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Basic Preventive Maintenance On Sputtering Systems

Basic Preventive Maintenance On Sputtering Systems



written by D.Jean /ppt

written by D.Jean /ppt



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    Basic Preventive Maintenance On Sputtering Systems Basic Preventive Maintenance On Sputtering Systems Presentation Transcript

    • Basic Preventive maintenance on Sputtering Systems Written by: Dorin Jean November 10, 2008
    • General purpose for sputtering system
      • Hello everyone, my name is Dorin Jean, as a wafer fab technician I have found it necessary to have a written manual for proper and consistent training on various tools.
      • With all tools, there exist a standard procedure of performing proper maintenance in order to decrease down time of that equipment.
    • Maintaining a sputtering system
      • To fully understand the proper procedures for maintaining a sputtering system, this report will:
      • Provide instruction combined with certified supervision on how to perform a physical vapor deposition (PVD) kit change as well as a PVD target change.
    • Maintenance for sputtering system continued
      • Identify best practices for performing successful and quick turnaround PVD kit change and target preventive maintenance (PM)
      • Provide instruction on performing all procedures associated to process kit change PM.
      • Certified an operator/technician candidate as capable of performing a PVD process kit PM for sputtering systems.
    • What is sputtering?
      • Sputtering is a process that can deposit any material on any substrate. Sputtering like evaporation, takes place in a vacuum.
      • However it is a physical not a chemical process, and is referred to as physical vapor deposition (PVD).
      • It is a metallization process
    • Knowing the proper procedures
      • Before you begin to perform any PMs, you must ensure all operators know the proper procedures for placing a tool down.
      • Proper procedures include:
      • Familiarization of functions within the operating system
      • And prior to any actual maintenance , you must make sure that all required tools and parts are present.
    • Proper procedures
      • Once the tool is properly set up for the PM, you then performed the required steps as listed in the report to cool and vent the chamber.
      • Once conditions have been met prior to opening chamber, you can follow the step-by-step procedure to perform a kit and or target change.
    • Procedures continued
      • While performing the procedures for a kit and or target change , you must also check for others conditions that may require maintenance activities, for instance, regeneration of cryopumps.
      • Once kit and or target changes have been performed, then you can proceed to allow the tool to complete the remaining steps for a proper PM.
      • Once the PM is complete, you must condition and qualify the tool before releasing it to full production
    • Procedures continued
      • This includes
      • Running paste (conditioning)
      • Particle checks
      • And checking thickness of film
    • Conclusion
      • This manual that I have developed should explained and allowed operators to become certified in performing PMs on sputtering system
      • As the need for integrated circuits continues to increase, semiconductor manufacturing companies will stress the need to enforce efficient use of time and personnel.
    • Hybrid Systems UHV Sputtering And Evaporation
      • One example