combined flexible & printed electronic applications could reach US$1B in 2020. Multipleapplications are driving growth!Technical Challenges Are Close To Being Overcome To Reach US $1B Market By 2020Today flexible & printed electronics create a lot of hope. And a supply chain is being created to supportan industrial infrastructure. In our report, we have identified and tracked the five main functionalities offlexible & printed electronics: displaying, sensing, lighting, energy generating and substrates. Thedifferent degrees of freedom in flexibility that can be obtained can be divided into:- Conformable substrate: the flexible substrate will be shaped in a definitive way after processing- “Bendable” substrate: they can be rolled and bent many times (even if we consider it will not be a keyfeature coming from customer needs)- “Unused” flexibility: in the end, the flexibility is not an added value to the customerWe believe some applications will be more likely than other to be successful – for example, bendableapplications will undergo tough stress during use and technological challenges will be hard to overcome.Our report shows the distinction between the functions (displaying lighting, energy conversion, sensing &substrates) and the seek flexibility “degree of freedom”. We do not make the distinction in our reportbetween organic and inorganic substrates as semiconductors can also be used as flexible substrates.Complete Report Copy @ http://www.rnrmarketresearch.com/flexible-applications-based-on-printed-electronics-technologies-2013-report-market-report.htmlKey Features Of The Report- Flexible and printed electronics market forecast 2013 – 2020- Application roadmaps & timelines- Detailed manufacturing process flows- Technical challenges- Analyzed applications: displays, lighting, photovoltaics, sensing,substrates- Polytronics & smart systemsHowever, we believe over the next several years, the number of applications using printing processes forflexible electronics will grow.We estimate the printed & flexible electronics market will grow from ~ $176M in 2013 to ~ $950M in 2020with a 27% CAGR in market value. Printed OLED displays for large size (TVs) are likely to become thelargest market. For OLED lighting, we believe it will grow but remain a niche market for automotive and/or office lighting. For PV, the market demand by 2020 will remain very low compared to the demand forrigid PV, largely below 1% of the global market demand by 2020. Sensor, smart system & polytronicapplications will include sensors, touchless / touch screens, RFID applications.A Wide, Exiciting Range Of New ApplicationPrinted & flexible electronics is a new exiting technology with large potential market expectations. Indeed,
  2. 2. as semiconductors move to the very small with 22nm critical dimension, printed electronics moves to theother end of the spectrum with its own material, equipment, process challenges and supply chain. Printedelectronics will not kill semiconductor electronics as it will not be a replacement for CMOS silicon.However, it will create new industry segments and new classes of applications with unique features,benefits and costs that cannot be addressed with conventional semiconductor electronics.For example, we believe printing technologies will also allow additional properties such as flexibility.Originally, the general vision for printed electronics was the possibility to print low cost electroniccomponents on any substrate. It was supposed to allow low cost, low efficiency, large volume electronicsmanufacturing, and it was supposed to create a large multiplicity of applications. Flexible electronicsappeared quite soon after envisaging printability. Such devices were supposed to allow new applicationsdirectly linked to flexibility.Request a Sample Copy @ http://www.rnrmarketresearch.com/contacts/request-sample?rname=103431Moreover, the coming of polytronic technologies is a disruptive approach that could change the wayprinted & flexible electronic devices will be manufactured. It can be considered a new alternative to the“More Moore” approach where Si ICs, thin films, micro batteries, displays etc … will be embedded in aflexible substrate. The global interest in polytronics is born from the difficulties faced by the flexible &printed electronics industry. It is an alternate way to come to similar results while trying to avoid some ofthe main challenges.Manufacturing: Key Processing Choices Are Still To Be MadeWe have identified strong technical challenges for the printed & fl exible electronics industry to overcomeif it is to be successful. Today it is still more technopush rather than market-pull. Printed and fl exibleelectronics are still looking for high throughput, high resolution deposition techniques in order to becomesuitable for other markets than just a few niche highend applications. For example, a big bottleneck is anefficient barrier technology. Indeed, to be successful, the main technical challenge in the short term lies infinding a good barrier technology: encapsulation materials are not so good on flexible substrates. Solutionprinting process fl ow is composed of three main steps: ink/coating creation, deposition and curing. I nk chemistry i s a pplication d ependent, and various precursors can be used for the same application. Thenature of the ink / coating will define what kind of process can or cannot be used. For example, only inkscontaining very thin particles can be used for inkjet printing (typically < 100nm particle for 1μm diameternozzles). In the same way, deposition methods induce specific requirements in terms of viscosity.Deposition techniques vary, but most of them are not yet adapted to large volume, low cost printedelectronics. Thermal processing is required in order to crystallize the ink. Curing temperature and time arecritical factors for printed electronics manufacturing as organic materials are very sensitive to hightemperatures.Companies Cited In The Report3M, Add-Vision, AGC, AGFA, Air Products, Aixtron, Altadevices, Applied materials, Arjowiggins, Arkema,Armor, Astron Flamm, Asys Solar, BASF, Beneq, Bosch, Boschmann, Cabot, Cambrios, Canatu, Canon,Catrene, CEA LITEN, Central Standard Timing, Ceradrop, Ceres, Chimet, CIT, CNM, Creative Materials,DEK, DisaSolar, DNP, DOW, Dupont, Dupont Teijin, Dyesol, Dynamic Organic Light, Eight 19, E-ink,Elecon, EMPA, EnFuCell, enthone, Epson, EVG, evonik, Flisom, Fraunhofer, Fuji Film, G24i, GE,GEM,Global Solar, Global Solar Energy Deutschland GmbH (GSED), Haiku Tech, HC Starck, Heliatek,HelioVolt, Heraeus, HMI, Honeywell, IMEC, Inca Digital Printers, Infineon, Infinite Power solutions, Inkoa,InkTec, ISET, ISORG, JRT, Konarka, Konica Minolta, Kovio, KUL, KWJ Engineering, LG, Liquavista,LPKF, manroland, Markandy, MEMC, Merck, MiaSolé, Micro-tec, Mitsubishi Chemical, Monocrystal,moserbaer, Nano ePrint, Nanoink, Nanomas, Nanosolar, NextInput, Novacentrix, NTC, Ntera, Nuon
  3. 3. Helianthos, Nuvosun, NVC, NXP, Odersun, Optomec, Optony, Ormecon, Ormet, Osram, Panasonic,PEMCO, Pioneer, PixDro, Philips, Plastic Logic, Plextronics, Polymer Vision, Prelonic Technologies,Prime View International, Rena, Rolith, SAES, Sakurai, Samsung, Schreiner, Showa Denko, Skiff,Solarion, Solaronix, Sony, SouthWest Nanotechnologies, Sumitomo Chemical, Tianma, TNO, Toppan,TU Delft, Unidym, UniSolar, Veeco, Verhaert, Vitex, Von Ardenne, Vorbeck Materials, VTT, WageningenUniversity, YotaphoneExplore More Reports @ http://www.rnrmarketresearch.com/reports/information-technology-telecommunication/electronics/electronics-componentsFor more details contact Mr. Priyank Tiwari: sales@rnrmarketresearch.com / +18883915441Website: http://www.rnrmarketresearch.com

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