www.ironwoodelectronics.com 
Adapter Technologies 
Toll Free: (800) 404-0204 U.S. Only 
Tel: (952) 229-8200 
Fax: (952) 22...
www.ironwoodelectronics.com Introduction 
 Company Overview 
– Over 5,000 products 
– High Performance Adapters and Socket...
www.ironwoodelectronics.com 
Pluggable BGA Adapter System 
(Giga-snaP™) Continuous improvement 
2000 pin count BGA system ...
www.ironwoodelectronics.com 
Surface Mount Package 
Emulators Continuous improvement 
Leadless SOIC emulator 
Features Ben...
www.ironwoodelectronics.com 
Package Convertors  Fix 
Adapters 
20 Years 
Continuous improvement 
BGA device mounted to QF...
www.ironwoodelectronics.com 
Continuous Prototype, Probe  Analysis 
Adapters Power PC BGA device interfaced 
to Logic anal...
www.ironwoodelectronics.com 
Receptacles, Extenders, 
Rotators  Socket Plugs Continuous improvement 
Rigid PCB extender al...
www.ironwoodelectronics.com 
Electronic Modules 
8 Years 
Continuous improvement 
Multi chip module with components on bot...
www.ironwoodelectronics.com Custom Capability 
 Custom adapter designs in 2 days 
 Match customer’s PCB footprint 
 Custom...
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Adapter Technologies

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IC adapter technologies document shows various configurations of probing and logic analyzer adapters for all SMT package types, as well as socket probes for DIP and PLCC. Partnered with Agilent and Tektronix, enabling adapters to facilitate the use of in-circuit emulators and FPGA development systems.

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Adapter Technologies

  1. 1. www.ironwoodelectronics.com Adapter Technologies Toll Free: (800) 404-0204 U.S. Only Tel: (952) 229-8200 Fax: (952) 229-8201 email: info@ironwoodelectronics.com
  2. 2. www.ironwoodelectronics.com Introduction Company Overview – Over 5,000 products – High Performance Adapters and Sockets – Many Custom Designs – Engineering – Electrical and Mechanical – ISO9001:2008 Registration Adapter Technology Overview – Pluggable BGA adapter system (Giga-snaP™) – Surface mount package emulators – Package convertors Fix adapters – Prototype, probe analysis adapters – Receptacles, extenders, rotators and socket plugs – Electronic modules IP, 9/25/2014
  3. 3. www.ironwoodelectronics.com Pluggable BGA Adapter System (Giga-snaP™) Continuous improvement 2000 pin count BGA system plugged together shown separately BGA device soldered on top module base module soldered on PCB Features Benefits Short contact High bandwidth applications Gold plated clips terminals Low contact resistance 10 Years IP, 9/25/2014 Development Proven Capability Chip size footprint Easy to place inductors, capacitors, resistors, etc for tuning and increasing bandwidth. Ideal for IC prototype and system testing and field upgradeable system designs Epoxy over-mold Matched CTE No solder wicking No substrate warping Low insertion/extraction force Easy operation to plug and remove module system Capabilities • 0.5mm to 1.27mm pitch • 2x2mm to 45x45mm device • 2000 pin count • Shortest signal path (2-7GHz) • Low insertion force (15-25g) • Co-planarity 100μm • Tape reel • RoHS compatible DDR memory BGA adapter system 0.5mm pitch BGA Pluggable adapter system Daughter card interface system or Board-to-board connector system
  4. 4. www.ironwoodelectronics.com Surface Mount Package Emulators Continuous improvement Leadless SOIC emulator Features Benefits Short contact High bandwidth applications Gold plated clips terminals Low contact resistance 15 Years 0.4mm pitch QFP emulator base with female interface J-leaded PLCC Emulator foot Gull-wing QFP Emulator foot IP, 9/25/2014 Development Proven Capability Chip size footprint Easy to place inductors, capacitors, resistors, etc for tuning and increasing bandwidth. Ideal for IC prototype and system testing and field upgradeable system designs Side castellation Easy hand soldering and reflow soldering Low insertion/extraction force Easy operation to plug and remove module system PLCC plug Capabilities • 0.4mm to 1.27mm pitch • 2x2mm to 50x50mm device • QFN, QFP, SOIC, PLCC • 500 pin count • Gull-wing options • Leadless options • RoHS compatible Side castellation SOIC emulator Leadless Leadless QFN emulator PLCC emulator
  5. 5. www.ironwoodelectronics.com Package Convertors Fix Adapters 20 Years Continuous improvement BGA device mounted to QFP footprint on mother board QFP device mounted to PLCC Footprint on target board with shortest trace length Features Benefits Shortest signal routing Minimal loss for high bandwidth applications BGA to BGA conversion with complex signal swap due to device enhancement without additional real estate IP, 9/25/2014 Development Proven Capability Gold plated interconnection Low contact resistance Chip size footprint No additional real estate needed. Ideal for replacing obsolete IC and field upgradeable system designs Shaped solder Solders same as IC it replaces. No change in assembly process Conventional PCB material CTE match and high temperature applications Capabilities • 0.4mm to 2.54mm pitch • 2x2mm to 50x50mm device • BGA, LGA, QFN, SOIC, PLCC, QFP, DIP, PGA, etc • 2000 pin count • RoHS compatible • Tray, Panel, Tape Reel options SOIC to DIP convertor using blind hole technology BGA convertor in scored panel SOIC device mounted to PLCC footprint using solder column technology for high volume production SOIC pitch convertor
  6. 6. www.ironwoodelectronics.com Continuous Prototype, Probe Analysis Adapters Power PC BGA device interfaced to Logic analyzer and mother board for functional analysis improvement 60 pin, 0.8mm pitch BGA rigid-flex probing adapter with AMP mictor and BGA surface mount foot SOIC, PLCC adapter 20 Years 0.5mm pitch 21x21 array 289 position BGA solder balls to AMP 104068 connectors using rigid flex PCB with socket fixture Features Benefits Shortest signal routing Minimal loss for high bandwidth applications Gold plated interconnection Low contact resistance Chip size footprint No additional real estate needed. Ideal for IC prototype and Conventional PCB material CTE match and high temperature applications Flexible top side traces Probing solution without additional interconnect BGA proto adapter with IP, 9/25/2014 Flex emulator – 125 position AMP Z pack connector to 80 position female interface Development Proven Capability system analysis testing Capabilities • 0.4mm to 1.27mm pitch • 2x2mm to 50x50mm device • BGA, LGA, QFN, SOIC, PLCC, QFP, DIP, PGA, etc • 2000 pin count • RoHS compatible • Agilent, Tektronix compatible • Rigid flex options Allows QFN device to be socketed to mother board with signals brought out to test pins Clamshell pogo pin socket
  7. 7. www.ironwoodelectronics.com Receptacles, Extenders, Rotators Socket Plugs Continuous improvement Rigid PCB extender alleviates height constraints Features Benefits Gold plated interconnection Low contact resistance Circular receptacle Array receptacle 20 Years Flex PCB extender allows communication between device to moving head IP, 9/25/2014 Development Proven Capability Small footprint No additional real estate needed. Ideal for IC prototype and daughter card interface Conventional PCB material CTE match and high temperature applications Flexible top side traces Probing solution without additional interconnect Differential and impedance matched signal routing High speed applications with accommodation of space constraints Capabilities • 0.5mm to 2.54mm pitch • 2x2mm to 50x50mm device • BGA, LGA, QFN, QFP, SOIC • 2000 pin count • RoHS compatible • Rigid flex options • Custom fixtures in days Height extender PLCC socket plugs Receptacles for burn-in sockets PLCC device clips with probing option
  8. 8. www.ironwoodelectronics.com Electronic Modules 8 Years Continuous improvement Multi chip module with components on both side Features Benefits Conventional PCB material CTE match and high temperature applications Shortest signal routing Minimal loss for high bandwidth applications Chip size footprint No additional real estate needed. Ideal for replacing QFP device, discrete connector BGA device, discrete voltage regulator IP, 9/25/2014 Development Proven Capability obsolete IC and field upgradeable system designs Conductive filled via Excellent thermal dissipation and high current applications Optimized plated thru hole Low inductance and high speed applications with filled via Fiducial, Kapton dot Optical alignment, pick place assembly Shaped solder (QFN, QFP) Easy assembly (industry standard reflow profile) Capabilities • 0.25mm to 2.54mm pitch • 3 mil trace/space • Laser micro vias • Embedded caps resistors • Lead free options • Tray, Tape Reel options • Turnkey solutions Daughter card module Interfaced to QFP footprint BGA device, SOIC device discrete Dual technology (SMT thru hole) assembly SoC module with high density connector
  9. 9. www.ironwoodelectronics.com Custom Capability Custom adapter designs in 2 days Match customer’s PCB footprint Custom adapter manufacturing in 10 days In-house automated optical inspection Stencil print, Pick Place, Reflow Adapter signal integrity simulation Innovative adapter technologies In-house machining Quick turn production IP, 9/25/2014
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