Reflections on COTS in Avionics/Vetronics The Use of COTS Assemblies in Harsh Environment Two-Level Maintenance Systems – May 12 th , 2005 James A. Robles, Senior Technical Fellow The Boeing Company Phn: (206) 655-9062 Email: [email_address] BOE 042105-077

Context – The Environment Changed We Won the Cold War Control of the Electronics Industry Acquisition Reform New Generation of Users 1994 Perry Memo Streamline procurement of reduce cycle time and cost Strengthen technology/industrial base Increased access to advanced technologies Move away from the military specification system Not My Generation Better educated and more aware of technology Not willing to tackle a difficult job with obsolete hardware Useful life reduced to correspond to desired technology refresh cycle Defense Outlays As a Share of Gross Domestic Product 2 4 6 8 10 12 50 60 70 80 90 00 3.0 GDP (%) 4.4 4.7 11.9% 9.1% 6.3% Year

1994 Perry Memo

Streamline procurement of reduce cycle time and cost

Strengthen technology/industrial base

Increased access to advanced technologies

Move away from the military specification system

Not My Generation

Better educated and more aware of technology

Not willing to tackle a difficult job with obsolete hardware

Useful life reduced to correspond to desired technology refresh cycle

What My Customers Require on Advanced Fighters, Helicopters, and Ground Vehicles Minimize Total Ownership Cost (TOC) Development Cost Unit Recurring Flyaway (URF) Cost Operation and Support (O&S) Cost High functional density to minimize weight and volume Thermal density (watts/cm) Perform reliably in harsh environment Reduce thermal strains to improve inherent reliability Uniformity of temperature distribution across module Exposure to coolant Complexity Compatibility with two-level maintenance Facilitate insertion of new technology and mitigation of component obsolescence Thermal margin

Minimize Total Ownership Cost (TOC)

Development Cost

Unit Recurring Flyaway (URF) Cost

Operation and Support (O&S) Cost

High functional density to minimize weight and volume

Thermal density (watts/cm)

Perform reliably in harsh environment

Reduce thermal strains to improve inherent reliability

Uniformity of temperature distribution across module

Exposure to coolant

Complexity

Compatibility with two-level maintenance

Facilitate insertion of new technology and mitigation of component obsolescence

Thermal margin

Obstacles to Wider Usage of Available COTS Low Functional Density Current standards do not meet the need IEEE 1101.1 Air Cooled IEEE 1101.2 Conduction Cooled Not Compatible with Two-Level Maintenance Requires an ESD protected connector and covers for handling protection Two to three times O&S cost penalty F/A-22 example Lack of a Standard for Environments A Gaping hole in our “open architectures’ Exposes programs to risk with each DMS fix or upgrade cycle

Low Functional Density

Current standards do not meet the need

IEEE 1101.1 Air Cooled

IEEE 1101.2 Conduction Cooled

Not Compatible with Two-Level Maintenance Requires an ESD protected connector and covers for handling protection

Two to three times O&S cost penalty

F/A-22 example

Lack of a Standard for Environments

A Gaping hole in our “open architectures’

Exposes programs to risk with each DMS fix or upgrade cycle

Enablers for Wider Usage of Tomorrow’s COTS Higher Functional Density Standards under development will meet the need VITA 46 VITA 48 Compatible with Two-Level Maintenance VITA 46 and VITA 48 will have an ESD protected connector VITA 48 will provide optional covers for ESD and handling We Have a Standard for Environments Fills the gaping hole in our “open architectures’ ANSI VITA 47 is released

Higher Functional Density

Standards under development will meet the need

VITA 46

VITA 48

Compatible with Two-Level Maintenance

VITA 46 and VITA 48 will have an ESD protected connector

VITA 48 will provide optional covers for ESD and handling

We Have a Standard for Environments

Fills the gaping hole in our “open architectures’

ANSI VITA 47 is released

The Thermal Management Challenge and Answer Thermal management challenge More heat to remove Less “potential” to drive it out Consequences Unit Recurring Flyaway cost Functional density – fuel cost (O&S cost), lethality, survivability. Reliability (O&S cost) Margin for DMS fixes Margin for technology insertion The answer --- VITA 48 Enhanced conduction cooling Liquid Flow Through Cooling Spray Cooling BOE 042105-077

Thermal management challenge

More heat to remove

Less “potential” to drive it out

Consequences

Unit Recurring Flyaway cost

Functional density – fuel cost (O&S cost), lethality, survivability.

Reliability (O&S cost)

Margin for DMS fixes

Margin for technology insertion

The answer --- VITA 48

Enhanced conduction cooling

Liquid Flow Through Cooling

Spray Cooling

Outlook for the Future We are addressing the obstacles to wider usage of COTS assemblies in avionics/vetronics The environment will continue to change in ways that encourage the use of COTS We are at a tipping point – much wider use of COTS assemblies in harsh environment two-level maintenance systems

We are addressing the obstacles to wider usage of COTS assemblies in avionics/vetronics

The environment will continue to change in ways that encourage the use of COTS

We are at a tipping point – much wider use of COTS assemblies in harsh environment two-level maintenance systems