Ats Maxi Flow And Maxi Grip Technical Data July 09

maxiFLOW and maxiGRIP The Solution For Heat Sink Attachment Technical Data Package Product of Advanced Thermal Solutions, Inc. 89-27 Access Road Norwood, MA 02062 USA 781-769-2800

maxiFLOW™ Heat Sink Technology maxiFLOW™ Heat Sink BGA Component • maxiFLOW™ heat sinks feature a low profile, spread fin array to maximize surface area • Extruded aluminum fabrication minimizes thermal resistance and weight. • Reduces device junction temperatures (Tj) by more than 20% (compared to other types of heat sinks of similar volume, tested at air flow of just 0.5 m/s (100 ft/m)) • Anodized finish enhances surface emissivity and improves thermal performance Copyright©, Advanced Thermal Solutions, Inc. 2

maxiFLOW™ vs. Straight Fin Heat Sink Fin Tip to Fin Tip • maxiFLOW™ fin architecture allow fins to overhang components • Provides 20% improvement in performance over straight fin heat sinks • Flared fins allow for lower profile heat sinks with the same or greater performance Copyright©, Advanced Thermal Solutions, Inc. 3

maxiGRIP™ Heat Sink Attachment • A plastic frame clip snaps securely around a component’s perimeter • A stainless steel spring clip runs though the heat sink’s fin field and fastens securely to the plastic frame • The combination of the above secures the component with steady, even pressure • This allows for quick and easy removal of the heat sink • The spring clip is easily removed to allow the heat sink to be detached and reattached without damaging the component • This does not require holes in the board and leaves more room for circuit traces on the PCB • Meets Mil-STD-810 Shock and Drop Testing, Telcordia GR-63-Core Office Vibration, ETSI 300 019 Transportation Vibration standards, NEBS standards and RoHS requirements Copyright©, Advanced Thermal Solutions, Inc. 4

maxiFLOW™ Heat Sink Technology with superGRIP • Requires minimal space around the component’s perimeter; ideal for densely populated PCBs • Allows the Heat Sink to be detached and reattached from a component with no destruction of the component or board • Strong uniform attachment force helps achieve maximum performance from phase change TIM Copyright©, Advanced Thermal Solutions, Inc. 5

maxiGRIP Evolution • maxiGRIP™ Customer Heat Sink attach method was introduced in 2004 • superGRIP™ introduced in 2006 as a product family option decreasing PWB keep out restrictions MxiPKG™ • MxiPKG™ takes full advantage of the mechanical benefits of current ATS maxiGRIP™ product design and enhances the thermal performance superGRIP™ maxiGRIP™ Copyright©, Advanced Thermal Solutions, Inc. 7

Technical Advantage – shock and vibe • maxiPACKAGE (heat sink, frame and clip) have received a certificate of compliance from NTS Test Labs for passing tests in accordance with: • Telcordia GR-63-Core Office Vibration, • ETSI 300 019 Transportation Vibration • Mil-STD-810 Shock Testing and Unpackaged Drop Testing. • The product remained securely on the test unit and showed no physical damage after testing • Please refer to NTS test lab report for full data set by clicking on the report cover in the next column. Copyright©, Advanced Thermal Solutions, Inc. 8

Different HS Technologies Compared Elliptical Finned Extruded Longitudinal Finned Thermal Resistance/Area (°C/W/cm2) Folded Finned Cross Cut maxiFLOW™ Low Profile maxiFLOW™ Source: F. Forghan, et. al., 2001 Copyright©, Advanced Thermal Solutions, Inc. 9

maxiFLOWTM vs. Competitors – hA Comparison 1 ATS 3 6 ATS 4 ATS 5 2 7 hA Values For 7 Different Heat Sinks As a Function of Velocity, Ref: Pictures of 7 Different Heat Sinks Clemens Lasance, IEEE-SEMI-THERM 2005 • Heat sinks 3,4 and 5 are ATS maxiFLOW™ ATS • Heat sinks 1,2,6 and 7 are competitor’s heat sinks • All heat sinks have similar size base area • The 3 top curves have the highest hA (heat transfer coefficient X base area), i.e., Lowest thermal resistance Copyright©, Advanced Thermal Solutions, Inc. 10

maxiFLOWTM vs. Competitors - Using Different Metrics 1 ATS 3 6 ATS 4 ATS 5 2 7 Pictures of 7 Different Heat Sinks hA Values For 7 Different Heat Sinks As a Function of Velocity, Ref: Clemens Lasance, IEEE-SEMI-THERM 2005 • According to Lasance, ATS heat sink number 3 is champion for the ratio hA/H (hA divided by total height) – This implies ATS is best suited for applications with limited space • All ATS heat sinks 3,4 and 5 have the highest hA/H Copyright©, Advanced Thermal Solutions, Inc. 11

maxiFLOW™ vs. Various Heat Sink Types Wind Tunnel Test Results a b c d Pictures Of Various Heat sinks. (a) Straight Fin, (b) Elliptical Pin Fin, (C) Cylindrical Pin Fin, (d) maxiFLOWTM Heat Sinks Under Test at ATS CWT-106 Wind Tunnel Copyright©, Advanced Thermal Solutions, Inc. 12

Heat Sink Types: Flow Management Premature Flow Egress Flow Energy Loss • Some heat sinks, such as folded and straight fin, need ducting to increase performance Straight Fin • It is important to consider heat sinks that exhibit the least premature flow egress and energy loss when Folded Fin compared to other designs maxiFLOW™ Copyright©, Advanced Thermal Solutions, Inc. 13

maxiFLOW™ vs. Various Heat Sink Types Wind Tunnel Test Results ATS maxiFLOW™ Thermal Resistance for Thermal Resistance for 25x25x17 mm Heat Sinks 42x42x17 mm Heat Sinks • For the 25x25x17 mm heat sink maxiFLOW™ has the lowest resistance • For the 42x42x17 mm heat sink maxiFLOW™ has the lowest resistance • At very low flows (most practical applications), maxiFLOW™ heat sinks are almost twice better compared to round pin fins, elliptic pin fins and straight fin heat sinks Copyright©, Advanced Thermal Solutions, Inc. 14

ATS Heat Sinks Three factors have yielded this unique performance 1. Design capabilities - Approaching the problem from the heat transfer and fluid mechanics viewpoints, rather than mass production. 2. Manufacturing technology Unique and patented manufacturing process to enable production of custom designs with high performance, low profile and light weight. 3. Testing ATS tests all its heat sinks in an unducted, research quality wind tunnel. Prototypes and tests each design to verify performance. Copyright©, Advanced Thermal Solutions, Inc. 15

PCM Ramp and Wetting • Engineering Data: • ATS’s current generation BGA attach technology, MaxiGRIP and superGRIP • MaxiGRIP test results show significant improvement over other technologies for PCM • Test data with first generation technology MaxiGRIP show: • Insure even wetting with phase change material across the top of the chip for best contact with a heat sink • Results in better thermal performance than alternatives due to the proper pressure exerted on phase change material in cooling semiconductors. • Apply consistent, continuous, creep-free force onto the chip through the use of properly designed spring clips (which do not necessarily have to be ATS’s) • Economizes on keep out area to allow tighter pitch between IC’s while allowing for all these benefits Copyright©, Advanced Thermal Solutions, Inc. 16

PCM Ramp and Wetting - Experiment • Experiment • ATS conducted an experiment to understand the benefits for semiconductors using MaxiGRIP’s technology with Phase Change TIM. As the MxiPKG BGA package is derived from the MaxiGRIP technology, the results are relevant. • An ATS MaxiFLOW Heat Sink was attached to an ATS test board using the ATS MaxiGRIP BGA attach method • The test board contained a heating element simulating a lidless semiconductor. • ATS heat sink part EX84 • Die Size 10mmx10mm • 10 to 20 PSI applied • Chomerics T-766 Phase change material was applied to the HS’s underside. • Burn in of 100 Deg.C to seat TIM • Test Parameters •Test Wattage: 5.8W Copyright©, Advanced Thermal Solutions, Inc. 17

PCM Ramp and Wetting - Experiment Photo of ATS Test Board Test Board Front Test Board Back Simulated Heating lidless IC Element sits behind simulated lidless IC MaxiGRIP frame clip Power and Power and sensor sensor leads leads Copyright©, Advanced Thermal Solutions, Inc. 18

PCM Ramp and Wetting - Results • Chomerics predicted outcome on T-766 • Chomerics test data shows T-766 phase change material flows at 75PSI and temperatures above 58C. •MaxiGRIP actual outcome from experiment • ATS MaxiGRIP experiment shows phase change flow starts from 10 – 20PSI and with temperatures between 51C and 58C. • ATS MaxiGRIP approach allows for the phase change to occur earlier providing faster cooling. • Discussion • The test data shows that using MaxiGRIP technology with Phase Change TIM resulted in less PSI and therefore stress to the test IC as well as faster ramp to steady state for the phase change TIM. • These test results suggest that MaxiGRIP technology used on IC’s will reduce overall BGA stress as well as improving the performance of already thermally superior phase change material. • These test results suggest that heat sinks with phase change material using next generation superGRIP technology should have the same results but with a smaller keep out area around the chip. Copyright©, Advanced Thermal Solutions, Inc. 20

Advanced Thermal Solutions, Inc. Cooling Solutions Thermal Evaluation Compliance High Tech Manufacturing Testing and Supply Chain Mechanical and Thermal Design Instrumentation Services and Control Systems Your solution to electronics packaging and thermal management. Copyright©, Advanced Thermal Solutions, Inc. 21

Ats Maxi Flow And Maxi Grip Technical Data July 09

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