LCE13: Thermal Management BOF

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Resource: LCE13
Name: Thermal Management BOF
Date: 09-07-2013
Speaker: Sanjay Singh Rawat (Linaro/LG Electronics and Amit Kucheria (Linaro
Video: http://youtu.be/PLOgFY37PsQ

Published in: Technology
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LCE13: Thermal Management BOF

  1. 1. Sanjay Singh Rawat (Linaro/LG Electronics) Amit Kucheria (Linaro) Thermal Management BoF
  2. 2. Content  General Thermal Framework (Intel)  Governors (Intel)  Possible solutions
  3. 3.  Sensor & Thermal Zone sensor-1 Thermal core sensor-2 Thermal zone
  4. 4.  Cooling devices: - SW (cpufreq_cooling) - HW (fan, sink)
  5. 5. - Sensors <=> Thermal Zones - registration - trips levels - operations - bind - temp/trend - trip temp/type - cooling device: - state get/set
  6. 6.  Instance Thermal Instance Thermal zone Trip point Cooling device Cooling State levels
  7. 7.  Trip types: - Active/Passive Handling → governors - Critical/Hot Handling → shutdown/notify
  8. 8.  Flow: irq tzone-update get-temp handle-trip Throttle/shutdown
  9. 9. tz 1 tz 2 tz n t1-tz1 t2-tz1 t1-tz2 t1-tzn cpufreq_cool cdev-n tz- thermal zone t- trip point cdev- cooling device Governor Trip Type Shutdown/Notify instance FAN thermal-core cooling_device
  10. 10.  Governors: (intel) Step wise Fair share user space
  11. 11. Step Wise  Trend for zone THERMAL_TREND_STABLE THERMAL_TREND_RAISING THERMAL_TREND_DROPPING THERMAL_TREND_RAISE_FULL THERMAL_TREND_DROP_FULL  throttle / temperature  Target cooling state, range set during registering.  Update to cooling device
  12. 12. Fair Share  Multiple cooling devices. Weight/Effectiveness of Cooling device(w)  Max states (m)  Trip Level (l)  Target state = (w * l * m) / (100 * total_trip_no)  Update to cooling device state User space  user side management provision
  13. 13.  Cpufreq Cooling (by Amit D Kachhap)  Scaling frequency to achieve the target set by the Governor Contribution by Linaro:
  14. 14. Future Solutions/Issues:  Coordination with scheduler to limit load on cpu with high temperature/idle injection?  Limitation of maximum 12 trip points for thermal zone.  GPU cooling?  Shared cooling device conflict?  More generic cooling devices
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