Pressure curing oven,Conveyor Systems,Control Systems,Cooling Zones,Exhibitions

1. It has application for lamination and to remove voids both layers in industries of touch panel and LCD, PDP, semi conductor.
Effect of removing voids by pressure and temperature
Effect of hardness by temperature
Effect of adhesive strength by pressure
Solderball
Top and Bottom Die Die Attach Film/Paste
Air
Bubbles
(기포)
Dieelectric
Before After Before After Before After
Mold Cap
FR-5 Substrate
Silicon ICEpoxy Undrfill
Air
Bubbles
Solder Ball (63Sn/37Pb)
Bubble
Pressure curing oven06
Completed lamination
and removed voids
TPVB or EVA film
Glass
1
2
3
Clutch Door
Chamber
Touch Screen
Pressure gauge (Seal / Inlet / Chamber)
Three color light
Glass
(GA)
Touch panel screen,
Film (FA)
ass
GA)
panel screen,
m (FA)
Semiconductor of package
process (HA)

2. Parts of system
FEATURE
CONSIDERATION TO ORDER
Main O-ring
To seal cover Heating & Cooling Internal air circulation To pressurize the vessel
Pressure curing oven
07
M/D
Air circulation
Cooling system
Heater
Main O-ring Heater and cooling coil Fan and motor Booster
Compacted size
Reasonable price
Durability
BoosterAward for safety
Internal air flow
Before sealed
cover
After sealed
cover
Uniformity : +/-3deg C
Size (A, B)1
1
2
3
Pressure2
Temperature3
Cooling4
Booster or compressed air5
Gas media (Air or gas )6
A
B
B