Development in the electronics industry has come a long way from nascent low performing devices to advanced devices with high computational speed and power. The advancement in the
industry led to an exponential increase in power densities, which in turn drove the innovation of smarter and smaller products. These advanced technologies, coupled with miniaturization requirements, guided innovation-driven thermal management in electronic devices.
Thermal management is essential in electronics, as it improves reliability and enhances performance by removing heat generated by the devices.
This paper highlights the development and challenges faced in the thermal management of electronic equipment in various domains.
It gives an overview of innovative cooling solutions developed over the years. It presents HCL case studies in various domains such as medical, consumer, aerospace and defense, and automotive
electronics. It also gives a process flow chart which demonstrates the thermal methodology of electronic equipment in general