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Intel Roadmap for CPUs

Intel Roadmap for CPUs

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Intel Roadmap Intel Roadmap Presentation Transcript

  • Public Roadmap Desktop, Mobile & Server 2H’ 2009 1 2H’09 Public Roadmap
  • Public Roadmap Desktop Platform 2H’ 2009 2 2H’09 Public Roadmap
  • Desktop Processor: Roadmap Consumer Platforms 2H’09 Q3’09 Q4’09 Intel® Core™ i7 Processor Extreme Edition Codename: Tylersburg DT platform Intel® X58 Express Chipset - 2x16 or 4x8 graphics Extreme Intel® Core™ i7 Processor Codename: Tylersburg DT platform Intel® X58 Express Chipset - 2x16 or 4x8 graphics Intel® Core™2 Quad Proc. Q9xxx &Q8xxx series Codename: Boulder Creek platform Intel® G45 & P45 Express Chipsets Best Intel® Core™2 Duo Processor E8xxx & E7xxx series Codename: Boulder Creek platform Intel® G45, G43, & P43 Express Chipsets Better Intel® Pentium® & Celeron® Proc. Intel® G41 Express Chipset Intel® G31/P31 Express Chipsets Good 2H’09 Public Roadmap
  • Desktop Platform: Roadmap Business Platforms 2H’09 Q3’09 Q4’09 Intel® SIPP Deploy 2008/2009 Platform** Intel® vPro Tech. for 2009 Intel® Core™2 Quad & Duo proc. Q9000,E8000 series2 Intel® Q45 Express Chipset w/ICH10DO, Intel® TPM Business Security: Microsoft NAP, Access Monitor Proactive IT Care: Best Intel® Standard Manageability plus: Fast Call for Help, Remote Schedule Maintenance, Remote Alerts, DASH Intel® Core™2 Duo Proc. E8000 series Intel® Q43 Express Chipset w/ICH10D, Intel® TPM Intel® Standard Manageability Intel® SIPP Better Upgradeable Intel® Pentium® processor1 Intel® B43 Express Chipset w/ICH10D - Manageability Upgrade Available Intel® G41 Express Chipset Intel® G31 Express Chipset Good * Qualification window begins at platform launch and continues for 3 months. ** Deployment begins at the end of the Qualification window and continues for 12 months. 1 Intel® Pentium® dual-core proc not SIPP eligible. 2. Check the feature set reference table for vPro and SIPP CPU details. 3. Intel Std. Manageability and Intel AMT support WS-MAN and DASH 4 2H’09 Public Roadmap
  • Public Roadmap Intel® Mobile Platform 2H’09 5
  • Consumer Mobile Platforms: Roadmap 2H’09 1H’09 2H’09 ‘Montevina’ / ‘Montevina Plus’ Intel® Core™2 Extreme QX9300, X9100 Extreme ‘Montevina’ / ‘Montevina Plus’ Intel® Centrino® 2 processor technology Intel® Centrino® 2 processor technology Featuring Intel® Core™2 Quad Q9100, Q9000 Featuring Intel® Core™2 Duo T9900, P9700, P8800 Featuring Intel® Core™2 Duo T9800, T9600, T9550, T9400, P9600, P9500, P8700, P8600, P8400 Intel® Core™2 Duo Small Form Factor processors: Power-Optimized, Low Voltage, and Ultra Low-Voltage SP9400, SP9300 SP9600 SL9400, SL9300 SL9600 SU9400, SU9300, SU3300* SU9600, SU3500* Performance Mobile Intel GM45, PM45 Express chipsets with ICH9M or ICH9M-Enhanced ® Mobile Intel® GS45 Express Chipset with ICH9M-SFF-Enhanced Intel® WiMAX/WiFi Link 5050 Series Intel® WiFi Link 5000 Series Intel® 82567LF Gigabit Network Connection ‘Montevina’ / ‘Montevina Plus’ Intel® Celeron® processors T1700, T1600, 585, 575, 723 900 Mobile Intel® GM45, GL40 Express chipsets with ICH9M Entry Mobile Intel® GS45 Express Chipset with ICH9M-SFF-Enhanced Mobile Intel® GS40 Express Chipset with ICH9M-SFF-Enhanced *Intel® CoreTM 2 Solo processors are eligible for Centrino® branding only 6
  • Business Mobile Platforms: Roadmap 2H’09 1H’09 2H’09 ‘Montevina’ / ‘Montevina Plus’ Intel® Core™2 Extreme QX9300, X9100 Extreme Intel® SIPP Deploy 2008 Platforms Intel® Centrino® 2 with vProTM technology Intel® Centrino® 2 with vProTM processor Featuring Intel® Core™2 Duo T9800, T9600, T9550, technology T9400, P9600, P9500, P8700, P8600, P8400 Addition of Intel® Core™2 Duo T9900, P9700, P8800 Intel® Core™2 Duo Small Form Factor processors: Power-Optimized, Low Voltage, and Ultra Low-Voltage SP9400, SP9300 SP9600 SL9400, SL9300 SL9600 SU9400, SU9300 SU9600 Mobile Intel® GM45 and PM45 Express Chipsets with ICH9M Enhanced Best Mobile Intel® GS45 Express Chipsets with ICH9M-SFF-Enhanced Intel® WiMAX/WiFi Link 5050 Series, Intel® WiFi Link 5000 Series Intel® 82567LM Gigabit Network Connection Intel® AMT 4.X, Intel® Anti-Theft Technology (AT), Intel® Virtualization, Technology (VT-x, VT-d), Intel® Trusted Execution Technology (TXT) Intel® Centrino®2 processor technology Intel® Centrino®2 processor technology Featuring Intel® Core™2 Duo processors Addition of Intel® Core™2 Duo processors Mobile Intel® GM45 and PM45 Express Chipsets with ICH9M or ICH9M-Enhanced Mobile Intel® GS45 Express Chipsets with ICH9M-SFF-Enhanced Better Intel® WiMAX/WiFi Link 5050 Series, Intel® WiFi Link 5000 Series 7
  • Intel® Server Platform Group (SPG) Public Roadmap 2H 2009 8
  • Legal Disclaimer • INFORMATION IN THIS DOCUMENT IS PROVIDED IN CONNECTION WITH INTEL PRODUCTS. NO LICENSE, EXPRESS OR IMPLIED ,BY ESTOPPEL OR OTHERWISE, TO ANY INTELLECTUAL PROPERTY RIGHTS IS GRANTED BY THIS DOCUMENT. EXCEPT AS PROVIDED IN INTEL’S TERMS AND CONDITIONS OF SALE FOR SUCH PRODUCTS , INTEL ASSUMES NO LIABILITY WHATSOEVER, AND INTEL DISCLAIMS ANY EXPRESS OR IMPLIED WARRANTY, RELATING TO FITNESS FOR A PARTICULAR PURPOSE , MERCHANTABILITY, OR INFRINGEMENT OF ANY PATENT, COPYRIGHT OR OTHER INTELLECTUAL PROPERTY RIGHT. UNLESS OTHERWISE AGREED IN WRITING BY INTEL, THE INTEL PRODUCTS ARE NOT DESIGNED NOR INTENDED FOR ANY APPLICATION IN WHICH FAILURE OF THE INTEL PRODUCT COULD CREATE A SITUATION WHERE PERSONAL INJURY OR DEATH MAY OCCUR. • THIS INFORMATION IS PROVIDED “AS IS” WITH NO WARRANTIES WHATSOEVER, INCLUDING ANY WARRANTY OF MERCHANTABILITY, NON- INFRINGEMENT, FITNESS FOR ANY PARTICULAR PURPOSE, OR ANY WARRANTY OTHERWISE ARISING OUT OF ANY PROPOSAL, SPECIFICATION OR SAMPLE. • THE HARDWARE VENDOR REMAINS SOLELY RESPONSIBLE FOR THE DESIGN, SALE AND FUNCTIONALITY OF IT’S PRODUCT, INCLUDING ANY LIABILITY ARISING FROM PRODUCT INFRINGEMENT OR PRODUCT WARRANTY. • Intel may make changes to specifications and product descriptions at any time, without notice. • “Intel® Turbo Boost Technology requires a PC with a processor with Intel Turbo Boost Technology capability. Intel® Turbo Boost Technology performance varies depending on hardware, software and overall system configuration. Check with your PC manufacturer on whether your system delivers Intel Turbo Boost Technology. For more information, see http://www.intel.com/technology/turboboost.” • Intel® Hyper-Threading Technology requires a computer system with a processor supporting HT Technology and an HT Technology-enabled chipset, BIOS and operating system. Performance will vary depending on the specific hardware and software you use. For more information including details on which processors support HT Technology, see here • Intel Virtualization Technology requires a computer system with a processor, chipset, BIOS, virtual machine monitor (VMM) and applications enabled for virtualization technology. Functionality, performance or other virtualization technology benefits will vary depending on hardware and software configurations. Virtualization technology-enabled BIOS and VMM applications are currently in development. • Intel processor numbers are not a measure of performance. Processor numbers differentiate features within each processor family, not across different processor families. See www.intel.com/products/processor_number for details. • Intel, processors, chipsets, and desktop boards may contain design defects or errors known as errata, which may cause the product to deviate from published specifications. Current characterized errata are available on request. • 64-bit computing on Intel architecture requires a computer system with a processor, chipset, BIOS, operating system, device drivers and applications enabled for Intel® 64 architecture. Performance will vary depending on your hardware and software configurations. Consult with your system vendor for more information. • Intel, Intel Xeon, Intel Core microarchitecture, and the Intel logo are trademarks or registered trademarks of Intel Corporation or its subsidiaries in the United States and other countries. • Lead-free: 45nm product is manufactured on a lead-free process. Lead is below 1000 PPM per EU RoHS directive (2002/95/EC, Annex A). Some EU RoHS exemptions for lead may apply to other components used in the product package. • Halogen-free: Applies only to halogenated flame retardants and PVC in components. Halogens are below 900 PPM bromine and 900 PPM chlorine.
  • Risk Factors Intel’s Roadmap Update presentations may contain forward-looking statements and projections. All statements and projections made that are not historical facts are subject to a number of risks and uncertainties, and actual results may differ substantially. Please refer to our recent Earnings Release and Form 10-Q for more information on the Risk Factors that could cause actual results to differ. 10
  • Mission Critical (MC) Platform Roadmap 2009 Q1 ’09 Q2 ’09 Q3 ’09 2010 Q4 ’09 Next Generation Intel® Itanium® Intel® Itanium® Platform Server Platform (codename Boxboro-MC) Intel® Itanium® processor 9100 series Next-generation Intel® Itanium® processor Intel® E8870 Chipset — 400FSB, Intel® 82801DB (ICH4) (Tukwila*) Boxboro-MC Chipset Technologies Technologies FSB 667, DDR2-667, Quad-Core Dual-Core, Intel® QuickPath Interconnect , Hyper-Threading Technology, Dual Integrated Memory Controllers Mission Critical Intel® Virtualization Technology, Intel® Cache Safe Technology. IA-64, Demand Based switching, Core Level Lockstep * Tukwila production targeted to Q1 ’10 All products, computer systems, dates, and figures specified are preliminary based on current expectations, and are subject to change without notice. 2
  • Expandable Server (EX) Platform Roadmap 2009 2010 Caneland Platform Next Generation Expandable Platform (codename Boxboro-EX ) Intel® Xeon® processor 7400 series 45 nm 6-core Next-generation Intel® Xeon® processor (Dunnington) (Nehalem-EX* ) Intel® Xeon® processor 7300 & 7200 series Intel® 7300 Chipset Enabled chipsets -4P/8P+ platforms Boxboro-EX Chipset Technologies Expandable Quad-Core, Dual-Core, Technologies Up to 8 cores /16 Threads Intel® Core™ Microarchitecture, 24MB Shared Cache Dedicated High-Speed Interconnects (DHSI), Integrated Memory Controllers FBDIMM Memory Technology, Intel® Turbo Boost Intel® VT, Intel® Hyper-Threading Next Generation Intel® I/OAT, 64 MB Snoop Filter * Nehalem-EX on track for 2H ‘09 production All products, computer systems, dates, and figures specified are preliminary based on current expectations, and are subject to change without notice. 12
  • Efficient Performance (EP) Platform Roadmap 2009 2010 Intel ® Xeon® 5500 Platform (previously Tylersburg-EP) Intel ® Xeon® processor 5500 series Next-generation Intel ® Xeon® processor (Nehalem-EP) (Westmere-EP*) Intel® 5520 Chipset Intel® 5520 Chipset Technologies Technologies Quad-Core / Dual Core Up to 6 cores/12 Threads Efficient Performance DDR3 1333/1066/800 memory Improved Energy Efficiency Two Socket Intel® Turbo Boost Technology, Cache Enhancements Intel® VT Intel® QuickPath Interconnect (QPI) Intel® Hyper-Threading Technology Lead and halogen free platform kit1 * Westmere-EP available in 2010 All products, computer systems, dates, and figures specified are preliminary based on current expectations, and are subject to change without notice. 1.Lead and Halogen free kit includes Intel® Xeon® family CPU, Intel® Chipsets, and Intel® LAN components. 13 Note:45nm product is manufactured on a Lead Free process. Lead-free per EU RoHS directive July, 2006. Some E.U. RoHS
  • Entry Server (EN) Platform 2009 Roadmap 1H ‘09 2H ‘09 Intel ® Xeon® 5500 Platform (previously Tylersburg-EN) Intel ® Xeon® processor 5500 series (Nehalem–EP) Intel® 5500 Chipset Intel® Core™ Microarchitecture (codename Penryn) Entry Intel® Xeon® processor 5400 series Two Socket Intel® Xeon® processor 5200 series Intel® 5100 Chipset (previously San Clemente) Intel® 5000V Chipset (previously Blackford) Intel® Core™ Microarchitecture Next Generation (Intel® Microarchitecture (codename Merom & Penryn) codename Nehalem) Platform Intel® Xeon® processor 3300 series Next-generation Intel ® Xeon® processor Intel® Xeon® processor 3100 series (Lynnfield*) Intel® Xeon® processor 3200 series Intel® Xeon® processor 3000 series Intel® 3400/3420 Chipset Intel® 3210/3200 Chipset Entry One Socket *Lynnfield processor production targeted for 2H ’09 All products, computer systems, dates, and figures specified are preliminary based on current expectations, and are subject to Change without notice. 14
  • Workstation (WS) Platform Roadmap 2009 2010 Intel ® Xeon® 5500 Platform (previously Tylersburg-WS ) Intel ® Xeon® processor 5500 series Next-generation Intel ® Xeon® processor (Nehalem-WS) (Westmere-WS*) Intel® 5520 Chipset Workstation Two Socket Intel ® Xeon® 3500 Platform (previously Tylersburg-WS ) Intel ® Xeon® processor 3500 series Next-generation Intel ® Xeon® processor (Nehalem-WS) (Westmere-WS*) Intel® X58 Express Chipset Intel® Core™ Microarchitecture Next Generation (Intel® Microarchitecture (codename Merom & Penryn) codename Nehalem ) Platform Intel® Core™2 processor series Next-generation Intel® Xeon® processor Intel® X38 Express Chipset (Lynnfield) Ibex Peak Chipset** Workstation One Socket * Westmere processor available in 2010 ** Ibex Peak chipset for Lynnfield-based Workstations targeted for production in 2H’09 All products, computer systems, dates, and figures specified are preliminary based on current expectations, and are 15subject to change without notice.