Shaping the COTS Assembly Market

[email_address] – (253) 773-0197, [email_address] – (253) 657-0809, [email_address] – (253) 657-5663 Shaping the COTS Assembly Market to Support High End MilAero Applications Lori E. Bechtold Kimberly D. Meredith James A. Robles Saint Louis, Missouri - February 13-15, 2007

Name: Lori E. Bechtold Key Technical Field: Phone number: Fax number: (253) 773-0299 E-mail: Biography: Lori Bechtold is a reliability engineer with 22 years experience with Boeing, spanning programs in military, commercial aviation and space applications. She currently supports the P-8A Poseidon program, addressing environmental issues of commercial off the shelf (COTS) electronics on a Navy platform. She has conducted research and development in Boeing’s Phantom Works group, in the application of COTS electronics to military and aerospace applications. Lori is the technical editor for the VMEbus International Trade Association (VITA) working group 51, developing a new industry specification for reliability prediction for COTS modules. She holds a B.S degree in mathematics from the Massachusetts Institute of Technology. [email_address] Reliability (253) 773-0197

Name: Kimberly D. Meredith Key Technical Field: Electronic Systems Packaging Phone number: 253-657-0809 Fax number: 253-657-0071 E-mail: [email_address] Biography: Kimberly Meredith is a thermal and structural designer and analyst in the field of Electronics packaging, and has ten years of experience in avionics related disciplines. Areas of expertise include hardware design for military avionics, test and analysis of prototype and production avionics, test and mechanical design of pulse detonation technologies, thermal and dynamic/vibration analysis, design of experiments, and environmental test and analysis. She recently has become involved in joint COTS electronics initiatives in Phantom Works and Integrated Defense Systems, as well as participated in Boeing efforts with the VMEbus International Trade Association (VITA). She holds a M.S. degree in Engineering Science and Mechanics from the University of Tennessee.

Name: James A. Robles Key Technical Field: Electronic Systems Packaging Phone number: 253-657-5663 Fax number: 253-657-0090 E-mail: [email_address] Biography: Jim Robles is a Boeing Senior Technical Fellow. He has more than thirty years of experience in electronic packaging disciplines including, development of system architectures, hardware design for commercial and military ground and airborne avionics, equipment installation design, mechanical tolerance analysis, thermal and dynamic/vibration analysis, weights/mass properties analysis, design of experiments, and environmental test and analysis. He is a recognized expert on the application of COTS hardware on military platforms. Jim is the leader of the GEIA working group that developed EIA-933 Standard for Preparing a COTS Assembly Management Plan . He is also the Boeing Executive Focal for our External Technical Affiliation with VITA, developing standards for next generation COTS hardware assemblies for military/aerospace applications.

Shaping the COTS Market

Rapid evolution in COTS market

Boeing has influence only in high end MilAero market

In the last decade, high end MilAero market has been transformed by technological advances, and through Boeing influence on open architecture standards evolution

COTS assemblies now provide superior solution for all design criteria

In increasingly competitive commercial and military marketplace, COTS integration is essential to remain competitive and is key to future success

Agenda

COTS Applicability

Customer Needs

The COTS Trade, Then and Now

Functional Density

Open Architecture Standard for Environments

Two-Level Maintenance

Future Combat Systems and COTS

Liquid Flow Through Cooling

Future Opportunities

COTS Applicability Future More of the same “ office environment” Future More COTS VPX/REDI Graphic courtesy of Mercury Computing

Critical skill to support our core competencies

Commercial-Off-The-Shelf (COTS) Electronics; Provide broad and deep knowledge of, and contacts within, the commercial electronics industry. This includes technical, management, economic, and cultural awareness. Also have similar knowledge of all segments of the aerospace industry, including commercial, military, and space; as well as the avionics supply chain, including avionics original equipment manufacturers, system integrators, commercial and military operators, and regulatory agencies; and all geographic regions. (IDS, BCA, PW, EE Function)

Related Critical Skills

Electrical Engineering

Materials, Processes and Physics

Systems Engineering

System/Design Safety

Test and Evaluation

High Functional Density, Severe Environment Military Platform Needs

Minimize Total Ownership Cost (TOC)

Development Cost

Unit Recurring Flyaway (URF) Cost

Operation and Support (O&S) Cost

High functional density to minimize weight and volume

Thermal density (watts/cm)

Perform reliably in harsh environment

Compatibility with two-level maintenance for

Reductions in life cycle cost

Reductions in logistic footprint

Facilitate insertion of new technology and mitigation of component obsolescence

Thermal margin

Open system standards

Customer Needs The Challenge and the Opportunity The Challenge Thermal Management Continuing Loss of Control of the Electronics Industry Processing Requirements AKA Functional Density The Opportunity References: www.vita.com and http://www.busandboard.com/archive-index.html Open Architecture Standards & a Strong Industrial Base Two-Level Maintenance VITA 48 ERDI (Enhanced Ruggedized Design Implementation) IBM Cell Processor Technology

Enhanced thermal management and functional density

Two-level maintenance compatibility

Conduction and air cooling to 200 watts

LFT and spray cooling to 800 watts

Moving target engagement

Automatic target recognition

Graphic courtesy of Mercury Computing

VITA 46 VPX

High speed serial interconnect switch fabric based architecture

Market driven selection of bus protocols

ESD protected connector

ANSI/VITA 47-2005

Open architecture standard for environments

Two-Level Maintenance - Radar - F- 22 Requires Two - Level Maintenance F- 22 Opportunity To Use COTS Based Graphic courtesy of CWCEC VITA 48 VITA 46 (VPX) and VITA 48 (REDI) addressed and resolved ESD issue, making two-level maintenance practicable. Radar Processor (RP) Processor

The COTS Trade – Circa 1998 Extremely Poor Poor Low 63 Eight (8) times Baseline Eight (8) times Baseline Higher Lower Lower Conduction Cooled COTS Extremely Poor Good Low 145 3.4 times baseline 3.4 times baseline High High No change from Baseline Conduction Cooled Custom Design High (100% thermal margin) Good Medium 333 1.5 times baseline + ECS effect 1.5 times baseline + ECS effect No change from baseline No change from baseline No change from Baseline Air Flow Through Cooled Custom Design High (100% thermal margin) Good High 500 Baseline Baseline Baseline Baseline Baseline Liquid Flow Through (LFT) Cooled Custom Design Ease of Technology Insertion Ease of Maintenance Integrity/ Reliability Performance (watts per inch of pitch) Volume Weight O&S Cost Design To Cost (DTC) Development Cost Supportability Survivability/Lethality Affordability Option

The COTS Trade - Circa 2006 VPX/REDI COTS Assemblies provide low total ownership cost, excellent weight, volume, performance, and good supportability.

Cooling Capacity vs. Functional Density Requirements

Key to survivability/lethality

Trends have changed COTS vs. Custom advantages

The Future

IBM BE Cell Processor – 600 watt 6U card with four nodes

COTS LFT Functional Density Requirements COTS Conduction Custom Conduction Custom LFT

Advances in Conduction Cooled COTS

F-22 CNI/EW Power Supply

Circa 1993 to 2000

SEM-E

~ 40 watts

Military Grade Temperature Components

No “special” technology

IEEE 1101.2 VME Card

2000 to 2005

6U

Up to 90 watts

~ Industrial Grade Temperature Components

Extra conduction paths

VITA 48 Module

Circa 2006

6U

200 watt capability

Heat pipes, extra conduction paths

Graphic courtesy of CWCEC GRAPHIC NOT AVAILABLE

Current Custom Module

Circa 2006

6U

110 watt capability

Annealed Pyrolytic Graphite Core

Large Wedge Clamps

Advances in LFT Cooling

F/A-22 CIP Power Supply

Circa 1993 to 2000

SEM-E

~ 80 to 100 watts

Military Grade Temperature Components

Quick Disconnect (QD) Issues

Custom Design Processor

Circa 1996 to 2000

SAM (6U-ish)

140 watts design / 300 watt capability

Industrial Grade Temperature Components

QD Issues Worked

VITA 48 Module

Circa 2006

6U

600 to 800 watt capability

QD Issues Being Worked

Graphic courtesy of Mercury Computing

ANSI / VITA 47-2005

In 1996, COTS not available to an open standard for Mil/Aero application environments

In 2005, an open standard approved for environmental, design and construction, safety, and quality requirements for COTS plug-in units intended for mobile applications

Keeps the advantages of open systems

Lower total ownership cost

Obsolescence protection, backward compatibility

Efficiency of common solutions across multiple applications

Future Combat Systems is using a VITA 46 COTS Solution Backplane (BP) – ruggedized circuitry for intra-rack power and signal distribution; includes backplane interconnect, I/O connectors, backplane to I/O connector harness, and backplane cover Backplane 6U 3U

Circuit Cards – Per VITA 46

Functional Density

High speed serial interconnect with switch fabric

matrix architecture

ESD protected connector

Environments – Per ANSI/VITA 47-2005

Open architecture standard

Future Combat Systems has committed to 2-Level Maintenance Utilizing VITA 48 Table 2. FCS Maintenance Levels Trade Study VITA 48 Module with ESD protected connector and covers Integrated Electronics Rack (IER) – the enclosure in which LRMs are installed; provides mechanical support, cooling and some measure of environmental protection to the LRMs; provides the physical interface to the platform; includes backplane interface 6U 3U

Line Replaceable Modules (LRM) – Per VITA 48

Covers for ESD protection also provide stiffening

and greater EMC

Meets the Army’s Needs

$4B operation and support (O&S) cost reduction for

Integrated Computer System (ICS) alone

Greater than 50% reduction in logistics footprint

Corresponding benefits for other systems.

Commercial Cooling Trends/Innovations

All Electric Trend

787 Power Electronics Control System (PECS)

Circa 2004

All Electric Airplane

Thermal loads unmanageable with air cooling

http://www.newairplane.com/

Currently Available Liquid Cooled Computing

Apple Power Mac G65

“ Mind-boggling leaps in processing power

http://www.apple.com/powermac/design.html

Sony VGC-RA710G

“ Liquid Flow Heat Pipe”

http://www.mynetbuys.com/pdetails.aspx?part=VGC-RA710G

Intel Liquid Cooling Research

Sunon Waturbo CPU radiator cooling

http://www.xbitlabs.com/news/coolers/display/20060418123542.html

Integrated pump-coldplate module

http://www.xbitlabs.com/articles/editorial/display/idf-s2006-3.html

Back Up Slides

Shaping the COTS Market

Our needs can’t be levied as requirements on COTS - they must be advocated in the market to influence future products

Continued advocacy results in practicable solutions using COTS

COTS integration is a critical skill to support our core competencies

Future efforts will assure practicable COTS solutions to future integration challenges.

The Maintenance Level Trade - Circa 1998

Three Level and Two Plus Level maintenance rejected due to high cost

Two Level w/Protection rejected due to weight and volume increase

Thermal Management Technologies Active Transport Elements Interfaces LFT Cooling Spray Cooling Conduction Cooling Passive Transport Elements HRU Global Solutions Module Solutions Liquid Metal Cooling Loop Phase Change Fillers for Liquid Loops Custom and COTS Design Improvements QDs Thermal Spreaders (Diamond, etc.) Heat Pipes Custom and COTS Design Improvements Vapor Chambers Micro-Channels Wedge Clamps Heat Pipes Wedge Clamps Thermal Spreaders (Diamond, etc.) Refrigeration Thermal Pads Composite Chassis Rarefied Air Thermoelectric Spacecraft Radiator

Future Opportunities

Directed Energy Weapons

7E7 More Electric Aircraft

Increasing Avionics Functional Density

High Power Microwave

Commercial Cooling Trends/Innovations

All Electric Trends

787 Power Electronics Control System (PECS)

Circa 2004

All Electric Airplane

Thermal loads unmanageable with air cooling

http://www.newairplane.com/

DDG 1000 Multimission Destroyer

All electric drive with integrated power system

http://peos.crane.navy.mil/ddx/

Currently Available Liquid Cooled Computing

Apple Power Mac G65

“ Mind-boggling leaps in processing power

http://www.apple.com/powermac/design.html

Sony VGC-RA710G

“ Liquid Flow Heat Pipe”

http://www.mynetbuys.com/pdetails.aspx?part=VGC-RA710G

Silicon Carbide Microelectronic Devices

Operate at higher temperatures and radiation levels vs. Si and GaAs semiconductors

High thermal conductivity

http://www.cree.com/products/sic_sub_prop.asp

Microtechnology Advances

Carbon Nanotubes (Purdue)

http://widget.ecn.purdue.edu/~CTRC/research/breakthroughs.htm#CNT

MEMS Cooling pumps (Purdue, UW)

http://www.physorg.com/news75566064.html

MEMS Synthetic jets (Georgia Tech research)

IBM Zurich Labs chip cooling channel design

http://www.physorg.com/news81096760.html

Intel Liquid Cooling Research

Sunon Waturbo CPU radiator cooling

http://www.xbitlabs.com/news/coolers/display/20060418123542.html

Integrated pump-coldplate module

http://www.xbitlabs.com/articles/editorial/display/idf-s2006-3.html

Shaping the COTS Assembly Market

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