High Performance Printed     Circuit Boards     By Joseph Y. Lee Samsung Electro-Mechanics
Chapter - 7Soldering and Cleaning of High Performance Circuit    Board Assemblies
Introduction to Requirements Industry standardization Low cost method to bump die Cost-competitive substrates High yie...
Two basic types of low melt flip-           chip interconnections                                           63/37 Low melt...
Problems   Reliability is problem for bigger dies.   Failure modes are either    delamination of encapsulant, most    of...
Definition of a solder   A solder alloy consists of two or more    elements that can wet to a surface,    most often copp...
Phase diagram on binary solder alloys                                                  L                          e u a ep...
3 Solder InterconnectionsPin-in-hole                     Gull-wing-leaded              Ball-grid array
No-lead solder alloys   Sn-Ag-Bi   Sn-Ag-In   Sn-Ag-Bi-In   Sn0.965Ag0.035 – melts at 221°CEnvironmental concerns to e...
Flux   Flux; when it is applied to surfaces that are    to be joined by soldering; flux cleans the    surfaces and result...
Description of solder pastes   It is a homogeneous mixtures of solder    powder, flux, and a vehicle.   Must be able to ...
Solder paste printing considerations   Squeegee                     Screening equipment       Blade material           ...
Types of solder pastes   No clean chemistries – consist of either    rosin- or resin-based flux system with a    suitable...
Key factors for solder paste            performance   Equipment and setup parameters   Stencil fabrication method   Pit...
Characterize solder pastes   Solder ball testing – solder paste on ceramic    substrate   Residue – amount of clarity of...
Conductive adhesives – 2 types   Anisotropic – conductive in only one    direction   Isotropic – conducting in all 3    ...
Materials developmentPolymer metal solvent paste   Thermoplastic binder   Conductive silver particles   Solvent
Assembly processes   First-level assembly – flip-chip attach   Second-level assembly – BGA    modules       Ceramic bal...
Post assembly cleaning   Incoming hardware must be clean    and highly solderable.   Flux residue and other    contamina...
Chapter – 8   Environmentally  Conscious PrintedCircuit Board Materials    and Processes
Environmental survey   Low water usage and sewer costs have high adjusted    production-based flow rates.   Common pollu...
Problems to POT (publicly           owned treatment)   Pollutants that create fire or explosive    hazard.   That cause ...
Pollutions Limitations in USGeographical       Federal        Federal        Federal        State AQMDsArea Destination   ...
Pollution Prevention   It is defined as the prevention of the generation    of pollutants by minimizing or eliminating th...
Things to Consider   You do not need so much water.   Determine the sources of waste.   Ask employees to provide pollut...
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High Performance Printed Circuit Boards - Lecture #4

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High Performance Printed Circuit Boards - Lecture #4

  1. 1. High Performance Printed Circuit Boards By Joseph Y. Lee Samsung Electro-Mechanics
  2. 2. Chapter - 7Soldering and Cleaning of High Performance Circuit Board Assemblies
  3. 3. Introduction to Requirements Industry standardization Low cost method to bump die Cost-competitive substrates High yield assembly process
  4. 4. Two basic types of low melt flip- chip interconnections 63/37 Low melt 97/3 High meltchip chiplaminate laminate Conventional Pb-rich Eutectic Sn-Pb
  5. 5. Problems Reliability is problem for bigger dies. Failure modes are either delamination of encapsulant, most often at the die passivation interface, or chip cracking. Or combination of both delamination or chip cracking.
  6. 6. Definition of a solder A solder alloy consists of two or more elements that can wet to a surface, most often copper, and then react to form an adhesion layer, and, upon solidification of the alloy, produces an interconnection that has good mechanical properties.
  7. 7. Phase diagram on binary solder alloys L e u a ep m T eEutectictemperature, Te, Proeutectic phasethe alloy is a Te r t rhomogeneous a βliquid consisting ofA and B atoms. A XA Xe XB B Composition
  8. 8. 3 Solder InterconnectionsPin-in-hole Gull-wing-leaded Ball-grid array
  9. 9. No-lead solder alloys Sn-Ag-Bi Sn-Ag-In Sn-Ag-Bi-In Sn0.965Ag0.035 – melts at 221°CEnvironmental concerns to eliminate Pb.Cost too high though.No government pressure.Pb use is not high compared to industrial paint and batteries
  10. 10. Flux Flux; when it is applied to surfaces that are to be joined by soldering; flux cleans the surfaces and results in a better bond Helps transfer heat. Prevents oxidation. Oxidation prevents any flow of molten solder and prevents wetting.
  11. 11. Description of solder pastes It is a homogeneous mixtures of solder powder, flux, and a vehicle. Must be able to withstand prolonged open exposure to temperature and humidity without undergoing changes that degrade its performance. Must be able to withstand long delays or pauses in the process and resume printing with the print quality being equal to that before the pause.
  12. 12. Solder paste printing considerations Squeegee  Screening equipment  Blade material  Stencil screen size  Blade hardness  pattern  Blade configuration  Solder paste  Squeegee speed  Paste rheology  Metal content  Down stop pressure  Alloy composition  Substrate  Paste stability  Material type  Paste tackiness  Flatness  Compatibility with  Size screen squeegee
  13. 13. Types of solder pastes No clean chemistries – consist of either rosin- or resin-based flux system with a suitable vehicle system. Water soluble fluxes – contain organic or inorganic acids in the flux.
  14. 14. Key factors for solder paste performance Equipment and setup parameters Stencil fabrication method Pitch of components Lead density of components Operator skills Component and card solderability Temperature and humidity
  15. 15. Characterize solder pastes Solder ball testing – solder paste on ceramic substrate Residue – amount of clarity of the remaining flux after reflow Solder paste wetting – hot air soldered leaded (HASL) surface is more difficult to differentiate Slump – ability of paste to stay well defined after screening Tack – certain amount of adhesive strength to hold the component in place prior to reflow operation Worklife – how long the paste can remain on the stencil before it can no longer print adequately
  16. 16. Conductive adhesives – 2 types Anisotropic – conductive in only one direction Isotropic – conducting in all 3 directions  Materials development of the conductive adhesives  Assembly process development  Development of equipment set to form reliable flip-chip attach interconnections.
  17. 17. Materials developmentPolymer metal solvent paste Thermoplastic binder Conductive silver particles Solvent
  18. 18. Assembly processes First-level assembly – flip-chip attach Second-level assembly – BGA modules  Ceramic ball-grid array  Ceramic column-grid array  Plastic ball-grid array  Tape ball-grid array
  19. 19. Post assembly cleaning Incoming hardware must be clean and highly solderable. Flux residue and other contaminations must be removed. Post assembly cleaning is required. Post assembly cleaning eliminates a lot of unknowns in the soldering process.
  20. 20. Chapter – 8 Environmentally Conscious PrintedCircuit Board Materials and Processes
  21. 21. Environmental survey Low water usage and sewer costs have high adjusted production-based flow rates. Common pollutants: Cu, Pb, Ni, Ag and total toxic organics (TTO). Two basic wastewater treatment configurations: conventional metals precipitation and ion exchange systems. ½ of survey have a formal pollution prevention. Water is wasted by unnecessary flow rates in their rinse tanks. ¾ of survey implemented recycling, recovery, and bath maintenance. Off-site recycling is commonly used.
  22. 22. Problems to POT (publicly owned treatment) Pollutants that create fire or explosive hazard. That cause corrosive structure damage. That will obstruct the flow in the POTW. Biological oxygen demand, released at a flow rate or concentration. Materials hot enough to cause POTW to exceed 104°F.
  23. 23. Pollutions Limitations in USGeographical Federal Federal Federal State AQMDsArea Destination “Serious” “Severe” “Extreme” CaliforniaVOC Emissionsto be major 50 tons/year 25 tons/year 10 tons/year 1 lb/day VOC – Volatile Organic Compounds AQMD’s – Air Quality Management District
  24. 24. Pollution Prevention It is defined as the prevention of the generation of pollutants by minimizing or eliminating the steps or materials that produce them. Circuit boards require a lot of water. Reduction of water use is one goal for pollution prevention. 5lb (12kg) laptop represent about 40,000lb of materials, resources, and wastes. Few PWB manufacturers use ozone depleting substances in their products and process.
  25. 25. Things to Consider You do not need so much water. Determine the sources of waste. Ask employees to provide pollution prevention solutions. Environmental management system – requires documentation. Know costs of waste and pollution
  26. 26. 감사합니다

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