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LCE13: Thermal Management BOF
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LCE13: Thermal Management BOF

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Resource: LCE13

Resource: LCE13
Name: Thermal Management BOF
Date: 09-07-2013
Speaker: Sanjay Singh Rawat (Linaro/LG Electronics and Amit Kucheria (Linaro
Video: http://youtu.be/PLOgFY37PsQ

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    LCE13: Thermal Management BOF LCE13: Thermal Management BOF Presentation Transcript

    • Sanjay Singh Rawat (Linaro/LG Electronics) Amit Kucheria (Linaro) Thermal Management BoF
    • Content  General Thermal Framework (Intel)  Governors (Intel)  Possible solutions
    •  Sensor & Thermal Zone sensor-1 Thermal core sensor-2 Thermal zone
    •  Cooling devices: - SW (cpufreq_cooling) - HW (fan, sink)
    • - Sensors <=> Thermal Zones - registration - trips levels - operations - bind - temp/trend - trip temp/type - cooling device: - state get/set
    •  Instance Thermal Instance Thermal zone Trip point Cooling device Cooling State levels
    •  Trip types: - Active/Passive Handling → governors - Critical/Hot Handling → shutdown/notify
    •  Flow: irq tzone-update get-temp handle-trip Throttle/shutdown
    • tz 1 tz 2 tz n t1-tz1 t2-tz1 t1-tz2 t1-tzn cpufreq_cool cdev-n tz- thermal zone t- trip point cdev- cooling device Governor Trip Type Shutdown/Notify instance FAN thermal-core cooling_device
    •  Governors: (intel) Step wise Fair share user space
    • Step Wise  Trend for zone THERMAL_TREND_STABLE THERMAL_TREND_RAISING THERMAL_TREND_DROPPING THERMAL_TREND_RAISE_FULL THERMAL_TREND_DROP_FULL  throttle / temperature  Target cooling state, range set during registering.  Update to cooling device
    • Fair Share  Multiple cooling devices. Weight/Effectiveness of Cooling device(w)  Max states (m)  Trip Level (l)  Target state = (w * l * m) / (100 * total_trip_no)  Update to cooling device state User space  user side management provision
    •  Cpufreq Cooling (by Amit D Kachhap)  Scaling frequency to achieve the target set by the Governor Contribution by Linaro:
    • Future Solutions/Issues:  Coordination with scheduler to limit load on cpu with high temperature/idle injection?  Limitation of maximum 12 trip points for thermal zone.  GPU cooling?  Shared cooling device conflict?  More generic cooling devices