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Driving Industrial InnovationOn the Path to Exascale:From Vision to RealityDr. Rajeeb HazraVice President, Datacenter & Co...
Fundamental Discovery toGain Fundamental InsightsTechnical Computing Continues Its Rapid GrowthTo Compete, You Must Comput...
From Vision to Reality: Designed Without Prototypes!Future Intel® Xeon® Processor E5-2600 V2 familyIntel® True Scale Fabri...
Intel in HPC: In 2009Processors SoftwareIntel® EnterpriseEdition for Lustre*software
Intel in HPC: In 2013+Processors Coprocessor Fabrics SoftwareIntel® TruescaleIntel® EthernetProductsNext GenerationInterco...
Redefining Compute: Neo-Heterogeneity at Scale*Source: IDC. 78% surveyed plan to purchase a coprocessor or accelerator, In...
Announcing Today:New Intel® Xeon Phi™ Coprocessor Products7Software and workloads used in performance tests may have been ...
Next Intel® Xeon Phi™ Processor:Knights LandingAll products, computer systems, dates and figures specified are preliminary...
GuangzhouThe Pinnacle of Neo-Heterogeneity Today
Prof. Liao’s VisionMilkyWay-2*Source: top500.org, NUDT50PF Reality2013#1 system on top500!MilkyWay-254.9PF Peak Performanc...
Top 500 HighlightsIntel® Xeon Phi™ coprocessor Top10 systems: #1 and #6 system on list #6 system: 5.3 PF TACC StampedeIn...
Integration Is The KeyUnprecedented Innovations Only Enabled by the Leading Edge Process TechnologyOther brands, names, an...
HPC: Transforming Information & DataDriven Science Into KnowledgeOther brands, names, and images are the property of their...
INFORMATION IN THIS DOCUMENT IS PROVIDED “AS IS”. NO LICENSE, EXPRESS OR IMPLIED, BY ESTOPPEL OR OTHERWISE, TO ANY INTELLE...
Intel: Driving Industrial Innovation on the Road to Exascale
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Intel: Driving Industrial Innovation on the Road to Exascale

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In this video from ISC'13, Raj Hazra from Intel presents: Driving Industrial Innovation on the Road to Exascale.

"Join Intel for a look at the state of the HPC industry from two perspectives. First, we’ll look at how innovations in HPC are driving innovation in manufacturing industries with energy and automotive industry leaders providing examples. Next, we’ll give our perspective on the race to Exascale and discuss how Intel is collaborating with the HPC industry to address the challenges."

Watch the presentation video: http://insidehpc.com/2013/06/18/video-driving-industrial-innovation-on-the-road-to-exascale/

Download the presentation audio: https://archive.org/download/HazraISC13Keynote/Hazra%20ISC13%20Keynote.mp3

Learn more at:
http://www.intel.com/content/www/us/en/high-performance-computing/server-reliability.html

Published in: Technology, Business
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Transcript of "Intel: Driving Industrial Innovation on the Road to Exascale"

  1. 1. Driving Industrial InnovationOn the Path to Exascale:From Vision to RealityDr. Rajeeb HazraVice President, Datacenter & Connected Systems GroupGM, Technical Computing Group
  2. 2. Fundamental Discovery toGain Fundamental InsightsTechnical Computing Continues Its Rapid GrowthTo Compete, You Must ComputeSource: IDC: Worldwide Technical Computing Server 2013–2017 Forecast; Other brands, names, and images are the property of their respective owners.Governments & Research Commercial/Industrial New Users – New UsesBusiness Transformation Big Data Analytics EnablingData Driven ScienceBetter ProductsFaster Time to MarketReduced R&DFromDiagnosis topersonalizedtreatmentsquicklyGenomics ClinicalInformationHPC: Transforming the world of data and information into KNOWLEDGE“My goal is simple. It is completeunderstanding of the universe,why it is as it is and why itexists at all”Stephen Hawking
  3. 3. From Vision to Reality: Designed Without Prototypes!Future Intel® Xeon® Processor E5-2600 V2 familyIntel® True Scale FabricShow floor demo: 52 nodesVehicle Images © Audi, used by Permission; Other brands and names are the property of their respective owners."For Audi to stay on the forefront of automotive design, we required a new way to visualize our designs. Working with Intel and Autodesk,we have been able, for the first time, to adopt Real Time Predictive Rendering to interactively see our car design concepts with high fidelityvisualization. This helps us reduce the costs of development by eliminating expensive prototype turns“-- Audi
  4. 4. Intel in HPC: In 2009Processors SoftwareIntel® EnterpriseEdition for Lustre*software
  5. 5. Intel in HPC: In 2013+Processors Coprocessor Fabrics SoftwareIntel® TruescaleIntel® EthernetProductsNext GenerationInterconnectsIntel® EnterpriseEdition for Lustre*software…With Continued Innovation Across All Aspects of HPC
  6. 6. Redefining Compute: Neo-Heterogeneity at Scale*Source: IDC. 78% surveyed plan to purchase a coprocessor or accelerator, Intersect360Source IDC: Intel® Xeon Phi™ leads all accelerators in user preference for future buys (Intel 32%, nVidia: 26%)Heterogeneity is here to stay…Neo- Heterogeneity =Heterogeneous systemwith a single programming model…but it doesn’t have to be HARDMultiple Surveys:Increasing Intel Xeon Phiuser preference for future buysIDC Intersect360
  7. 7. Announcing Today:New Intel® Xeon Phi™ Coprocessor Products7Software and workloads used in performance tests may have been optimized for performance only on Intel microprocessors. Performance tests, such as SYSmark andMobileMark, are measured using specific computer systems, components, software, operations and functions. Any change to any of those factors may cause the results tovary. You should consult other information and performance tests to assist you in fully evaluating your contemplated purchases, including the performance of that productwhen combined with other products. For more information go to http://www.intel.com/performance 1. Claim based on calculated theoretical peak double precisionperformance capability for a single coprocessor. 16 DP FLOPS/clock/core * 60 cores * 1.053GHz = 1.0108 TeraFlop/s.7100 Family:Highest PerformanceMost Memory3100 Family:Performance & Value5100 Family:High Density Form Factor7120P 7120X 3120P 3120A 5120D
  8. 8. Next Intel® Xeon Phi™ Processor:Knights LandingAll products, computer systems, dates and figures specified are preliminary based on current expectations, and aresubject to change without notice.Designed usingIntel’s cutting-edge14nm processNot bound by “offloading” bottlenecksStandalone CPU orPCIe coprocessorLeadership compute & memory bandwidthIntegratedon-package memory
  9. 9. GuangzhouThe Pinnacle of Neo-Heterogeneity Today
  10. 10. Prof. Liao’s VisionMilkyWay-2*Source: top500.org, NUDT50PF Reality2013#1 system on top500!MilkyWay-254.9PF Peak Performance33.86PF Rmax>32000 Intel® Xeon® ProcessorE5-2600 v2 family>48000 Intel® Xeon Phi™Coprocessors100PF Project Vision2015Competency.Programmability.Reliability.Continuity.
  11. 11. Top 500 HighlightsIntel® Xeon Phi™ coprocessor Top10 systems: #1 and #6 system on list #6 system: 5.3 PF TACC StampedeIntel® Xeon® processor 98% of new listings based on Intel 1st listing of Intel Xeon E5-2600 V2 processor 56% performance increase vs. prior generationSource: www.top500.orgOther brands and names are the property of their respective owners.InmillionsHighlights403 of 500 (81%) of all systems chose Intel174 of 177 (98%) of new systems chose IntelTotal Rmax of Intel Xeon Phi > total Rmax of GPUs
  12. 12. Integration Is The KeyUnprecedented Innovations Only Enabled by the Leading Edge Process TechnologyOther brands, names, and images are the property of their respective owners.System level benefits in cost, power, density, scalability, & performance
  13. 13. HPC: Transforming Information & DataDriven Science Into KnowledgeOther brands, names, and images are the property of their respective owners.This decade we will create and extendcomputing technology to connect andenrich the lives of every person on earthOn to Exascale:Innovation and partnerships
  14. 14. INFORMATION IN THIS DOCUMENT IS PROVIDED “AS IS”. NO LICENSE, EXPRESS OR IMPLIED, BY ESTOPPEL OR OTHERWISE, TO ANY INTELLECTUAL PROPERTY RIGHTS IS GRANTED BY THISDOCUMENT. INTEL ASSUMES NO LIABILITY WHATSOEVER AND INTEL DISCLAIMS ANY EXPRESS OR IMPLIED WARRANTY, RELATING TO THIS INFORMATION INCLUDING LIABILITY OR WARRANTIESRELATING TO FITNESS FOR A PARTICULAR PURPOSE, MERCHANTABILITY, OR INFRINGEMENT OF ANY PATENT, COPYRIGHT OR OTHER INTELLECTUAL PROPERTY RIGHT.Software and workloads used in performance tests may have been optimized for performance only on Intel microprocessors. Performance tests, such as SYSmark and MobileMark, are measuredusing specific computer systems, components, software, operations and functions. Any change to any of those factors may cause the results to vary. You should consult other information andperformance tests to assist you in fully evaluating your contemplated purchases, including the performance of that product when combined with other products.Intel product plans in this presentation do not constitute Intel plan of record product roadmaps. Please contact your Intel representative to obtain Intels current plan of record product roadmaps.Intels compilers may or may not optimize to the same degree for non-Intel microprocessors for optimizations that are not unique to Intel microprocessors. These optimizations include SSE2, SSE3,and SSE3 instruction sets and other optimizations. Intel does not guarantee the availability, functionality, or effectiveness of any optimization on microprocessors not manufactured by Intel.Microprocessor-dependent optimizations in this product are intended for use with Intel microprocessors. Certain optimizations not specific to Intel microarchitecture are reserved for Intelmicroprocessors. Please refer to the applicable product User and Reference Guides for more information regarding the specific instruction sets covered by this notice.Notice revision #20110804All products, computer systems, dates, and figures specified are preliminary based on current expectations, and are subject to change without notice.Intel processor numbers are not a measure of performance. Processor numbers differentiate features within each processor family, not across different processor families. Go to:http://www.intel.com/products/processor_numberIntel, processors, chipsets, and desktop boards may contain design defects or errors known as errata, which may cause the product to deviate from published specifications. Current characterizederrata are available on request.Intel, Intel Xeon, Intel Xeon Phi, the Intel Xeon Phi logo, the Intel Xeon logo and the Intel logo are trademarks or registered trademarks of Intel Corporation or its subsidiaries in the United Statesand other countries.Intel does not control or audit the design or implementation of third party benchmark data or Web sites referenced in this document. Intel encourages all of its customers to visit thereferenced Web sites or others where similar performance benchmark data are reported and confirm whether the referenced benchmark data are accurate and reflect performance ofsystems available for purchase.Other names and brands may be claimed as the property of others.Copyright © 2013, Intel Corporation. All rights reserved.Legal Information
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