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Socket Technologies

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IC Socket and interconnect technologies such as embedded wire on elastomer, spring pin, stamped pin, silver particle elastomer, diamond particle interconnect enable testing of IC devices

IC Socket and interconnect technologies such as embedded wire on elastomer, spring pin, stamped pin, silver particle elastomer, diamond particle interconnect enable testing of IC devices


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  • 1. www.ironwoodelectronics.com Socket Technologies Toll Free: (800) 404-0204 U.S. Only Tel: (952) 229-8200 Fax: (952) 229-8201 email: info@ironwoodelectronics.com
  • 2. www.ironwoodelectronics.com Introduction  Company Overview – Over 5,000 products – High Performance Adapters and Sockets – Many Custom Designs – Engineering – Electrical and Mechanical – ISO9001:2008 Registration  Socket Technology Overview – Embedded gold plated wire elastomer (SG) – Stamped & Etched spring pins (SBT) – Embedded silver ball elastomer matrix (SM/SMP) – Surface mount adapters for sockets (SF) IP, 9/25/2014
  • 3. www.ironwoodelectronics.com Embedded gold plated wire elastomer socket (SG) 17 Years Continuous improvement Protruded wire from elastomer BGA compressed on Elastomer Wire marks on BGA Features Benefits Short contact High bandwidth applications Heat sink lid Torque indicator IP, 9/25/2014 Development Proven Capability Gold plated Brass wire Low contact resistance Small socket footprint Easy to place inductors, capacitors, resistors, etc for tuning and increasing bandwidth. Ideal for IC prototype and system testing and field upgradeable system designs High resilient elastomer Compression cycles in thousands Optimized contact force Reliable connection without damage to device or board Capabilities • 0.3mm to 1.27mm pitch • 2x3mm to 50x50mm device • BGA, QFN, QFP, SOIC • 3000 pin count • Heat sink options • Easy chip replacement • Custom support plate options Xilinx FPGA socket Custom Open top lid No mounting hole socket insulation plate
  • 4. www.ironwoodelectronics.com Stamped & Etched spring pin socket (SBT) 6 Years Continuous improvement LGA high force pin BGA low force pin BGA socket w/ Snap Lid Features Benefits Long contact travel Compliancy for large package warpage Gold plated BeCu material High temperature applications Small socket footprint Easy to place inductors, capacitors, resistors, etc for tuning and increasing bandwidth. Ideal for IC prototype and system testing Open top socket Super short Etched spring pin IP, 9/25/2014 Development Proven Capability and field upgradeable system designs High resilient spring Compression cycles in hundreds of thousands Optimized pin diameter to Impedance matched high speed applications length ratio Stamped contact High current applications Automated assembly Low cost, short lead time Capabilities • 0.4mm to 1.27mm pitch • 2x3mm to 50x50mm device • BGA, LGA, QFN, QFP, SOIC • 5000 pin count • Heat sink options • Easy chip replacement • Custom support plate options Cone /ball Floating plate for precise Plunger alignment and swivel lid Clamshell BGA socket
  • 5. www.ironwoodelectronics.com Embedded silver ball elastomer matrix socket (SM/SMP) Continuous improvement Array of Columns - Elastomer Matrix Cross section - Silver balls SMP = Elastomer layer + Protective layer Features Benefits Shortest contact Highest bandwidth applications Actuate d SMP SM IP, 9/25/2014 4 Years Development Proven Capability Silver balls Low contact resistance Small socket footprint Easy to place inductors, capacitors, resistors, etc for tuning and increasing bandwidth. Ideal for IC prototype and system testing and field upgradeable system designs High resilient elastomer Compression cycles in hundreds of thousands Matrix with core Optimized force and built-in compression stop mechanism Capabilities • 0.25mm to 1.27mm pitch • 2x3mm to 50x50mm device • BGA, LGA, QFN • 2000 pin count • Heat sink options • Easy chip replacement • Custom support plate options Replaceable elastomer module ATE socket with double latch clam shell lid Relaxed Actuated Rest & Test condition
  • 6. www.ironwoodelectronics.com Contact Technology Summary Characteristics Embedded Wire Elastomer (SG) Stamped spring pins (SBT) Embedded Silver Ball Elastomer Matrix (SM/SMP) Bandwidth, GHz 8 to 10 7 to 31.7 40 Endurance, Cycles 2K 500K 10K/500K Resistance, mΩ 20 15 15 Self Inductance, nH 0.15 0.88 to 0.98 0.21 Max Current, Amp 2 8 4 Temp Range, ⁰C -35 to +100 -55 to +180 -55 to +155 Pitch, mm 0.3 to 1.27 0.4 to 1.27 0.25 to 1.27 Package Types BGA, QFN, QFP, SOIC BGA, LGA, QFN, QFP, SOIC BGA, LGA, QFN Lab test √ √ √ Production test √ √ Field upgrade √ √ Temperature test √ √ √ Kelvin test √ √ √ Burn-in test √ IP, 9/25/2014
  • 7. www.ironwoodelectronics.com Pin Datasheet IP, 9/25/2014
  • 8. www.ironwoodelectronics.com Socket Lid Options IP, 9/25/2014
  • 9. www.ironwoodelectronics.com Surface Mount Adapters for sockets (SF) 17 Years Continuous improvement Surface mount adapter Socket + SM adapter QFN SM adapter Features Benefits Pluggable interface Easy insertion and extraction for device swap FR4 & Gold plated contacts High temperature applications Small adapter footprint Easy to place inductors, capacitors, resistors, etc for tuning and increasing bandwidth. Ideal for IC prototype and system testing Spring pin socket + Thru hole adapter + Surface mount adapter QFP SM adapter IP, 9/25/2014 Development Proven Capability and field upgradeable system designs Conductive filled via Excellent thermal dissipation and high current applications Optimized plated thru hole Low inductance and high speed applications with filled via Edge castellation (QFN) Easy manual assembly Standard Solder (BGA) Easy assembly (industry standard reflow profile) Capabilities • 0.5mm to 1.27mm pitch • 2x3mm to 50x50mm device • BGA, LGA, QFN, QFP, SOIC • 2000 pin count • Lead free options • Easy pluggable module • Custom height extension Thru hole adapter Thru hole adapter + Surface mount adapter Pluggable adapter pair with soldered device 0.5mm pitch Pluggable adapter pair
  • 10. www.ironwoodelectronics.com Thermal Control System • FlexTC, -55°C to +155°C, Temperature accuracy of ±0.2°C • MaxTC, -60°C to +300°C, Temperature accuracy of ±0.2°C • FlexTC device plunger, 21W @-40C • MaxTC device plunger, 52W @-40C • Adaptor plate – specific to socket • Universal adaptor plate – mounting hole in PCB • Condensation control – dry air purge • Accommodate device in socket as well as soldered device • Portable, fluid free operation, Ultra-quiet operation • Maintenance-free system • Self contained system - No external chiller and no compressed air required IP, 9/25/2014
  • 11. www.ironwoodelectronics.com Custom Capability  Custom socket designs in 2 days  Match customer’s PCB footprint  Custom socket manufacturing in 10 days  Multiple contactor technologies  Heat sink simulation and design  Contactor signal integrity simulation  In-house automated optical inspection  In-house machining  Quick-turn production IP, 9/25/2014