MHMilil arbidePower FlB JRYflllT   BflllGfl
EMiTim CarbidePower Devices
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Carbide                   Power Devices                   B         jnvnnT                                BRLIGR          ...
Published byWorld Scientific Publishing Co. Pte. Ltd.5 Toh Tuck Link, Singapore 596224USA office: 27 Warren Street, Suite ...
DedicationThe author would like to dedicate this book to his family- his wife, Pratima and his sons, Avinash and Vinay - f...
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PrefacePower semiconductor devices are a key component of all powerelectronic systems. It is estimated that at least 50 pe...
VU1                  SILICON CARBIDE POWER DEVICESissues produced a cumbersome design with snubber networks, whichraised t...
Preface                                  IX on-state resistance, it became possible to postulate that unipolar power devic...
X                   SILICON CARBIDE POWER DEVICESvolt and no reverse recovery transients . By improving the edgeterminatio...
Preface                                   XIThe simulations were done for 4H-SiC, rather than 6H-SiC, because itslarger br...
Xll                  SILICON CARBIDE POWER DEVICESadvantages of larger channel mobility and lower threshold voltageleading...
Preface                                 xin        I am hopeful that this book will be used for the teaching ofcourses on ...
XIV                 SILICON CARBIDE POWER DEVICESReferences1    B.J. Baliga, "Power Semiconductor Devices", PWS Publishing...
ContentsPreface                                                       viiChapter 1 Introduction                           ...
xvi                 SILICON CARBIDE POWER DEVICESChapter 3 Breakdown Voltage                                       373.1 O...
Contents                             xviiChapter 6 Shielded Schottky Rectifiers                             1036.1 Junctio...
XVU1                 SILICON CARBIDE POWER DEVICESChapter 8 The Baliga-Pair Configuration                       1998.1 The...
Contents                             xixChapter 10 Shielded Planar MOSFETs                             25910.1 Shielded Pl...
XX                 SILICON CARBIDE POWER DEVICESChapter 12 Shielded Trench-Gate Power MOSFETs               33912.1 Shield...
Contents                                xxiChapter 14 Integral Diodes                                          42514.1 Tre...
Chapter 1                           IntroductionThe increasing dependence of modern society on electrical appliances forco...
2                       SILICON CARBIDE POWER DEVICESIGBTs for the medium frequency and power applications, and powerMOSFE...
Introduction                      3MOSFETs with appropriate control ICs to serve applications such asautomotive electronic...
4                      SILICON CARBIDE POWER DEVICESdrop (V 0 N) when carrying current on the on-state leading to conducti...
Introduction                           5         The i-v characteristics of an ideal power switch are illustrated inFig. 1...
6                     SILICON CARBIDE POWER DEVICESchannel pinch-off in the current saturation mode1. Recently, devicesope...
Introduction                                     7applications1. Silicon P-i-N rectifiers are favored for designs with lar...
SILICON CARBIDE POWER DEVICESresistance increases rapidly with increasing blocking voltage limiting theperformance of sili...
Introduction                              9MOSFETs and IGBTs supplanted them. The structures of the bipolartransistor and ...
10                     SILICON CARBIDE POWER DEVICESwhich was developed in the 1980s by combining the physics of operation...
Introduction                                   111.5 Ideal Drift Region for Unipolar Power DevicesThe unipolar power devic...
12                     SILICON CARBIDE POWER DEVICES                                           (                          ...
Introduction                                           13silicon, gallium arsenide, and silicon carbide are shown in the f...
14                     SILICON CARBIDE POWER DEVICESReferences1       B.J. Baliga, "Power Semiconductor Devices", PWS Publ...
Chapter 2       Material Properties and TechnologyIn the previous chapter, it was demonstrated the resistance of the drift...
16                        SILICON CARBIDE POWER DEVICES2.1 Fundamental PropertiesThis section provides a summary of the fu...
Material Properties and Technology               172.1.1 Energy Band GapThe energy band gap of silicon carbide is much lar...
18                                 SILICON CARBIDE POWER DEVICESdevices. Surface generation currents may be much larger du...
Material Properties and Technology                 19         For silicon, the intrinsic carrier concentration becomes equ...
20                                 SILICON CARBIDE POWER DEVICESdevice structures, such as the ACCUFET, that are tailored ...
Material Properties and Technology               21abrupt P-N junction. For the case of silicon, three lines are given for...
22                             SILICON CARBIDE POWER DEVICES                          a(4H - SiC) = 6.46*10 6 - 1.07;cl04:...
Material Properties and Technology                     23for breakdown for 4H-SiC resulting in a big increase in the Balig...
24                            SILICON CARBIDE POWER DEVICES                                   ,„. x     5.1(M0 1 8 +92A^ 9...
Material Properties and Technology              25silicon and 4H-SiC as shown in Fig. 2.8. For silicon, the temperaturedep...
26                     SILICON CARBIDE POWER DEVICESallowing the approximation that the electron concentration is equal to...
Material Properties and Technology                      27In order to take full advantage of the low specific on-resistanc...
28                     SILICON CARBIDE POWER DEVICES         Metal-semiconductor contacts can also be used to make Schottk...
Material Properties and Technology              29structures in silicon carbide must take this limitation in processtechno...
30                     SILICON CARBIDE POWER DEVICES         The issues that must be considered for the gate dielectric in...
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  1. 1. MHMilil arbidePower FlB JRYflllT BflllGfl
  2. 2. EMiTim CarbidePower Devices
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  4. 4. Carbide Power Devices B jnvnnT BRLIGR North Carolina State University, USA [p World ScientificN E W JERSEY • L O N D O N • SINGAPORE • BEIJING • S H A N G H A I • HONG KONG • T A I P E I • C H E N N A I
  5. 5. Published byWorld Scientific Publishing Co. Pte. Ltd.5 Toh Tuck Link, Singapore 596224USA office: 27 Warren Street, Suite 401-402, Hackensack, NJ 07601UK office: 57 Shelton Street, Covent Garden, London WC2H 9HEBritish Library Cataloguing-in-Publication DataA catalogue record for this book is available from the British Library.SILICON CARBIDE POWER DEVICESCopyright © 2005 by World Scientific Publishing Co. Pte. Ltd.All rights reserved. This book, or parts thereof, may not be reproduced in any form or by any means,electronic or mechanical, including photocopying, recording or any information storage and retrievalsystem now known or to be invented, without written permission from the Publisher.For photocopying of material in this volume, please pay a copying fee through the CopyrightClearance Center, Inc., 222 Rosewood Drive, Danvers, MA 01923, USA. In this case permission tophotocopy is not required from the publisher.ISBN 981-256-605-8Printed in Singapore by B & JO Enterprise
  6. 6. DedicationThe author would like to dedicate this book to his family- his wife, Pratima and his sons, Avinash and Vinay - fortheir support of his commitment to create a world-wideeffort on the development and commercialization ofpower devices based upon wide band-gapsemiconductors. V
  7. 7. This page is intentionally left blank
  8. 8. PrefacePower semiconductor devices are a key component of all powerelectronic systems. It is estimated that at least 50 percent of theelectricity used in the world is controlled by power devices. With thewide spread use of electronics in the consumer, industrial, medical, andtransportation sectors, power devices have a major impact on theeconomy because they determine the cost and efficiency of systems.After the initial replacement of vacuum tubes by solid state devices in the 1950s, semiconductor power devices have taken a dominant role withsilicon serving as the base material. Bipolar power devices, such as bipolar transistors and thyristors,were first developed in the 1950s. Their power ratings and switchingfrequency increased with advancements in the understanding of theoperating physics and availability of more advanced lithographycapability. The physics underlying the current conduction and switchingspeed of these devices has been described in several textbooks12. Sincethe thyristors were developed for high voltage DC transmission andelectric locomotive drives, the emphasis was on increasing the voltagerating and current handling capability. The ability to use neutrontransmutation doping to produce high resistivity n-type silicon withimproved uniformity across large diameter wafers enabled increasing theblocking voltage of thyristors to over 5000 volts while being able tohandle over 2000 amperes of current in a single device. Meanwhile,bipolar power transistors were developed with the goal of increasing theswitching frequency in medium power systems. Unfortunately, thecurrent gain of bipolar transistors becomes low when it is designed forhigh voltage operation at high current density. The popular solution tothis problem, using the Darlington configuration, had the disadvantage ofincreasing the on-state voltage drop resulting in an increase in the powerdissipation. In addition to the large control currents required for bipolartransistors, they suffered from second breakdown failure modes. These vu
  9. 9. VU1 SILICON CARBIDE POWER DEVICESissues produced a cumbersome design with snubber networks, whichraised the cost and degraded the efficiency of the power control system. In the 1970s, the power MOSFET product was first introducedby International Rectifier Corporation. Although initially hailed as areplacement for all bipolar power devices due to its high inputimpedance and fast switching speed, the power MOSFET hassuccessfully cornered the market for low voltage (< 100 V) and highswitching speed (> 100 kHz) applications but failed to make seriousinroads in the high voltage arena. This is because the on-state resistanceof power MOSFETs increases very rapidly with increase in thebreakdown voltage. The resulting high conduction losses, even whenusing larger more expensive die, degrade the overall system efficiency. In recognition of these issues, I proposed two new thrusts in 1979 for the power device field. The first was based upon the merging ofMOS and bipolar device physics to create a new category of powerdevices3. My most successful innovation among MOS-Bipolar deviceshas been the Insulated Gate Bipolar Transistor (IGBT). Soon aftercommercial introduction in the early 1980s, the IGBT was adopted for allmedium power electronics applications. Today, it is manufactured bymore than a dozen companies around the world for consumer, industrial,medical, and other applications that benefit society. The triumph of theIGBT is associated with its huge power gain, high input impedance, widesafe operating area, and a switching speed that can be tailored forapplications depending upon their operating frequency. The second approach that I suggested in the early 1980s forenhancing the performance of power devices was to replace silicon withwide band gap semiconductors. The basis for this approach was anequation that I derived relating the on-resistance of the drift region inunipolar power devices to the basic properties of the semiconductormaterial. This equation has since been referred to as Baligas Figure ofMerit (BFOM). In addition to the expected reduction in the on-stateresistance with higher carrier mobility, the equation predicts a reductionin on-resistance as the inverse of the cube of the breakdown electric fieldstrength of the semiconductor material. In the 1970s, there was a dearth of knowledge of the impactionization coefficients of semiconductors. Consequently, an associationof the breakdown electric field strength was made with the energy bandgap of the semiconductor4. This led to the conclusion that wide band gapsemiconductors offer the opportunity to greatly reduce the on-stateresistance of the drift region in power devices. With a sufficiently low
  10. 10. Preface IX on-state resistance, it became possible to postulate that unipolar power devices could be constructed from wide band gap semiconductors with lower on-state voltage drop than bipolar devices made out of silicon. Since unipolar devices exhibit much faster switching speed than bipolar devices because of the absence of minority carrier stored charge, wide band gap based power devices offered a much superior alternative to silicon bipolar devices for medium and high power applications. Device structures that were particularly suitable for development were identified as Schottky rectifiers to replace silicon P-i-N rectifiers, and power Field Effect Transistors to replace the bipolar transistors and thyristors prevalent in the 1970s. The first attempt to develop wide band gap based power devices was undertaken at the General Electric Corporate Research and Development Center, Schenectady, NY, under my direction. The goal was to leverage a 13-fold reduction in specific on-resistance for the drift region predicted by the BFOM for Gallium Arsenide. A team of 10 scientists was assembled to tackle the difficult problems of the growth of high resistivity epitaxial layers, the fabrication of low resistivity ohmiccontacts, low leakage Schottky contacts, and the passivation of the GaAs surface. This led to an enhanced understanding of the breakdown strength5 for GaAs and the successful fabrication of high performanceSchottky rectifiers6 and MESFETs7. Experimental verification of thebasic thesis of the analysis represented by BFOM was thereforedemonstrated during this period. Commercial GaAs based Schottkyrectifier products were subsequently introduced in the market by severalcompanies. In the later half of the 1980s, the technology for the growth of silicon carbide was developed with the culmination of commercialavailability of wafers from CREE Research Corporation. Although dataon the impact ionization coefficients of SiC was not available, earlyreports on the breakdown voltage of diodes enabled estimation of thebreakdown electric field strength. Using these numbers in the BFOMpredicted an impressive 100-200 fold reduction in the specific on-resistance of the drift region for SiC based unipolar devices. In 1988, Ijoined North Carolina State University and subsequently founded thePower Semiconductor Research Center (PSRC) - an industrialconsortium - with the objective of exploring ideas to enhance powerdevice performance. Within the first year of the inception of theprogram, SiC Schottky barrier rectifiers with breakdown voltage of 400volts were successfully fabricated with on-state voltage drop of about 1
  11. 11. X SILICON CARBIDE POWER DEVICESvolt and no reverse recovery transients . By improving the edgetermination of these diodes, the breakdown voltage was found to increaseto 1000 volts. With the availability of epitaxial SiC material with lowerdoping concentrations, SiC Schottky rectifiers with breakdown voltagesover 2.5 kV have been fabricated at PSRC9. These results have motivatedmany other groups around the world to develop SiC based powerrectifiers. In this regard, it has been my privilege to assist in theestablishment of national programs to fund research on silicon carbidetechnology in the United States, Japan, and Switzerland-Sweden.Meanwhile, accurate measurements of the impact ionization coefficientsfor 6H-SiC and 4H-SiC in defect free regions were performed at PSRCusing an electron beam excitation method10. Using these coefficients, aBFOM of over 1000 is predicted for SiC providing even greatermotivation to develop power devices from this material. Although the fabrication of high performance, high voltageSchottky rectifiers has been relatively straight-forward, the developmentof a suitable silicon carbide MOSFET structure has been moreproblematic. The existing silicon power D-MOSFET and U-MOSFETstructures do not directly translate to suitable structures in siliconcarbide. The interface between SiC and silicon dioxide, as a gatedielectric, needed extensive investigation due to the large density of trapsthat prevent the formation of high conductivity inversion layers. Evenafter overcoming this hurdle, the much higher electric field in the silicondioxide when compared with silicon devices, resulting from the muchlarger electric field in the underlying SiC, leads to reliability problems.Fortunately, a structural innovation, called the ACCUFET, to overcomeboth problems was proposed and demonstrated at PSRC11. In thisstructure, a buried P+ region is used to shield the gate region from thehigh electric field within the SiC drift region. This concept is applicableto devices that utilize either accumulation channels or inversionchannels. Devices with low specific on-resistance have beendemonstrated at PSRC using both 6H-SiC and 4H-SiC with epitaxialmaterial capable of supporting over 5000 volts12. This device structurehas been subsequently emulated by several groups around the world. Although many papers have been published on silicon carbidedevice structures and process technology, no comprehensive bookwritten by a single author is available that provides a unified treatment ofsilicon carbide power device structures. This book has been prepared tofill this gap. The emphasis in the book is on the physics of operation ofthe devices elucidated by extensive two-dimensional numerical analysis.
  12. 12. Preface XIThe simulations were done for 4H-SiC, rather than 6H-SiC, because itslarger breakdown strength results in superior device performance. Thisanalysis provides general guidelines for understanding the design andoperation of the various device structures. For designs that may bepertinent to specific applications, the reader should refer to the paperspublished in the literature, the theses of my M.S. and Ph.D. students, aswell as the work reported by other research groups. Comparison withsilicon devices is provided to enable the reader to understand the benefitsof silicon carbide devices. In the introduction chapter, the desired characteristics of powerdevices are described with a broad introduction to potential applications.The second chapter provides the properties of silicon carbide that haverelevance to the analysis and performance of power device structures.Issues pertinent to the fabrication of silicon carbide devices are reviewedhere because the structures analyzed in the book have been constructedwith these process limitations in mind. The third chapter discussesbreakdown voltage, which is the most unique distinguishingcharacteristic for power devices, together with edge terminationstructures. This analysis is pertinent to all the device structures discussedin subsequent chapters of the book. The fourth chapter provides a brief analysis of P-i-N rectifiersfollowed by a detailed analysis of the Schottky rectifier structure inchapter five. The sixth chapter introduces the concept and explains thebenefits of shielding the Schottky contact. This approach is essential formitigating the generation of high leakage current in silicon carbideSchottky rectifiers arising from Schottky barrier lowering and tunnelingcurrents. The next chapter describes power JFET and MESFETstructures with planar and trench gate regions. These normally-onstructures can be used to construct the Baliga-Pair circuit13, described inchapter eight, which has been shown to be ideally suitable for motorcontrol applications. This represents a near term solution to takingadvantage of the low specific on-resistance of the silicon carbide driftregion while awaiting resolution of reliability issues with the gate oxidein silicon carbide power MOSFET structures. Chapter nine provides a description of silicon carbide powerMOSFET structures with emphasis on problems associated with simplyreplicating structures originally developed in silicon technology.Innovative approaches to prevent high electric field in the gate oxide ofsilicon carbide power MOSFETs are then discussed in chapter ten. In thischapter, accumulation-mode structures are shown to provide the
  13. 13. Xll SILICON CARBIDE POWER DEVICESadvantages of larger channel mobility and lower threshold voltageleading to a reduction in the specific on-resistance. In chapter eleven,issues with adopting the silicon UMOSFET structure to silicon carbideare enunciated followed by analysis of solutions to these problems inchapter twelve. Once again, methods for shielding the gate oxide areshown to enable reduction of the electric field in the gate oxide toacceptable levels. The shielding is also demonstrates to ameliorate thebase reach-through problem allowing a reduction of the base width andhence the channel resistance contribution. The application of the charge-coupling concept to silicon carbideis explored in chapter thirteen to reduce the resistance of the drift region.This approach is applicable to very high voltage structures with blockingvoltage capability exceeding 3000 volts. In chapter fourteen, theoperation of the integral diode within the silicon carbide power MOSFETstructures is analyzed for utilization as a fly-back rectifier in motorcontrol applications. A unique mode of current conduction in the siliconcarbide power MOSFET in the third quadrant of operation is identifiedhere which allows for a reduction of the on-state voltage drop of theintegral diode. Although the emphasis in this book has been on discrete verticalsilicon carbide structures, for the sake of completeness, the fifteenthchapter describes high voltage lateral silicon carbide structures that aresuitable for integration with CMOS circuits. In the concluding sixteenthchapter, the performance of silicon carbide devices is compared with thatof silicon devices using a typical motor control application as an exampleto provide the reader with a perspective on the benefits of using siliconcarbide devices. From an applications perspective, it is demonstrated thatthe replacement of the silicon P-i-N rectifier with the silicon carbide JBSrectifier provides a significant reduction in the power losses for thesystem as well as the stress experienced by the silicon IGBT. Thisapproach is already becoming a commercially viable option due to theavailability of silicon carbide Schottky rectifier products from severalcompanies. Throughout the book, experimental results are includedwhenever pertinent to each chapter. This provides a historical contextand a brief summary of the state of the art for silicon carbide devices.Issues that must be addressed before commercialization of siliconcarbide structures becomes viable are pointed out in these sections of thebook.
  14. 14. Preface xin I am hopeful that this book will be used for the teaching ofcourses on solid state devices and that it will make an essential referencefor the power device industry. To facilitate this, analytical solutions areprovided throughout the book that can be utilized to understand theunderlying physics and model the structures. Comparison of the siliconcarbide structures with their silicon counterparts is also includedwhenever pertinent to the discussion. Ever since my identification of the benefits of utilizing wideband gap semiconductors for the development of superior power devicestwenty-five years ago, it has been my mission to resolve issues thatwould impede their commercialization. I wish to thank the sponsors ofthe Power Semiconductor Research Center and the Office of NavalResearch for supporting this mission during the last fifteen years. Thishas been essential to providing the resources required to create manybreakthroughs in the silicon carbide technology which I hope will enablecommercialization of the technology in the near future. I look forward toobserving the benefits accrued to society by adopting the silicon carbidetechnology for conservation of fossil fuel usage resulting in reducedenvironmental pollution. Prof. B. Jayant Baliga 2005
  15. 15. XIV SILICON CARBIDE POWER DEVICESReferences1 B.J. Baliga, "Power Semiconductor Devices", PWS PublishingCompany, 1996.2 S. K. Ghandhi, "Semiconductor Power Devices", John Wiley andSons, 1977.3 B. J. Baliga, "Evolution of MOS-Bipolar Power SemiconductorTechnology", Proceedings IEEE, pp. 409-418, April 1988.4 B.J. Baliga, "Semiconductors for High Voltage Vertical Channel FieldEffect Transistors", J. Applied Physics, Vol. 53, pp. 1759-1764, March1982.5 B.J. Baliga, R. Ehle, J.R. Shealy, and W. Garwacki, "BreakdownCharacteristics of Gallium Arsenide", IEEE Electron Device Letters,Vol. EDL-2, pp. 302-304, November 1981.6 B. J. Baliga, A.R. Sears, M.M. Barnicle, P.M. Campbell, W.Garwacki, and J.P. Walden, "Gallium Arsenide Schottky PowerRectifiers", IEEE Transactions on Electron Devices, Vol. ED-32, pp.1130-1134, June 1985.7 P.M. Campbell, W. Garwacki, A.R. Sears, P. Menditto, and B.J.Baliga, Trapezoidal-Groove Schottky-Gate Vertical-Channel GaAsFET", IEEE Electron Device Letters, Vol. EDL-6, pp. 304-306, June1985.8 M. Bhatnagar, P.K. McLarty, and B.J. Baliga, "Silicon-Carbide High-Voltage (400 V) Schottky Barrier Diodes", IEEE Electron DeviceLetters, Vol. EDL-13, pp.501-503, October 1992.9 R.K. Chilukuri and B.J. Baliga, "High Voltage Ni/4H-SiC SchottkyRectifiers", International Symposium on Power Semiconductor Devicesand ICs, pp. 161-164, May 1999.10 R. Raghunathan and B.J. Baliga, Temperature dependence of HoleImpact Ionization Coefficients in 4H and 6H-SiC", Solid StateElectronics, Vol. 43, pp. 199-211, February 1999.11 P.M. Shenoy and B.J. Baliga, "High Voltage Planar 6H-SiCACCUFET", International Conference on Silicon Carbide, Ill-Nitrides,and Related Materials, Abstract Tu3b-3, pp. 158-159, August 1997.12 R.K. Chilukuri and B.J. Baliga, PSRC Technical Report TR-00-007,May 2000.13 B.J. Baliga, See Chapter 7 in "Power Semiconductor Devices", pp.417-420, PWS Publishing Company, 1996.
  16. 16. ContentsPreface viiChapter 1 Introduction 11.1 Ideal and Typical Power Device Characteristics 31.2 Unipolar Power Devices 61.3 Bipolar Power Devices 81.4 MOS-Bipolar Power Devices 91.5 Ideal Drift Region for Unipolar Power Devices 111.6 Summary 13 References 14Chapter 2 Material Properties and Technology 152.1 Fundamental Properties 16 2.1.1 Energy Band Gap 17 2.1.2 Impact Ionization Coefficients 21 2.1.3 Electron Mobility 232.2 Other Properties Relevant to Power Devices 25 2.2.1 Donor and Acceptor Ionization Energy Levels 25 2.2.2 Recombination Lifetimes 26 2.2.3 Metal-Semiconductor Contacts 262.3 Fabrication Technology 28 2.3.1 Diffusion Coefficients and Solubility of Dopants 28 2.3.2 Ion Implantation and Annealing 29 2.3.3 Gate Oxide Formation 29 2.3.4 Reactive Ion Etching of Trenches 322.4 Summary 32 References 33 XV
  17. 17. xvi SILICON CARBIDE POWER DEVICESChapter 3 Breakdown Voltage 373.1 One-Dimensional Abrupt Junction 373.2 Schottky Diode Edge Termination 44 3.2.1 Planar Schottky Diode Edge Termination 44 3.2.2 Planar Schottky Diode with Field Plate Termination 45 3.2.3 Schottky Diode with Floating Metal Rings 50 3.2.4 Schottky Diode Edge Termination with Argon Implant ....50 3.2.5 Schottky Diode Edge Termination with RESP Region 523.3 P-N Junction Edge Termination 53 3.3.1 Planar Junction Edge Termination 53 3.3.2 Planar Junction Edge Termination with Field Plate 57 3.3.3 Planar Junction Edge Termination with Floating Rings 61 3.3.4 Planar Junction Edge Termination with P-Extension 623.4 Summary 68 References 69Chapter 4 PiN Rectifiers 714.1 One-Dimensional PiN Structure 714.2 Experimental Results 794.3 Summary 80 References 81Chapter 5 Schottky Rectifiers 835.1 Schottky Rectifier Structure: Forward Conduction 84 5.1.1 Forward Conduction: Simulation Results 88 5.1.2 Forward Conduction: Experimental Results 905.2 Schottky Rectifier Structure: Reverse Blocking 915.3 Schottky Rectifier Structure: Impact of Defects 965.4 Reliability Issues 1005.5 Summary 100 References 101
  18. 18. Contents xviiChapter 6 Shielded Schottky Rectifiers 1036.1 Junction Barrier Schottky (JBS) Rectifier Structure 104 6.1.1 JBS Rectifier Structure: Forward Conduction Model 106 6.1.2 JBS Rectifier Structure: Reverse Leakage Model 108 6.1.3 JBS Rectifier Structure: Simulation Results 109 6.1.4 JBS Rectifier Structure: Experimental Results 1186.2 Trench MOS Barrier Schottky (TMBS) Rectifier Structure 120 6.2.1 TMBS Rectifier Structure: Simulation Results 1216.3 Trench Schottky Barrier Schottky (TSBS) Rectifier Structure... 124 6.3.1 TSBS Rectifier Structure: Simulation Results 127 6.3.2 TSBS Rectifiers: Experimental Results 1386.4 Summary 138 References 139Chapter 7 Metal-Semiconductor Field Effect Transistors 1417.1 Trench Junction (Metal-Semiconductor) FET Structure 142 7.1.1 Forward Blocking 144 7.1.2 On-State 1487.2 Trench MESFET Structure: Simulation Results 151 7.2.1 On-State Characteristics 151 7.2.2 Blocking Characteristics 154 7.2.3 Output Characteristics 1637.3 JFET Structure: Simulation Results 1657.4 Planar MESFET Structure 168 7.4.1 Forward Blocking 170 7.4.2 On-State Resistance 1707.5 Planar MESFET Structure: Numerical Simulations 174 7.5.1 On-State Characteristics 174 7.5.2 Blocking Characteristics 177 7.5.3 Output Characteristics 187 7.5.4 Gate Contact Shielding 1897.6 Experimental Results: Trench Gate Structures 1917.7 Experimental Results: Planar Gate Structures 1947.8 Summary 195 References 196
  19. 19. XVU1 SILICON CARBIDE POWER DEVICESChapter 8 The Baliga-Pair Configuration 1998.1 The Baliga-Pair Configuration 201 8.1.1 Voltage Blocking Mode 202 8.1.2 Forward Conduction Mode 203 8.1.3 Current Saturation Mode 203 8.1.4 Switching Characteristics 204 8.1.5 Fly-Back Diode 2048.2 Baliga-Pair: Simulation Results 205 8.2.1 Voltage Blocking Mode 206 8.2.2 Forward Conduction Mode 208 8.2.3 Current Saturation Mode 210 8.2.4 Switching Characteristics 211 8.2.5 Fly-Back Diode 2148.3 Baliga-Pair Configuration: Experimental Results 2178.4 Summary 217 References 218Chapter 9 Planar Power MOSFETs 2219.1 Planar Power MOSFET Structure 223 9.1.1 Blocking Characteristics 224 9.1.2 Forward Conduction 227 9.1.3 Threshold Voltage 234 9.1.4 Threshold Voltage Simulations 238 9.1.5 Hot Electron Injection 2419.2 Planar Power MOSFET Structure: Numerical Simulations 242 9.2.1 Blocking Characteristics 243 9.2.2 On-State Characteristics 247 9.2.3 Output Characteristics 2509.3 Planar Power MOSFET: Experimental Results 252 9.3.1 Silicon Carbide MOSFET: Inversion Layer Mobility 253 9.3.2 The 4H-SiC Planar MOSFET: Experimental Results 2549.4 Summary 254 References 256
  20. 20. Contents xixChapter 10 Shielded Planar MOSFETs 25910.1 Shielded Planar MOSFET Structure 260 10.1.1 Blocking Mode 261 10.1.2 Forward Conduction 262 10.1.3 Threshold Voltage 267 10.1.4ACCUFET Structure: Threshold Voltage Simulations....27010.2 Planar Shielded Inversion-Mode MOSFET: Simulations 276 10.2.1 Blocking Characteristics 276 10.2.2On-State Characteristics 279 10.2.3 Output Characteristics 28110.3 Planar Shielded ACCUFET Structure: Simulations 282 10.3.1 Blocking Characteristics 283 10.3.2 On-State Characteristics 290 10.3.3 Output Characteristics 29510.4 Planar Shielded MOSFET Structures: Experimental Results 297 10.4.1 Silicon Carbide MOSFET: Accumulation Mobility 298 10.4.2Inversion-Mode MOSFET: Experimental Results 300 10.4.3 Accumulation-Mode MOSFET: Experimental Results....30110.5 Summary 303 References 304Chapter 11 Trench-Gate Power MOSFETs 30711.1 Trench-Gate Power MOSFET Structure 308 11.1.1 Blocking Characteristics 309 11.1.2 Forward Conduction 310 11.1.3 Threshold Voltage 31611.2 Trench-Gate Power MOSFET Structure: Simulations 318 11.2.1 Blocking Characteristics 318 11.2.2 On-State Characteristics 323 11.2.3 Output Characteristics 32511.3 Accumulation-Mode Trench-Gate Power MOSFET 32611.4 High Permittivity Gate Insulator 32811.5 Trench-Gate Power MOSFET: Experimental Results 33311.6 Summary 335 References 336
  21. 21. XX SILICON CARBIDE POWER DEVICESChapter 12 Shielded Trench-Gate Power MOSFETs 33912.1 Shielded Trench-Gate Power MOSFET Structure 340 12.1.1 Blocking Characteristics 341 12.1.2Forward Conduction 342 12.1.3 Threshold Voltage 34812.2 Shielded Trench-Gate Power MOSFET: Simulations 348 12.2.1 Blocking Characteristics 349 12.2.2 On-State Characteristics 355 12.2.3 Output Characteristics 35712.3 Shielded Trench-Gate MOSFET: Experimental Results 35812.4 Summary 360 References 361Chapter 13 Charge Coupled Structures 36313.1 Charge Coupled Silicon Carbide Structures 36413.2 Ideal Specific On-Resistance 36713.3 Charge Coupled Schottky Rectifier Structure 371 13.3.1 Blocking Characteristics 372 13.3.20n-State Characteristics 37713.4 Enhanced Charge Coupled Schottky Rectifier Structure 379 13.4.1 Blocking Characteristics 380 13.4.20n-State Characteristics 385 13.4.3 Charge Optimization 386 13.4.4Charge Imbalance 39013.5 Charge Coupled JFET Structure 394 13.5.1 Blocking Characteristics 396 13.5.20n-State Characteristics 399 13.5.3 Output Characteristics 40313.6 Shielded Charge Coupled MOSFET Structure 404 13.6.1 Blocking Characteristics 406 13.6.2 On-State Characteristics 410 13.6.3 Output Characteristics 417 13.6.4 Switching Characteristics 41813.7 Summary 421 References 422
  22. 22. Contents xxiChapter 14 Integral Diodes 42514.1 Trench-Gate MOSFET Structure 42714.2 Shielded Trench-Gate MOSFET Structure 43314.3 Planar Shielded ACCUFET Structure 43914.4 Charge Coupled MOSFET Structure 44114.5 Summary 444 References 445Chapter 15 Lateral High Voltage FETs 44715.1 Fundamental Analysis 44815.2 Lateral High Voltage Buried Junction FET Structure 45015.3 Lateral High Voltage MESFET Structure 45215.4 Lateral High Voltage MOSFET Structure 45315.5 Lateral MOSFET Structure with Field Plates 45715.6 Lateral High Voltage Shielded MOSFET Structure 46115.7 Lateral High Voltage MOSFET Structure Optimization 46515.8 Lateral HV-MOSFET Structure: Experimental Results 47115.9 Summary 472 References 474Chapter 16 Synopsis 47716.1 Typical Motor Control Application 47816.2 Motor Control Application: Silicon IGBT and P-i-N Rectifier ..48316.3 Motor Control Application: Silicon IGBT and SiC Rectifier 48616.4 Motor Control Application: SiC MOSFET and Rectifier 48816.5 Motor Control Application: Comparison of Cases 48916.6 Summary 490 References .491Index 493
  23. 23. Chapter 1 IntroductionThe increasing dependence of modern society on electrical appliances forcomfort, transportation, and healthcare has motivated great advances inpower generation, power distribution and power managementtechnologies. These advancements owe their allegiance to enhancementsin the performance of power devices that regulate the flow of electricity.After the displacement of vacuum tubes by solid state devices in the 1950s, the industry relied upon silicon bipolar devices, such as bipolarpower transistors and thyristors. Although the ratings of these devicesgrew rapidly to serve an ever broader system need, their fundamentallimitations in terms of the cumbersome control and protection circuitryled to bulky and costly solutions. The advent of MOS technology fordigital electronics enabled the creation of a new class of devices in the1970s for power switching applications as well. These silicon powerMOSFETs have found extensive use in high frequency applications withrelatively low operating voltages (under 100 volts). The merger of MOSand bipolar physics enabled creation of yet another class of devices in the1980s. The most successful innovation in this class of devices has beenthe Insulated Gate Bipolar transistor (IGBT). The high power density,simple interface, and ruggedness of the IGBT have made it thetechnology of choice for all medium and high power applications withperhaps the exception of high voltage DC transmission systems. Power devices are required for systems that operate over a broadspectrum of power levels and frequencies. In Fig. 1.1, the applicationsfor power devices are shown as a function of operating frequency. Highpower systems, such as HVDC power distribution and locomotive drives,requiring the control of megawatts of power operate at relatively lowfrequencies. As the operating frequency increases, the power ratingsdecrease for the devices with typical microwave devices handling about100 watts. All of these applications are served by silicon devices.Thyristors are favored for the low frequency, high power applications, l
  24. 24. 2 SILICON CARBIDE POWER DEVICESIGBTs for the medium frequency and power applications, and powerMOSFETs for the high frequency applications. 10" HVDC POWER DISTRIBUTION _ io 7 t 106 ELECTRIC TRAINS I UNINTERRUPTIBLE POWER SUPPLY i, 105 •B IO 4 i W FLUORESCENT LAMPS o 2 TELEVISION SWEEP ! 10 V3 CELLULAR COMMUNICATION 1 10 MICROWAVE OVEN 10° I I I I JL -U 2 3 4 s 6 7 10 10 10 10 10 10 10 108 10 System Operating Frequency (Hz) Fig. 1.1 Applications for Power Devices. Another approach to classification of applications for powerdevices is in terms of their current and voltage handling requirements asshown in Fig. 1.2. On the high power end of the chart, thyristors areavailable that can individually handle over 6000 volts and 2000 amperesenabling the control of over 10 megawatts of power by a singlemonolithic device. These devices are suitable for the HVDC powertransmission and locomotive drive (traction) applications. For the broadrange of systems that require operating voltages between 300 volts and3000 volts with significant current handling capability, the IGBT hasbeen found to be the optimum solution. When the current requirementsfall below 1 ampere, it is feasible to integrate multiple devices on asingle monolithic chip to provide greater functionality for systems suchas telecommunications and display drives. However, when the currentexceeds a few amperes, it is more cost effective to use discrete power
  25. 25. Introduction 3MOSFETs with appropriate control ICs to serve applications such asautomotive electronics and switch mode power supplies. 10 4 HVDC TRANSMISSION 10 3 ELECTRIC TRAINS I MOTOR ELECTRONICS 10 2 AUTOMOTIVE SUPPLIES DRIVES POWER 00 ROBOTICS 10 1 I LAMP BALLAST 10° u TELECOM. a U IO-1 DISPLAY DRIVES io-2 1 10 1 IO2 IO3 IO4 Voltage Rating (Volts) Fig. 1.2 System Ratings for Power Devices.1.1 Ideal and Typical Power Device CharacteristicsAlthough silicon power devices have served the industry for well overfive decades, they cannot be considered to have ideal devicecharacteristics. An ideal power rectifier should exhibit the i-vcharacteristics shown in Fig. 1.3. In the forward conduction mode, thefirst quadrant of operation the figure, it should be able to carry anyamount of current with zero on-state voltage drop. In the reverseblocking mode, the third quadrant of operation in the figure, it should beable to hold off any value of voltage with zero leakage current. Further,the ideal rectifier should be able to switch between the on-state and theoff-state with zero switching time. Actual silicon power rectifiers exhibitthe i-v characteristics illustrated in Fig. 1.4. They have a finite voltage
  26. 26. 4 SILICON CARBIDE POWER DEVICESdrop (V 0 N) when carrying current on the on-state leading to conductionpower loss. They also have a finite leakage current (IOFF) when blockingvoltage in the off-state creating power loss. In addition, the dopingconcentration and thickness of the drift region of the silicon device mustbe carefully chosen with a design target for the breakdown voltage(BV)1. The power dissipation in power devices increases when theirvoltage rating is increased due to an increase in the on-state voltage drop. ON-STATE OFF-STATE Fig. 1.3 Characteristics of an Ideal Power Rectifier. Fig. 1.4 Characteristics of a Typical Power Rectifier.
  27. 27. Introduction 5 The i-v characteristics of an ideal power switch are illustrated inFig. 1.5. As in the case of the ideal rectifier, the ideal transistor conductscurrent in the on-state with zero voltage drop and blocks voltage in theoff-state with zero leakage current. In addition, the ideal device canoperate with a high current and voltage in the active region with theforward current in this mode controlled by the applied gate bias. Thespacing between the characteristics in the active region is uniform for anideal transistor indicating a gain that is independent of the forwardcurrent and voltage. i ACTIVE ON-STATE . REGION / L / , / vG OFF-STATE / vF Fig. 1.5 Characteristics of an Ideal Transistor. The i-v characteristics of a typical power switch are illustrated inFig. 1.6. This device exhibits a finite resistance when carrying current inthe on-state as well as a finite leakage current while operating in the off-state (not shown in the figure because its value is much lower than theon-state current levels). The breakdown voltage of a typical transistor isalso finite as indicated in the figure with BV. The typical transistor canoperate with a high current and voltage in the active region. This currentis controlled by the base current for a bipolar transistor while it isdetermined by a gate voltage for a MOSFET or IGBT (as indicated in thefigure). It is preferable to have gate voltage controlled characteristicsbecause the drive circuit can be integrated to reduce its cost. The spacingbetween the characteristics in the active region is non-uniform for atypical transistor with a square-law behavior for devices operating with
  28. 28. 6 SILICON CARBIDE POWER DEVICESchannel pinch-off in the current saturation mode1. Recently, devicesoperating under a new super-linear mode have been proposed anddemonstrated for wireless base-station applications2. ACTIVE REGION Increasing Fig. 1.6 Characteristics of a Typical Transistor.1.2 Unipolar Power DevicesBipolar power devices operate with the injection of minority carriersduring on-state current flow. These carriers must be removed when theswitching the device from the on-state to the off-state. This isaccomplished by either charge removal via the gate drive current or viathe electron-hole recombination process. These processes introducesignificant power losses that degrade the power management efficiency.It is therefore preferable to utilize unipolar current conduction in a powerdevice. The commonly used unipolar power diode structure is theSchottky rectifier that utilizes a metal-semiconductor barrier to producecurrent rectification. The high voltage Schottky rectifier structure alsocontains a drift region, as show in Fig. 1.7, which is designed to supportthe reverse blocking voltage. The resistance of the drift region increasesrapidly with increasing blocking voltage capability as discussed later inthis chapter. Silicon Schottky rectifiers are commercially available withblocking voltages of up to 100 volts. Beyond this value, the on-statevoltage drop of silicon Schottky rectifiers becomes too large for practical
  29. 29. Introduction 7applications1. Silicon P-i-N rectifiers are favored for designs with largerbreakdown voltages due to their lower on-state voltage drop despite theirslower switching properties. As shown later in the book, silicon carbideSchottky rectifiers have much lower drift region resistance enablingdesign of very high voltage devices with low on-state voltage drop. SCHOTTKY CONTACT METAL (ANODE) Y////SSSSSSA DRIFT REGION SUBSTRATE V//////////A OHMIC CONTACT METAL (CATHODE) Fig. 1.7 The Power Schottky Rectifier Structure and its Equivalent Circuit. The most commonly used unipolar power transistor is the siliconpower Metal-Oxide-Semiconductor Field-Effect-Transistor or MOSFET.Although other structures, such as JFETs or SITs have been explored3,they have not been popular for power electronic applications because oftheir normally-on behavior. The commercially available silicon powerMOSFETs are based upon the structures shown in Fig. 1.8. The D-MOSFET was first commercially introduced in the 1970s and contains aplanar-gate structure. The P-base region and the N+ source regions areself-aligned to the edge of the Polysilicon gate electrode by using ion-implantation of boron and phosphorus with their respective drive-inthermal cycles. The n-type channel is defined by the difference in thelateral extension of the junctions under the gate electrode. The devicesupports positive voltage applied to the drain across the P-base/N-driftregion junction. The voltage blocking capability is determined by thedoping and thickness of the drift region. Although low voltage (< 100 V)silicon power MOSFET have low on-resistances, the drift region
  30. 30. SILICON CARBIDE POWER DEVICESresistance increases rapidly with increasing blocking voltage limiting theperformance of silicon power MOSFETs to below 200 volts. It iscommon-place to use the Insulated Gate Bipolar Transistors (IGBT) forhigher voltage designs. D-MOSFET U-MOSFET SOURCE SOURCE GATE W£3%$& N+ Z7 N-DRIFT REGION N-DRIFT REGION N+ SUBSTRATE N+ SUBSTRATE V////////////A DRAIN V////////////A DRAIN Fig. 1.8 Silicon Power MOSFET Structures. The silicon U-MOSFET structure became commerciallyavailable in the 1990s. It has a gate structure embedded within a trenchetched into the silicon surface. The N-type channel is formed on the side-wall of the trench at the surface of the P-base region. The channel lengthis determined by the difference in vertical extension of the P-base and N"1"source regions as controlled by the ion-implant energies and drive timesfor the dopants. The silicon U-MOSFET structure was developed toreduce the on-state resistance by elimination of the JFET componentwithin the D-MOSFET structure1.1.3 Bipolar Power DevicesThe commonly available silicon power bipolar devices are the bipolartransistor and the gate turn-off thyristor or GTO. These devices wereoriginally developed in the 1950s and widely used for power switchingapplications until the 1970s when the availability of silicon power
  31. 31. Introduction 9MOSFETs and IGBTs supplanted them. The structures of the bipolartransistor and GTO are shown in Fig. 1.9. In both devices, injection ofminority carriers into the drift region modulates its conductivity reducingthe on-state voltage drop. However, this charge must be subsequentlyremoved during switching resulting in high turn-off power losses. Thesedevices require a large control (base or gate) current which must beimplemented with discrete components leading to an expensive bulkysystem design. Bipolar Transistor GTO BASE EMITTER GATE CATHODE i mm P N+ N-DRIFT REGION N-DRIFT REGION N+ SUBSTRATE P+ SUBSTRATE W//////////A COLLECTOR ///////////A ANODE Fig. 1.9 Silicon Bipolar Device Structures. Several groups have worked on the development of bipolartransistors4,56,7 and GTOs8,9 using silicon carbide. The large junctionpotential for silicon carbide results in a relatively high on-state voltagedrop for these devices when compared with commercially availablesilicon devices. For this reason, the focus of this book is on unipolarsilicon carbide structures.1.4 MOS-Bipolar Power DevicesThe most widely used silicon high voltage (>300 volt) device for powerswitching applications is the Insulated Gate Bipolar Transistor (IGBT)
  32. 32. 10 SILICON CARBIDE POWER DEVICESwhich was developed in the 1980s by combining the physics of operationof bipolar transistors and MOSFETs10. The structure of the IGBT isdeceptively similar to that for the power MOSFET as shown in Fig. 1.10if viewed as a mere replacement of the N+ substrate with a P + substrate.This substitution creates a four-layer parasitic thyristor which can latchup resulting in destructive failure due to loss of gate control. Fortunatelythe parasitic thyristor can be defeated by the addition of the P+ regionwithin the cell1. The benefit of the P+ substrate is the injection ofminority carriers into the N-drift region resulting in greatly reducing itsresistance. This has enabled the development of high voltage IGBTproducts with high current carrying capability. D-MOS IGBT U-MOS IGBT EMITTER EMITTER GATE N-DRIFT REGION N-DRIFT REGION P+SUBSTRATE P+ SUBSTRATE V/////////////A Y/////////////A COLLECTOR COLLECTOR Fig. 1.10 IGBT Device Structures. The development of the IGBT in silicon carbide has beenanalyzed and attempted by a few research groups111213. The largejunction potential and high resistance of the P+ substrate for siliconcarbide results in a relatively high on-state voltage drop for these deviceswhen compared with commercially available silicon devices. Theirswitching speed is also compromised by the injected stored charge in theon-state. For these reasons, silicon carbide based IGBTs are notdiscussed in this book.
  33. 33. Introduction 111.5 Ideal Drift Region for Unipolar Power DevicesThe unipolar power devices discussed above all contain a drift regionwhich is designed to support the blocking voltage. The properties(doping concentration and thickness) of the ideal drift region can beanalyzed by assuming an abrupt junction profile with high dopingconcentration on one side and a low uniform doping concentration on theother side, while neglecting any junction curvature effects by assuming aparallel-plane configuration. The resistance of the ideal drift region canthen be related to the basic properties of the semiconductor material14. ANODE ELECTRIC FIELD V///////////A DRIFT REGION Wn SUBSTRATE Y//////////M CATHODE Fig. 1.11 The Ideal Drift Region and its Electric Field Distribution. The solution of Poissons equation leads to a triangular electricfield distribution within a uniformly doped drift region1 with the slope ofthe field profile being determined by the doping concentration. Themaximum voltage that can be supported by the drift region is determinedby the maximum electric field (Em) reaching the critical electric field (Ec)for breakdown for the semiconductor material. The critical electric fieldfor breakdown and the doping concentration then determine themaximum depletion width (WD). The specific resistance (resistance per unit area) of the ideal driftregion is given by:
  34. 34. 12 SILICON CARBIDE POWER DEVICES ( wD on.sp [1.1] W„ND.Since this resistance was initially considered to be the lowest valueachievable with silicon devices, it has historically been referred to as theideal specific on-resistance of the drift region. More recent introductionof the charge-coupling concept, described later in this chapter, hasenabled reducing the drift region resistance of silicon devices to belowthe values predicted by this equation. The depletion width underbreakdown conditions is given by: WD=-— [1.2] E cwhere BV is the desired breakdown voltage. The doping concentration inthe drift region required to obtain this breakdown voltage is given by: s ND = c [ 1.3] D 2.q.BVCombining these relationships, the specific resistance of the ideal driftregion is obtained: 4BV2 "on-ideal ~ ^3 *• * £ S^n^CThe denominator of this equation (es.|i.n-Ec3) is commonly referred to asBaligas Figure of Merit for Power Devices. It is an indicator of theimpact of the semiconductor material properties on the resistance of thedrift region. The dependence of the drift region resistance on the mobility(assumed to be for electrons here because in general they have highermobility values than for holes) of the carriers favors semiconductors suchas Gallium Arsenide. However, the much stronger (cubic) dependence ofthe on-resistance on the critical electric field for breakdown favors wideband gap semiconductors such as silicon carbide. The critical electricfield for breakdown is determined by the impact ionization coefficientsfor holes and electrons in semiconductors as discussed in the nextchapter. The change in the specific on-resistance for the drift region withcritical electric field and mobility is shown in Fig. 1.12 for the case of abreakdown voltage of 1000 volts. The location of the properties for
  35. 35. Introduction 13silicon, gallium arsenide, and silicon carbide are shown in the figure bythe points. The improvement in drift region resistance for GaAs incomparison with silicon is largely due to its much greater mobility forelectrons. The improvement in drift region resistance for SiC incomparison with silicon is largely due to its much larger critical electricfield for breakdown. Based upon these considerations, excellent highvoltage Schottky rectifiers were developed from GaAs in the 1980s15.Much greater improvement in performance is clearly indicated for siliconcarbide devices which is the subject of this book. 10 1 I I I I I I I I I I Breakdown Voltage = 1000 V 10° fcSi | 10-1 ^ = 1000 cm2/Vs M obility I I I I I u Gc I A S ^ c 10-2 - Mobility = 2000 c m W s a 10 "to 10-3 0) SiC a. _ Mobility = 4000 cm2/V S c 10-« O I I I I I ! o IE Mobility = 8000 cm2/Vs 5 10-5 o Q. 10"6 10 5 10 6 W Critical Electric Field for Breakdown (V/cm) Fig. 1.12 Specific On-Resistance of the Ideal Drift Region.1.6 SummaryThe motivation for the development of silicon carbide unipolar deviceshas been reviewed in this chapter. Although excellent unipolar siliconSchottky rectifiers and power MOSFETs are commercially availablewith breakdown voltages below 200 volts, the resistance of their driftregion increases rapidly at higher breakdown voltages producingsignificant power losses in applications. This problem can be overcomeusing silicon carbide based unipolar devices.
  36. 36. 14 SILICON CARBIDE POWER DEVICESReferences1 B.J. Baliga, "Power Semiconductor Devices", PWS PublishingCompany, 1996.2 B. J. Baliga, "Silicon RF Power Devices", World Scientific Press,2005.3 B. J. Baliga, "Modern Power Devices", John Wiley and Sons, 1987.4 E. Danielsson, et al, "Extrinsic base design of SiC bipolar transistors",Silicon Carbide and Related Materials, pp. 1117-1120, 2003.5 I. Perez-Wurfll, et al, "Analysis of power dissipation and hightemperature operation in 4H-SiC Bipolar Junction Transistors", SiliconCarbide and Related Materials, pp. 1121-1124, 2003.6 J. Zhang, et al, "High Power (500V-70A) and High gain(44-47) 4H-SiC Bipolar Junction Transistors", Silicon Carbide and RelatedMaterials, pp. 1149-1152, 2003.7 A. Agarwal, et al, "SiC BJT Technology for Power Switching and RfApplications", Silicon Carbide and Related Materials 2003, pp. 1141- 1144,2004.8 P. Brosselard, et al, "Influence of different peripheral protections onthe breakover voltage of a 4H-SiC GTO thyristor", Silicon Carbide andRelated Materials, pp. 1129-1132, 2003.9 A.K. Agarwal, et al, "Dynamic Performance of 3.1 kV 4H-SiCAsymmetrical GTO Thyristors", Silicon Carbide and Related Materials,pp.1349-1352, 2003.10 B. J. Baliga, "Evolution of MOS-Bipolar Power SemiconductorTechnology", Proceedings of the IEEE, pp. 409-418, 1988.11 T.P. Chow, N. Ramaungul, and M. Ghezzo, "Wide BandgapSemiconductor Power devices", Materials Research Society Symposium,Vol. 483, pp. 89-102, 1998.12 R. Singh, "Silicon Carbide Bipolar power Devices - Potentials andLimits", Materials Research Society Symposium, Vol. 640, pp. H4.2.1-12, 2001.13 J. Wang, et al, "Comparison of 5kV 4H-SiC N-channel and P-channelIGBTs", Silicon Carbide and Related Materials, pp. 1411-1414, 2000.14 B. J. Baliga, "Semiconductors for High Voltage Vertical ChannelField Effect Transistors", J. Applied Physics, Vol. 53, pp. 1759-1764,1982.15 B. J. Baliga, et al, "Gallium Arsenide Schottky Power Rectifiers",IEEE Transactions on Electron Devices, Vol. ED-32, pp. 1130-1134,1985.
  37. 37. Chapter 2 Material Properties and TechnologyIn the previous chapter, it was demonstrated the resistance of the driftregion in unipolar vertical power devices is strongly dependent upon thefundamental properties of the semiconductor material. In this chapter, themeasured properties for silicon carbide are reviewed and compared withthose for silicon. These properties are then used to obtain otherparameters (such as the built-in potential) which are relevant to theanalysis of the performance of devices discussed in the rest of the book.The discussion is constrained to the 4H poly-type of silicon carbidebecause its properties are superior to those reported for the 6H poly-type.The parameters given in this chapter were used during two-dimensionalnumerical simulations to determine the characteristics of various devicesdiscussed in this book. Data on the 6H poly-type is sometimes includedto demonstrate the reasons that the 4H poly-type is preferred for powerdevice structures. The 4H-SiC material is commercially available fromseveral sources for the development and manufacturing of power devicesbecause of its superior properties. Manufacturers are continuallyreducing the micropipe density in this material while increasing thediameter of commercially available wafers. The second portion of this chapter provides a review of thetechnology developed for the fabrication of silicon carbide powerdevices. One of the advantages of silicon carbide is that, unlike galliumarsenide, its processing is compatible with silicon devices without theproblem of contamination of production lines. It is advantageous toimplement any available silicon process technologies, such as ion-implantation or reactive ion etching, to the fabrication of silicon carbidedevices. This approach has been generally successful with the exceptionof the need to anneal the implants at much higher temperatures.Empirical studies performed on the oxidation and passivation of thesilicon carbide surface, as well those on the formation of metal-contacts,are also reviewed in this portion of the chapter. 15
  38. 38. 16 SILICON CARBIDE POWER DEVICES2.1 Fundamental PropertiesThis section provides a summary of the fundamental properties of siliconcarbide1,2,3 and compares them with those for silicon4. Only theproperties for the 4H poly-type have been included here as discussedabove. The basic properties of relevance to power devices are the energyband gap, the impact ionization coefficients, the dielectric constant, thethermal conductivity, the electron affinity, and the carrier mobility. Sincethe intrinsic carrier concentration and the built-in potential can beextracted by using this information, their values have also beencomputed and compared with those for silicon in this section. Properties Silicon 4H-SiC Energy Band Gap 1.10 3.26 (eV) Relative Dielectric 11.7 9.7 Constant Thermal Conductivity 1.5 3.7 (W/cm K) Electron Affinity 4.05 3.7 (eV) Density of States Conduction Band 2.80 x 1019 1.23 x 101 (cm"3) Density of States Valence Band 1.04 x 101 4.58 x 1018 (cm"3) Fig. 2.1 Fundamental Material Properties.
  39. 39. Material Properties and Technology 172.1.1 Energy Band GapThe energy band gap of silicon carbide is much larger than that forsilicon allowing its classification as a wide band gap semiconductor. Theband gap for 4H-SiC is 3.26 eV, which is 3 times larger than that forsilicon. The band gap for 6H-SiC of 3.0 eV is slightly smaller. Since alarger band gap results in a smaller generation of carriers in the depletionregions of devices, it is favorable for reducing the leakage current ofdevices which utilize P-N junctions to support voltages. The larger bandgap is also favorable for producing Metal-Semiconductor contacts withlarger Schottky barrier heights. This enables reduction of the leakagecurrent in Schottky rectifiers and MESFETs. The intrinsic carrier concentration is determined by the thermalgeneration of electron hole pairs across the energy band gap of asemiconductor. Its value can be calculated by using the energy band gap(EG) and the density of states in the conduction (Nc) and valence (N v )bands: n. = ^ = pc.Nve-(Eo2kT) [ 2.1]where k is Boltzmanns constant (1.38 x 10"23 J/°K) and T is the absolutetemperature. For silicon, the intrinsic carrier concentration is given by: n, = 3.87xl0 1 6 r 3 , V ( ™ 2 * 1 ° 3 ) / 7 [2.2]while that for 4H-SiC, it is given by: n, = 1 . 7 0 x l 0 1 6 r 3 / V ( 2 0 8 * l o V r [2.3]Using these equations, the intrinsic carrier concentration can becalculated as a function of temperature. The results are plotted in Fig. 2.2and Fig. 2.3. The traditional method for making this plot is shown in Fig.2.2 by using an inverse temperature scale for the x-axis. The additionalFig. 2.3 is provided here because it is easier to relate the value of theintrinsic carrier concentration to the temperature with it plotted on the x-axis. It is obvious that the intrinsic carrier concentration for siliconcarbide is far smaller than for silicon due to the large difference in bandgap energy. At room temperature (300°K), the intrinsic carrierconcentration for silicon is 1.4 x 1010 cm"3 while that for 4H-SiC is only6.7 x 1 0 " cm 3 . This demonstrates that the bulk generation current isnegligible for the determination of the leakage current in silicon carbide
  40. 40. 18 SILICON CARBIDE POWER DEVICESdevices. Surface generation currents may be much larger due to thepresence of states within the band gap. <5i * • I 4H-SIC V * • . 6H •SiC ^^^ * *» ^^^ * ^^ * 1.0 1.5 2.0 2.5 3.0 3.5 4.0 1000/Temperature (1/K) Fig. 2.2 Intrinsic Carrier Concentration. ^-—" . *•- -** Si , " ».- ^ 1 —* 6H- SiC . ,* ^ 4 H SiC * * ^^ • > 300 350 400 450 500 550 600 650 700 Temperature (K) Fig. 2.3 Intrinsic Carrier Concentration.
  41. 41. Material Properties and Technology 19 For silicon, the intrinsic carrier concentration becomes equal to atypical doping concentration of 1 x 1015 cm3 at a relatively lowtemperature of 540 °K or 267 °C. In contrast, the intrinsic carrierconcentration for 4H-SiC is only 3.9 x 107 cm"3 even at 700 °K or 427 °C.The development of mesoplasmas has been associated with the intrinsiccarrier concentration becoming comparable to the doping concentration5.Mesoplasmas create current filaments that have very high current densityleading to destructive failure in semiconductors. This is obviously muchless likely in silicon carbide. The built-in potential of P-N junctions can play an important rolein determining the operation and design of power semiconductor devices.As an example, the built-in potential determines the zero-bias depletionwidth which is important for calculation of the on-resistance in powerDMOSFETs. It has a strong impact on the on-state voltage drop in JBSrectifiers, and is an important parameter used for the design of normally-off accumulation mode MOSFETs. These structures are discussed indetail later in the book. The built-in voltage is given by: l y Auy D y«=—In [2.4]where NA" and ND+ are the ionized impurity concentrations on the twosides of an abrupt P-N junction. For silicon, their values are equal to thedoping concentration because of the small dopant ionization energylevels. This does not apply to silicon carbide because of the much largerdopant ionization levels as discussed later in this chapter. The calculated built-in potential is shown in Fig. 2.4 as afunction of temperature for a typical operating range for power devices.In making the plots, the product (NA".ND+) was assumed to be 1035 cm"6.This would be applicable for a typical doping concentration of 1 x 1019cm"3 on the heavily doped side of the junction and 1 x 1016 cm3 on thelightly doped side of the junction. The built-in potential for siliconcarbide is much larger than that for silicon due to the far smaller valuesfor the intrinsic carrier concentration. This can be a disadvantage due tothe larger zero bias depletion width for silicon carbide as shown later inthe chapter. As an example, the larger zero bias depletion widthconsumes space within the D-MOSFET cell structure increasing the on-resistance by constricting the area through which current can flow. Incontrast, the larger built-in potential for SiC and its associated larger zerobias depletion width can be taken advantage of in making innovative
  42. 42. 20 SILICON CARBIDE POWER DEVICESdevice structures, such as the ACCUFET, that are tailored to the uniqueproperties of SiC. — i > 4H-SiC 3.0 6H-SiC 1 OH 2.0 •a C Si .9 250 300 350 400 450 500 550 600 650 Temperature (K) Fig. 2.4 Built-in Potential for a P-N Junction in Si and SiC. 102 g 10 I 10° 4H-SiC Si 10 i io-2 10" 1014 10" 10" 10" Doping Concentration (cm"3) Fig. 2.5 Zero-Bias Depletion Width in Si and SiC. The calculated zero bias depletion width is shown in Fig. 2.5 as afunction of the doping concentration on the lightly doped side of the
  43. 43. Material Properties and Technology 21abrupt P-N junction. For the case of silicon, three lines are given for300°K, 400°K and 500°K with largest depletion width corresponding tothe lowest temperature. For silicon carbide, the lines for thesetemperatures are very close to each other. For both silicon and siliconcarbide, it can be seen that the zero bias depletion width can besubstantial in size at low doping concentrations making it important totake this into account during device design and analysis. The zero biasdepletion width for SiC is much (about 2x) larger than for silicon for thesame doping concentration. However, it is worth noting that the dopingconcentration in SiC is also much greater for a given breakdown voltagethan for silicon as discussed later in the chapter.2.1.2 Impact Ionization CoefficientsThe main advantage of wide band gap semiconductors for power deviceapplications is the greater breakdown voltage capability of thesematerials. The higher breakdown voltage for these materials is associatedwith the reduced impact ionization coefficients at any given electric fieldwhen compared with silicon. The impact ionization coefficients forsemiconductors is dictated by Chynoweths Law67: a = a.eb/E [2.5]where E is the electric field component in the direction of current flow.The parameters a and b are constants that depend upon thesemiconductor material and the temperature. For silicon, the impactionization rate is much larger for electrons than for holes. However, forsilicon carbide the opposite has been found to hold true. For silicon, theimpact ionization rates have been measured as a function of electric fieldand temperature489. The data can be modeled by using a = 7 x 105 percm and b = 1.23 x 106 V/cm at room temperature10. The impact ionization coefficients for silicon carbide have beenrecently measured as a function of temperature by using an electronbeam excitation method". This method allowed extraction of impactionization rates in defect free regions of the material by isolating diodescontaining defects with an EBIC (Electron Beam induced Current)image. This was important because substantially enhanced impactionization rates were discovered when the measurements were conductedat defect sites12. For defect free material, the extracted values for theimpact ionization coefficient parameters for holes in 4H-SiC were foundto be:
  44. 44. 22 SILICON CARBIDE POWER DEVICES a(4H - SiC) = 6.46*10 6 - 1.07;cl04:r [ 2.6]with b(4H-SiC) = 1.15x10" [2.7]while for 6H-SiC: a(6H - SiC) = 4.6*10 6 - lAxlQ3 T [ 2.8]with b(6H-SiC) = l.5xl01 [2.9] 104 ^ / ~/ T Si 103 / - B •B 4H-SiC 10* 10 105 106 10 Electric Field (V/cm) Fig. 2.6 Impact Ionization Coefficients in 4H-SiC and Silicon. The impact ionization coefficients for 4H-SiC can be comparedwith those for silicon in Fig. 2.6. This behavior was incorporated in theanalytical models used for two-dimensional numerical simulations ofdevice structures discussed later in the book. It can be seen that the onsetof significant generation of carriers by impact ionization occurs at muchlarger electric fields in 4H-SiC when compared with silicon. As aconsequence, breakdown in 4H-SiC devices occurs when the electricfields are in the range of 2-3 x 106 V/cm - an order of magnitude largerthan that for silicon. This implies a much larger critical electric field Ec
  45. 45. Material Properties and Technology 23for breakdown for 4H-SiC resulting in a big increase in the BaligasFigure of Merit. The critical electric field for breakdown is discussed inmore detail in the next chapter.2.1.3 Electron MobilityThe mobility for electrons is larger than that for holes in silicon carbide.It is therefore favorable to make unipolar devices using N-type driftregions rather than P-type drift regions. The conductivity of the driftregion is given by: 1 Pn = [2.10] WnNDwhere ^ n by the mobility for electrons which is a function of dopingconcentration (ND) and temperature (T). 1600 1400 1200 1000 1 s o u i 3 1015 10" 10" 1018 10" -3 Doping Concentration (cm ) Fig. 2.7 Bulk Mobility for Electrons in 4H-SiC and Silicon. For silicon, the measured data13 for mobility of electrons at roomtemperature as a function of the doping concentration can be modeledby:
  46. 46. 24 SILICON CARBIDE POWER DEVICES ,„. x 5.1(M0 1 8 +92A^ 9 1 [2.11] 3.15xl015 +N 0.91For silicon carbide, the mobility of electrons at room temperature as afunction of the doping concentration can be modeled by3: 4.05X1013 + 20N°D61 jUn(4H-SiC) = [2.12] 3.55xl0 lu + Nr0.61This behavior has also been theoretically modeled taking into accountacoustic and polar optical phonon scattering as well as intervalleyscattering14. The electron mobility at room temperature is plotted in Fig.2.7 as a function of doping concentration for silicon and silicon carbide.In both cases, the mobility decreases with increasing doping due toenhanced Coulombic scattering of electrons by the ionized donors. Thisbehavior was incorporated in the analytical models used for two-dimensional numerical simulations of device structures discussed later inthe book. 1600 1400 1200 1000 800 Si o 600 s c 400 4H-SiC o w 200 300 400 500 Temperature (°K) Fig. 2.8 Bulk Mobility for Electrons in 4H-SiC and Silicon. The mobility decreases in semiconductors with increasingtemperature due to enhanced phonon scattering. This holds true for
  47. 47. Material Properties and Technology 25silicon and 4H-SiC as shown in Fig. 2.8. For silicon, the temperaturedependence of the mobility at low doping concentrations can be modeledby15: ( T V2-42 //„ (Si) = 1360 [2.13] 300For 4H-SiC, the temperature dependence of the mobility at low dopingconcentrations can be modeled by3: . -2.70 / Mn(4H-SiC) = U40 [2.14] 300,This behavior was also incorporated in the analytical models used fortwo-dimensional numerical simulations of device structures discussedlater in the book. The variation of the mobility with temperature is shownin the above figure only up to 500 °K (227 °C). Although there isconsiderable interest in the performance of silicon carbide devices atmuch higher temperatures due to its wide band gap structure, theoperation of devices above 500 °K is problematic due to degradation ofthe ohmic contacts and the surface passivation.2.2 Other Properties Relevant to Power DevicesIn this section, other properties for 4H-SiC are provided, which arerequired for the analysis of power device structures. These properties arecompared with those for silicon whenever it is pertinent.2.2.1 Donor and Acceptor Ionization Energy LevelsIn silicon, the donor and acceptor ionization energy is small (50 meV)allowing the assumption that all the donors and acceptor impurities in thelattice are completely ionized at room temperature as well as at highertemperatures. This is not a valid assumption for silicon carbide due to therelatively larger ionization energies for donors and acceptors. The mostcommonly used donor in 4H-SiC is nitrogen which occupies Carbon sitesin the lattice. Its ionization energy is reported to be about 100 meV . Tocreate p-type 4H-SiC, the most commonly used acceptor impurity isAluminum with an ionization energy of about 200 meV1. At above roomtemperature, the ionized donor concentration is over ninety percent
  48. 48. 26 SILICON CARBIDE POWER DEVICESallowing the approximation that the electron concentration is equal to thedonor concentration when calculating the resistivity of drift regions.2.2.2 Recombination LifetimesIn silicon, high voltage devices are designed to operate with the injectionof minority carriers into the drift region to reduce its resistivity by theconductivity modulation phenomenon10. The recombination of holes andelectrons plays an important role in determining the switching speed ofthese structures. The recombination process can occur from band-to-bandbut is usually assisted by the presence of deep levels in the band gap. Thedeep levels can also produce leakage current during reverse blocking inpower devices by the generation of carriers in the depletion region. As already pointed out, for silicon carbide, it is appropriate toonly consider unipolar devices for power switching applications. This isfortunate because the lifetime values reported for this material isrelatively low (10 9 to 10"7 seconds)3. This is consistent with diffusionlengths of between 1 and 2 microns measured by using the EBICtechnique16. It is likely that these low lifetime and diffusion lengths areassociated with surface recombination. The performance of bipolardevices made from 4H-SiC, such as high voltage P-i-N rectifiers,indicates that higher values of bulk lifetime are applicable17. However,the large on-state voltage drop and slow switching speed of these devicesmakes them much less attractive for applications than unipolar devices.2.2.3 Metal-Semiconductor ContactsContacts to power devices are made by using metal films deposited onthe surface of its semiconductor layers. A common requirement is tomake ohmic contacts to n-type and p-type regions. This can be achievedby using a metal-semiconductor contact with low barrier height and ahigh doping concentration in the semiconductor to promote tunnelingcurrent across the contact. For metal-semiconductor contacts with highdoping level in the semiconductor, the contact resistance determined bythe tunneling process is dependent upon the barrier height and the dopinglevel18:
  49. 49. Material Properties and Technology 27In order to take full advantage of the low specific on-resistance of thedrift region in silicon carbide devices, it is important to obtain a specificcontact resistance that is several orders of magnitude smaller than that ofthe drift region. This is also necessary because the contact areas are oftenonly a small fraction (less than 10 percent) of the active area of mostpower device structures. Typically, specific contact resistances of lessthan 1 x 10"5 ohm-cm 2 are desirable to n-type regions. 0.8 eV io-1 u a S 3 -1 io- 0.6 eV i io-! 0.4 eV !7J io-7 10" 10 2 0 3 Surface Doping Concentration (cm ) Fig. 2.9 Specific Resistance at Metal-Semiconductor Contacts. The specific contact resistance calculated using the aboveformula is plotted in Fig. 2.9 as a function of the doping concentrationusing the barrier height as a parameter. Unfortunately, the barrier heightsof metal contacts to silicon carbide tend to be large due to its wide bandgap. From the figure, it can be concluded that a specific contactresistance of 1 x 10"5 ohm-cm 2 can be obtained for a dopingconcentration of 5 x IO19 cm"3 if the barrier height is 0.6 eV. Such highsurface doping concentrations can be achieved for N-type 4H-SiC byusing hot-implantation of nitrogen, phosphorus or arsenic followed byappropriate high temperature annealing 19 . Ohmic contacts with specificresistances of less than IO"6 Ohm-cm 2 have been reported to ion-implanted layers by using nickel and titanium .
  50. 50. 28 SILICON CARBIDE POWER DEVICES Metal-semiconductor contacts can also be used to make Schottkybarrier rectifiers with high breakdown voltages by using silicon carbide.In this case, it is advantageous to have a relatively large barrier height toreduce the leakage current. The commonly used metals for formation ofSchottky barriers to 4H-SiC are Titanium and Nickel. The barrier heightsmeasured for these contacts range from 1.10 to 1.25 eV for Titanium and1.30 to 1.60 eV for Nickel21,2223. The use of these metals to fabricate highvoltage device structures is discussed in subsequent chapters of the book.2.3 Fabrication TechnologyDue to the substantial infrastructure available to fabricate silicon devices,it is advantageous to manufacture silicon carbide devices using the sametechnology platform. During the last fifteen years of research, it has beenestablished that silicon carbide devices can be fabricated using the sameequipment used for silicon devices in most instances. However, it hasbeen found that much higher temperatures are needed for the annealingof ion implanted regions in silicon carbide to activate the dopants andremove the damage. In addition, the design of device structures in siliconcarbide requires giving special consideration to the low diffusioncoefficients for impurities. These unique issues are discussed in thissection of the chapter.2.3.1 Diffusion Coefficients and Solubility of DopantsIn silicon power devices, it is common-place to drive the dopants afterion-implantation to increase the junction depth. The widely used double-diffused (DMOS) process for silicon power MOSFETs utilizes thedifference in the junction depth of the P-base and N* source regions todefine the channel length without relying upon high resolutionlithography to achieve sub-micron dimensions10. In silicon carbide, thediffusion coefficients are very small even at relatively hightemperatures1. For nitrogen - the commonly used N-type dopant, theeffective diffusion coefficient is reported as 5 x 10"12 cm2/s even at 2450°C. For aluminum - the commonly used P-type dopant, the effectivediffusion coefficient is reported as 3 x 10"14 to 6 x 10"12 cm2/s even at1800 - 2000 °C. Due to the on-set of dissociation at these temperatureswith attendant generation of defects, it is not practical to drive dopants insilicon carbide after ion implantation. The design of power device
  51. 51. Material Properties and Technology 29structures in silicon carbide must take this limitation in processtechnology into account. The solid solubility of dopants in silicon carbide has beenreported to be comparable to that for dopants in silicon1. For nitrogen andaluminum, the solubility is in excess of 1 x 1020 cm"3. Ion implantednitrogen24 and aluminum25 doped layers have been formed with impurityconcentrations ranging from 1 x 1019 cm"3 to 1 x 1020 cm"3. These valuesare sufficient for the fabrication of most high voltage power devicestructures.2.3.2 Ion Implantation and AnnealingA significant body of literature has developed on the ion implantation ofimpurities into silicon carbide and the subsequent annealing process toactivate the dopants and remove lattice damage. The reader should referto the proceeding of the conferences on Silicon Carbide and RelatedMaterials for an abundance of information on this topic. Although room temperature ion implantation can be successful,it has been found that hot-implantation produces a higher degree ofimpurity activation and a smaller number of defects. The hot-implantsare usually performed in the 500 °C range followed by anneals performedat between 1200 and 1600 °C. At above 1600 °C, degradation of thesilicon carbide surface is observed due to sublimation or evaporation19,25.The surface degradation can be mitigated by using a graphite boat to hostthe implanted wafer with another silicon carbide wafer placed on top(proximity anneals)26.2.3.3 Gate Oxide FormationSilicon bipolar power devices, such as the bipolar power transistor andthe gate turn-off thyristor (GTO), were supplanted with MOS-gateddevices in the 1980s. The silicon power MOSFET replaced the bipolartransistor for lower voltage (< 200 V) applications while the IGBTreplaced bipolar transistors and GTOs for high voltage (>200V)applications. The main advantage of these MOS-gated devicearchitectures was voltage controlled operation which greatly simplifiedthe control circuit making it amenable to integration10. This feature mustbe extended to silicon carbide power devices to make them attractivefrom an applications perspective.
  52. 52. 30 SILICON CARBIDE POWER DEVICES The issues that must be considered for the gate dielectric inMOS-gated silicon carbide devices are the quality of the oxide-semiconductor interface and the ability of the oxide to withstand higherelectric fields than within silicon devices27. The quality of the oxide-semiconductor interface determines not only the channel mobility butimpacts the threshold voltage of the devices. The electric field in theoxide is related to the electric field in the semiconductor by GausssLaw: E«= — EMl~3Eiml [2.16]In silicon, the maximum electric field at breakdown is in the 3 x 105V/cm range. Consequently, the maximum electric field in the oxideremains well below its breakdown field strength of 107 V/cm. In contrast,the maximum electric field for breakdown in silicon carbide is in the 3 x 106 V/cm range. Consequently, the electric field in the oxide canapproach its breakdown strength and easily exceed a field of 3 x 106V/cm, which is considered to be the threshold for reliable operation. Oneapproach to overcome this problem is to use gate dielectric material witha larger permittivity2829. In these references, it has been theoreticallyshown that the specific on-resistance can be reduced by an order ofmagnitude by using high dielectric constant gate material. A permittivityof about 15 (versus 3.85 for silicon dioxide) was found to be adequate forallowing full use of the high electric field strength for breakdown insilicon carbide without problems with unacceptably high oxide electricfields. One example of such a dielectric is zirconium oxide30. A second approach utilizes improved device structuralarchitecture to screen the gate dielectric from the high electric fieldswithin the silicon carbide. This is discussed in detail in the chapters onshielded planar and shielded trench gate MOSFETs in this book. Suchdevices can then be made using silicon dioxide whose properties are wellunderstood. In this case, the silicon dioxide can be either grown by thethermal oxidation of silicon dioxide or by the formation of the oxideusing chemical vapor deposition processes. Many studies on both ofthese techniques are available in the literature. The thermal oxidation of SiC has been reviewed in the literatureand the growth rate of the oxide has been compared with that on siliconsurfaces31. Some selected data is shown in Fig. 2.10 to illustrate the muchlower growth rate of thermal oxide on SiC when compared with siliconfor both dry and wet oxidation conditions. The data shown in this figure

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