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Ipc Slideshow Ipc2152
Ipc Slideshow Ipc2152
Ipc Slideshow Ipc2152
Ipc Slideshow Ipc2152
Ipc Slideshow Ipc2152
Ipc Slideshow Ipc2152
Ipc Slideshow Ipc2152
Ipc Slideshow Ipc2152
Ipc Slideshow Ipc2152
Ipc Slideshow Ipc2152
Ipc Slideshow Ipc2152
Ipc Slideshow Ipc2152
Ipc Slideshow Ipc2152
Ipc Slideshow Ipc2152
Ipc Slideshow Ipc2152
Ipc Slideshow Ipc2152
Ipc Slideshow Ipc2152
Ipc Slideshow Ipc2152
Ipc Slideshow Ipc2152
Ipc Slideshow Ipc2152
Ipc Slideshow Ipc2152
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Ipc Slideshow Ipc2152

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  • 1. IPC Current Carrying Capacity Task Group (1-10b) August 2008 Michael R. Jouppi, Thermal Man, Inc., Task Group Chair <ul><ul><li>IPC-2152, Standard for Determining Current-Carrying Capacity in </li></ul></ul><ul><ul><li>Printed Board Design </li></ul></ul>
  • 2. <ul><ul><li>Mike Jouppi is a mechanical engineer who specializes in heat transfer. He has a bachelor’s of science in mechanical engineering from the University of Arizona and a master’s of science in computer information systems from Regis University. </li></ul></ul><ul><ul><li>Mike has been a thermal analyst since 1982. He has been a team member on projects such as the International Space Station, satellites, airships, missiles systems and, most recently, the Mars Lander. </li></ul></ul><ul><ul><li>Mike started with the IPC-1-10b </li></ul></ul><ul><ul><li>task group in 1999 and has chaired </li></ul></ul><ul><ul><li>the group since 2000. </li></ul></ul>
  • 3. IPC-2152 <ul><li>Introduction </li></ul><ul><ul><li>The amount of current that can be applied to a conductor and its resulting temperature rise is a printed circuit board (PCB) design concern. </li></ul></ul><ul><ul><ul><li>Design constraints have created a need for more precise guidelines for sizing conductors than those currently found in IPC-2221. </li></ul></ul></ul><ul><ul><li>Simple and accurate design guidelines, with an explanation to their origin, is the vision for IPC-2152. </li></ul></ul>Vision: Simple and Accurate Design Guidelines Standard for Determining Current Carrying Capacity in Printed Board Design
  • 4. IPC-2152 <ul><li>Introduction </li></ul><ul><li>The temperature rise of a PCB conductor is a complex problem, yet the desire is to have general guidelines. </li></ul><ul><li>A compromise has resulted that provides general guidelines in a main document and detailed guidelines in an attached appendix. </li></ul>IPC-2152 is divided into two sections, a main document with simple charts and an appendix that discusses details that impact the temperature rise of a conductor and more.
  • 5. IPC-2152 <ul><li>Introduction </li></ul><ul><li>The new standard is based on testing that was performed following IPC-TM-650, Method 2.5.4.1a, Conductor Temperature Rise Due to Current Changes in Conductors . </li></ul><ul><li>Computer simulations were also used to improve the understanding of the impact that certain variables have on the temperature rise of a conductor. </li></ul>IPC-2152 is based on industry standards test procedures and correlated computer simulations.
  • 6. IPC-2152 <ul><li>Test Considerations </li></ul><ul><ul><li>Environment </li></ul></ul><ul><ul><ul><li>Testing was performed in air and vacuum </li></ul></ul></ul><ul><ul><li>Internal and external conductors </li></ul></ul><ul><ul><li>PCB thickness </li></ul></ul><ul><ul><ul><li>0.038-inch, 0.059-inch and 0.07-inch thick test vehicles </li></ul></ul></ul><ul><ul><li>Copper thickness/weight (1/2-oz, 1-oz, 2-oz and 3-oz) </li></ul></ul><ul><ul><li>PCB material </li></ul></ul><ul><ul><ul><li>Polyimide and FR4 test vehicles </li></ul></ul></ul>Current carrying capacity testing considered multiple environments, conductor width and thickness, PCB thickness and PCB materials.
  • 7. IPC-2152 <ul><li>Test Results </li></ul><ul><li>Environment: Still air vs. vacuum </li></ul><ul><ul><li>Internal conductors in a board tested in vacuum are 55 percent higher in temperature rise than the same conductors in a still air environment. </li></ul></ul><ul><ul><li>External conductors in a board tested in vacuum are 35 percent higher in temperature rise than the same conductors in a still air environment. </li></ul></ul>Conductors run hotter in a vacuum than in air by as much as 55% or more.
  • 8. <ul><li>Test Results </li></ul><ul><li>Conductors: Comparing internal vs. external conductors </li></ul><ul><ul><li>An external conductor designed for a 10 o C rise will operate 20 percent higher in temperature than the same size internal conductor in a still air environment. </li></ul></ul><ul><ul><li>Identical external and internal conductors in a vacuum experience the same increase in temperature for the same applied current. </li></ul></ul>External conductors run hotter than internal traces in a still air environment . IPC-2152
  • 9. <ul><li>Test Results </li></ul><ul><li>Board Thickness: Conductor temperature and PCB thickness </li></ul><ul><ul><li>Conductors in a 0.965 mm (0.038 in.) thick PCB are approximately 30 to 35 percent higher in temperature than in a 1.78 mm (0.07 in.) thick PCB. </li></ul></ul><ul><ul><li>Conductors in a 1.498 mm (0.059 in.) thick PCB are approximately 20 percent higher in temperature than in a 1.78 mm (0.07 in.) thick PCB. </li></ul></ul><ul><ul><li>Test boards thicker than 1.78 mm have not been evaluated. </li></ul></ul>Conductors in thin PCBs run hotter than the same size conductor in thicker PCBs. IPC-2152
  • 10. <ul><li>Test Results </li></ul><ul><li>Comparing Copper Weights: </li></ul><ul><ul><li>Half-ounce copper conductors are similar in temperature rise for the same size cross-sectional area as 1 oz. conductors. </li></ul></ul><ul><ul><li>Two ounce copper conductors increase in temperature by 10 to 15 percent above 1 oz. conductors for the same size trace and applied current. </li></ul></ul><ul><ul><li>Three ounce copper conductors increase in temperature by 15 to 20 percent above 1 oz. conductors for the same size trace and applied current. </li></ul></ul><ul><ul><li>The higher percentages are related to a 45 o C delta T and the lower percentages are related to a 10 o C rise. </li></ul></ul>For the same cross-sectional area a wider conductor (1 oz.) will run 15 to 20 percent cooler than a narrow conductor (3 oz). IPC-2152
  • 11. <ul><li>Main Document </li></ul><ul><ul><li>Designed to be as simple as possible with conservative guidelines for sizing conductors. </li></ul></ul><ul><ul><li>The IPC-2221 internal conductor sizing chart will be kept as the most conservative chart to use for sizing conductors. </li></ul></ul><ul><ul><li>A single chart is included that envelopes both internal and external conductors in air environments </li></ul></ul><ul><ul><ul><li>External conductor heating data from a 1.78 mm (0.07 in.) thick PCB, 3 oz. copper, in an air environment </li></ul></ul></ul><ul><ul><li>A single chart is included that envelopes both internal and external conductors in a vacuum environment </li></ul></ul><ul><ul><ul><li>Based on external conductors heating data for a 1.78 mm (0.07 in.) thick PCB, 3 oz. copper, in a vacuum environment </li></ul></ul></ul>IPC-2152
  • 12. <ul><li>Appendix </li></ul><ul><li>Purpose: </li></ul><ul><li>A place in the document to add clarity on topic areas and a place for expanding on current carrying capacity in electrical conductors. </li></ul><ul><ul><ul><li>Example problems </li></ul></ul></ul><ul><ul><ul><li>New research: PCB materials, embedded resistors, high current, etc. </li></ul></ul></ul>IPC-2152
  • 13. <ul><li>Appendix </li></ul><ul><li>Topics Discussed: </li></ul><ul><ul><li>New and Old Conductor Sizing Charts </li></ul></ul><ul><ul><li>PCB Thickness </li></ul></ul><ul><ul><li>Parallel Conductors </li></ul></ul><ul><ul><li>Perpendicular Conductors </li></ul></ul><ul><ul><li>Flex circuits </li></ul></ul><ul><ul><li>PCB Material </li></ul></ul><ul><ul><li>Environments </li></ul></ul>IPC-2152
  • 14. <ul><li>Appendix </li></ul><ul><li>Topics Discussed (Continued) </li></ul><ul><ul><li>Vias </li></ul></ul><ul><ul><li>Neck down of conductors </li></ul></ul><ul><ul><li>High Density Interconnect </li></ul></ul><ul><ul><ul><li>Fine line and space conductors </li></ul></ul></ul><ul><ul><ul><li>Microvias </li></ul></ul></ul><ul><ul><li>Copper thickness </li></ul></ul><ul><ul><li>Thermal analysis of conductors, vias, odd shaped geometries </li></ul></ul>IPC-2152
  • 15. <ul><li>New Charts </li></ul><ul><ul><li>Multiple charts and chart formats </li></ul></ul><ul><ul><li>Charts for air and vacuum </li></ul></ul><ul><ul><li>Charts specifically for 1/2 oz., 1 oz., 2 oz. and 3 oz. copper weights (thicknesses) </li></ul></ul><ul><ul><li>Internal and external conductors </li></ul></ul><ul><ul><li>Linear charts and log-log charts </li></ul></ul><ul><ul><li>Charts showing finer resolution </li></ul></ul><ul><ul><li>SI (metric) and English (inch) units </li></ul></ul>IPC-2152
  • 16. IPC-2152 Chart Format Example
  • 17. IPC-2152 Chart Format Example
  • 18. <ul><li>Thermal Modeling (Computer Simulations) </li></ul><ul><ul><li>Thermal models developed and correlated to test data </li></ul></ul><ul><ul><li>Thermal models were used to investigate the influence of variables on conductor temperature rise: </li></ul></ul><ul><ul><ul><li>Copper planes </li></ul></ul></ul><ul><ul><ul><li>Distance from conductor to copper plane </li></ul></ul></ul><ul><ul><ul><li>Board level details </li></ul></ul></ul>IPC-2152
  • 19. <ul><li>PCB Level Details </li></ul><ul><ul><li>Conductors </li></ul></ul><ul><ul><ul><li>Parallel conductors </li></ul></ul></ul><ul><ul><li>Vias </li></ul></ul><ul><ul><li>Thermals </li></ul></ul><ul><ul><li>Odd-shaped geometries </li></ul></ul><ul><ul><li>Neck-down </li></ul></ul>IPC-2152
  • 20. <ul><li>Summary </li></ul><ul><ul><li>IPC-2152 will replace the conductor sizing charts that currently exist in IPC-2221. </li></ul></ul><ul><ul><li>IPC-2152 is a document that will be updated over time (embedded devices, microvias, etc.) as task group members continue adding to the knowledge base regarding current carrying capacity in printed board design. </li></ul></ul><ul><ul><li>IPC-2152 is the result of volunteer efforts that started in 1998. </li></ul></ul>IPC-2152
  • 21. For more information … If you would like more information, contact IPC by e-mail at perrjo@ipc.org.

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