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Merix Global Capabilities    Jan 2009   External
 

Merix Global Capabilities Jan 2009 External

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    Merix Global Capabilities    Jan 2009   External Merix Global Capabilities Jan 2009 External Presentation Transcript

    • Merix Corporation Capabilities Cross Compare San Jose Oregon Huiyang Huizhou Volume Production Controlled Volume Production Volume Production Controlled Volume Production Volume Production Controlled Volume Production Volume Production Controlled Volume Production Class A Class B Class A Class B Class A Class B Class A Class B 1.0 Material 1.1 Global Material Offerings All Sites Number of Conductive layers Number of Conductive layers Number of Conductive layer Number of Conductive layer Number of Conductive layers Number of Conductive layers Number of Conductive layers Number of Conductive layers Isola FR406: 2 - 30 32 - 40 2 - 30 32 - 40 2 – 14 10 - 24 2–8 10-14 Isola 370HR: 2 - 30 32 – 40 2 - 30 32 – 40 2 – 14 10 - 24 2-8 NO ITEQ 180: NO 2 – 40 NO 2 – 40 2 – 14 10 -24 NO NO FR408: 2 - 30 32 – 40 2 - 30 32 – 40 NO 2 -24 NO NO N4000-13 & 13SI: 2 - 30 32 - 40 2 - 30 32 - 40 NO 2 -24 NO NO Rogers 4350/4450: M/L & MIXED Dielectric M/L & MIXED Dielectric M/L & MIXED Dielectric M/L & MIXED Dielectric 2-SIDED ONLY M/L & MIXED Dielectric 2-6 M/L & MIXED Dielectric 1.2 Additional Standard Based Material Standard FR4: 2 - 30 32 – 40 2 - 30 32 – 40 2 – 14 10 - 24 2–8 10-14 NO NO NO NO High Tg FR4 (Nelco-29): 2 - 30 32 – 40 2 - 30 32 – 40 High Tg Modified FR-4 (IS415) 2 - 30 32 – 40 2 - 30 32 – 40 NO 2-24 NO NO 1.3 Low Loss E-Glass Materials High Freq. FR4 (FR408): 2 - 30 32 – 40 2 - 30 32 – 40 NO 2 - 24 NO NO High Freq. Modified FR4 (IS620): 2 - 30 32 – 40 2 - 30 32 – 40 NO NO NO NO Polyclad GETEK & MEM Megtron: NO NO NO NO NO NO NO NO Nelco 4000-13& 13SI: 2 - 30 32 – 40 2 - 30 32 – 40 NO 2 -24 NO NO 1.4 Lead-Free Qualified Materials ITEQ 180: NO 2 – 40 NO 2 – 40 2 – 14 10 - 24 NO NO High Tg CAF Resistant (370HR): 2 - 30 32 – 40 2 - 30 32 – 40 2 – 14 10 - 24 NO 2-8 NO NO NO NO High Tg FR4 (Nelco-29): 2 - 30 32 – 40 2 - 30 32 – 40 High Tg Modified FR-4 (IS415) 2 - 30 32 – 40 2 - 30 32 – 40 NO 2-24 NO NO Polyimide: 2 - 30 32 – 40 2 - 30 32 – 40 NO NO NO NO 1.5 Lead-Free Low Loss Materials High Freq. FR4 (FR408): 2 - 30 32 – 40 2 - 30 32 – 40 NO 2 -24 NO NO High Freq. Modified FR4 (IS620): 2 - 30 32 – 40 2 - 30 32 – 40 NO NO NO NO Nelco 4000-13EP and EPSI: 2 - 30 32 – 40 2 - 30 32 – 40 NO 2 -24 for -13EP Only NO NO 1.6 High Temperature Materials Polyimide: 1 – 16 18 – 28 2 - 30 32 – 40 NO NO NO NO 1.7 Commercial RF Materials Roger 3000 Series: YES YES YES YES NO NO NO NO Mixed Dielectric – Rogers Mixed Dielectric & Mulitlayer - Roger 4000 Series: YES YES YES YES 2-SIDED Rogers 4350 ONLY 4350 2-sided Rogers 4350 Only 4350 Taconic RF Materials: YES YES NO YES NO NO NO NO 1.8 Advanced RF Materials Nelco 9000 Series (PTFE): 1-2 NO NO NO NO NO NO NO Roger 6000 Series: 1–2 NO NO NO NO NO NO NO Roger 5000 Series: 1–2 NO NO NO NO NO NO NO 1.9 Asia Material Offering Isola 400,402, and ED130UV (Tg=125-145C): NO NO NO NO NO 2 – 14 2–8 10-14 Polyclad 370/ Turbo (Tg=175C): NO NO NO NO 2 - 18 10 – 24 2–8 10-14 ITEQ IT140(Tg=140C) NO NO NO NO 2 – 14 2 – 14 2–8 10-14 Nanya NP-140 (Tg=140C) NO NO NO NO 2 – 14 2 – 14 2–8 10-14 SHENGYI S1141 (Tg=135C): NO NO NO NO 2 – 14 2 – 14 NO YES SHENGYI S1441 (Tg=140C): NO NO NO NO 2 – 14 2 – 14 NO NO ITEQ IT158 (Tg=150C): NO NO NO NO 2 - 18 10 – 24 2–8 10-14 SHENGYI S1170 (Tg=170C): NO NO NO NO 2 - 18 10 – 24 NO Yes ITEQ IT170 (Tg=170C) NO NO NO NO 2 - 18 10 – 24 NO NO 1.10 Buried Capacitance Isola FR406– 2mil YES YES YES YES NO YES NO NO Isola FR408- 2mil YES YES YES YES NO YES NO NO Isola 370HR-2 mil YES YES YES YES NO YES NO NO Nelco-13 and -13Si – 2mil YES YES YES YES NO YES NO NO Isola IS620 – 2mil YES YES YES YES NO NO NO NO Polyimide P96 – 2mil YES YES YES YES NO NO NO NO Oak-Mitsui Faradflex – BC 24 ( 1 mil) NO NO YES YES NO NO NO NO Oak-Mitsui Faradflex – BC12TM (.5 mil) NO NO NO YES NO NO NO NO Merix Corporation Page 1 of 5 Rev:090128
    • San Jose Oregon Huiyang Huizhou Volume Production Controlled Volume Production Volume Production Controlled Volume Production Volume Production Controlled Volume Production Volume Production Controlled Volume Production Class A Class B Class A Class B Class A Class B Class A Class B 1.11 Panel Sizes and Useable Area 18 X 24 18 X 24 18 X 24, 18 X 24, 20 X 24, 16 X 21 Multilayer Panel Sizes: 12 X 18 16 X 18 21 X 24 16 x 18 21 X 24, 14 x 24 16 x 20, 14 x 20, 14 x 24 Non Usable Border on Panel: Double Sided Boards: .65 .65 .65 .55 .7 .65 .5 .5 Multilayer Boards: .75 .75 .65 .55 .7 .65 .7 .7 Spacing Between Boards: (Routing Process) Double Sided and Multilayer Boards: .150 .100 .150 .100 .150 .1 .150 .1 2.0 Stack-ups 2.1 Overall Thickness Range and Tolerances Overall Board Thickness: ≤ ≤ ≤ ≤ ≤ ≤ ≤ .126 - .240 .240 .126 - .240 .275 .125 .220 .118 .118 Overall Board Thickness Tolerance: < .020”: +/- 15% +/- 15% +/- 15% +/- 15% +/-15% +/-15% NO +/-15% .031”: +/- 15% +/- 10% +/- 15% +/- 10% +/-10% +/-10% +/-10% +/-10% .062”: +/- 10% +/- 8% +/- 10% +/- 8% +/-10% +/-10% +/-10% +/-10% .093”: +/- 10% +/- 8% +/- 10% +/- 8% +/-10% +/-10% +/-10% +/-10% .125”: +/- 10% +/- 8% +/- 10% +/- 8% +/-10% +/-10% NO NO .187”: +/- 10% +/- 8% +/- 10% +/- 8% +/-10% +/-10% NO NO 2.2 Flatness Spec Flatness: (Warp per Inch) .010 .007 .010 .0075 .010 .0075 .010 .0075 2.3 Thinnest Dielectric Finished Thin Board Overall Thickness: .017 .013 .017 .015 .031 .020 (No HASL) 0.028 .020 Thinnest Plated Core: .012 .008 .012 .008 NO .016 NO 0.016 3.0 Mechanical Capabilities 3.1 Machining Drill Capabilities Primary Drilled Hole Location Tolerance to Datum (Hole) Zero (DTP): 0.007 0.006 0.007 0.006 0.010 0.008 0.011 0.0085 2nd Drill Hole Location Tolerance to Datum Zero (DTP): 0.014 0.011 0.014 0.011 0.014 0.011 0.014 0.011 Minimum Clearance from Copper Conductor to Mechanical Drilled Hole: .0085 .008 .0085 .008 .010 .0085 .0085 .008 Minimum Clearance from Copper Conductor to a Laser Drilled Hole: .008 .006 .0085 .008 NO NO NO NO 3.2 Plated Through Hole Capabilities Smallest Plated Thru Hole Size: (Finished Via Size with Finished Hole Size - 1 mil Min Ave Copper Requirement) Finished Panel Thickness < .020”: .004 .003 .006 .006 .010 .008 .010 .010 Finished Panel Thickness .031”: .004 .004 .006 .006 .010 .008 .010 .010 Finished Panel Thickness.062”: .006 .006 .006 .006 .010 .008 .010 .010 Finished Panel Thickness.093”: .010 .008 .008 .008 .012 .008 .014 .014 Finished Panel Thickness.125”: .012 .008 .008 .008 .012 .008 NO NO Finished Panel Thickness.187”: .015 .012 .014 .012 NO .014 NO NO Plated Hole Tolerance: +/-.003 +/-.002 +/- .003 +/- .002 +/-.003 +/- .002 +/-.003 +/-.002 5:1 ( 12 mil drill) Aspect Ratio (with 10 mil drill): 10:1 12:1 12.5:1 14:1 8:1 12:1 6:1 non- auto 8:1 Plated Hole Spacing Minimum (Drilled hole to hole): .022 .015 .022 .015 .022 .015 .022 .020 3.3 Non Plated Through Holes Smallest Non Plated Hole Size: (Finished) .010 .008 .010 .008 .012 .010 .012 (non-HASL) .012 (non HASL) Largest Non-Plated Hole Size Routed: .200 NO LIMIT .200 NO LIMIT .200 NO LIMIT .250 NO LIMIT Largest Primary Drilled and Tented Non-Plated Hole: .200 .250 .200 .250 .200 .250 .236 .250 Non-plated Routed Hole Tolerance: +/- .005 +/- .003 +/- .005 +/- .003 +/- .005 +/- .003 +/- .005 +/- .003 Minimum NPTH to Edge of Board Spacing: .020 .010 .020 .010 .030 .020 .030 .025 3.4 Micro Via (μVia) Capabilities Smallest Laser μVia Hole Size: ( Via Size with 0.4 mil Copper Requirement) .004 .004 .004 .004 NO NO NO NO Largest Drilled Laser Via: .010 .010 .006 > .009 NO NO NO NO Via Aspect Ratio 0.8:1 .9:1 .75:1 .85:1 NO NO NO NO Capture Pad Size: μvia + .010 μvia + .006 μvia + .010 μvia + .007 NO NO NO NO Landing Pad Size: μvia + .010 μvia + .006 μvia + .010 μvia + .007 NO NO NO NO Stacked Via NO 2 NO 3 NO NO NO NO Type I Capabilities YES YES YES YES NO NO NO NO Type II Capabilities YES YES YES YES NO NO NO NO Type III Capabilities NO NO NO YES NO NO NO NO Merix Corporation Page 2 of 5 Rev:090128
    • San Jose Oregon Huiyang Huizhou Volume Production Controlled Volume Production Volume Production Controlled Volume Production Volume Production Controlled Volume Production Volume Production Controlled Volume Production Class A Class B Class A Class B Class A Class B Class A Class B 3.5 Control Depth Drill Capabilities Smallest Control Depth Drill .008 .006 .010 .010 NO NO NO NO Largest Control Depth Drill .125 .257 .125 .125 NO NO NO NO Minimum Backside Dielectric Separation .008 .005 .007 .007 NO NO NO NO Control Depth Drill Depth Tolerance .005 .002 .005 .002 NO NO NO NO Control Depth Drill Aspect Ratio (with tolerance) .75:1 .85:1 .75:1 .85:1 NO NO NO NO 3.6 Back Drilling Capabilities Minimum Back Drill Drilled Diameter .022 .020 .022 .020 .022 .020 NO NO Drilled Hole Over Finished Hole Size .012 .010 .012 .010 .012 .010 NO NO Drill Depth Tolerance +/- .008 +/- .005 +/-.008 +/-.005 +/-.008 +/-.007 NO NO Number of Drilled Depths per Side MULTIPLE MULTIPLE MULTIPLE MULTIPLE 1 MULTIPLE NO NO 3.7 Scoring Capabilities Angles: 60° 30° / 45° 30° 30° 30, 45, 60 30, 45, 60 30, 45, 60 30, 45, 60 Offset Tolerance: +/- .010 +/- .005 +/- .003 +/- .002 +/- .003 +/- .002 +/- .003 +/- .002 Optimum Remaining Web Thickness: .018 .012 .015 .012 .015 .012 .015 .012 Remaining Web Tolerance +/- .005 +/- .003 +/- .005 +/-.002 +/- .005 +/- .003 +/- .005 +/- .003 True Position Tolerance: .010 .005 .008 .005 .008 .005 .008 .005 3.8 Edge Connector Bevel Capabilities Finger Tip Angle: 45° 30° / 20° 49°, 45°, 40° 30°, 20° 20°, 30°, 45°, 60° 20°, 30°, 45°, 60° 20°, 30°, 45°, 60° 20°, 30°, 45°, 60° Bevel Depth Tolerance: +/- .010 +/- .005 +/- .008 +/- .005 +/-.010 +/- .008 +/-.010 +/- .008 3.9 Profile Capabilities Standard Router Bit Diameter: .093 & .125 .062,.039,.031 1.6 mm, 2.4mm, .125 .031, 1mm .062, .093, .031, .039, .125 1.6mm, 2.4mm 2.0mm Routed Profile Tolerance: (18”X 24” Panel): +/- 0.005 +/- 0.004 +/- 0.005 +/- 0.004 +/- 0.005 +/- 0.004 +/- 0.005 +/- 0.004 Routed Cutout Tolerance: (0.50” x 0.50”): +/- 0.005 +/- 0.004 +/- 0.005 +/- 0.004 +/- 0.005 +/- 0.004 +/- 0.005 +/- 0.004 Minimum Internal Rout Radius: > .031 0.016 > .031 0.016 0.031 0.024 >.031 .031 Minimum Routed Slot Width: > .062 .062 - .031 > .062 .062 - .031 .062 .062 - .031 .062 .062 4.0 Feature Size Capabilities 4.1 Innerlayer Capabilities Minimum Conductor Width Internal Starting Copper Weight ½ oz.: .00325 .003 .00325 .003 .0035 .00325 .005 .004 Internal Starting Copper Weight 1 oz.: .004 .0035 .004 .0035 .00425 .004 .006 .005 Internal Starting Copper Weight 2 oz.: .006 .0055 .006 .0055 .006 .0055 .008 .007 Internal Starting Copper Weight 3 oz: NO YES NO YES NO NO .011 .010 Minimum Conductor Spacing: (Airgap) Internal Starting Copper Weight ½ oz.: .0035 .00325 .0035 .00325 .00375 .0035 .005 .004 Internal Starting Copper Weight 1 oz.: .004 .004 .004 .004 .00425 .004 .006 .005 Internal Starting Copper Weight 2 oz.: .006 .0055 .006 .0055 .006 .0055 .008 .007 Internal Starting Copper Weight 3 oz.: NO YES NO YES NO NO .011 .010 4.2 Outerlayer Capabilities (Finished Cu Thick) (Finished Copper Thickness with Base Foil and Plating) (Finished Copper Thickness with Base Foil and Plating) (Finished Copper Thickness with Base Foil and Plating) Minimum Conductor Width (Finished Copper Thickness with Base Foil and Plating) External Copper Thickness 1.5 mil: .004 .003 .0035 .003 .0045 .004 .005 .0045 External Copper Thickness 2.0 mil: .0045 .0035 .004 .0035 .005 .0045 .006 .005 External Copper Thickness 2.5 mil: .0055 .005 .0055 .005 .0055 .005 .007 .006 External Copper Thickness 3.0 mil: .007 .006 .007 .006 .007 .006 .008 .0065 Minimum Conductor Spacing: (Airgap (Finished Copper Thickness with Base Foil and Plating) (Finished Copper Thickness with Base Foil and Plating) (Finished Copper Thickness with Base Foil and Plating) (Finished Copper Thickness with Base Foil and Plating) External Copper Thickness 1.5 mil: .004 .003 .004 .0035 .0045 .0045 .005 .005 External Copper Thickness 2.0 mil: .0045 .0035 .0045 .004 .005 .005 .006 .0055 External Copper Thickness 2.5 mil: .005 .004 .006 .0055 .0055 .0055 .007 .0065 External Copper Thickness 3.0 mil: .007 .006 .007 .006 .007 .006 .008 .007 4.3 Pad Diameter to Finished Hole Size Conventional Drilling: Minimum Pad / Drill / Plated Hole: (Pad Size for Tangency. Add 2X minimum annular ring as needed.) PAD / DRILL / HOLE PAD / DRILL / HOLE PAD / DRILL / HOLE PAD / DRILL / HOLE PAD / DRILL / HOLE PAD / DRILL / HOLE PAD / DRILL / HOLE PAD / DRILL / HOLE .062 Thick Board: .020/.010/.006 .018/.008/.004 .020 / .010 / .006 .018 / .008 / .004 .020 / .010 / .006 .019 / .010 / .006 .024 / .014 / .010 .022 / .012 / .008 .093 Thick Board: .020 / .010 / .006 .019 / .010 / .006 .020 / .010 / .006 .019 / .010 / .006 .020 / .010 / .006 .019 / .010 / .006 .026 / .016 / .010 .024 / .014 / .010 .125 Thick Board ( .120 for HY only): .020 / .010 / .006 .019 / .010 / .006 .020 / .010 / .006 .019 / .010 / .006 .020 / .012 / .006 .019 / .010 / .006 N/A N/A .150 Thick Board: .022 / .012 / .008 .020 / .010 / .005 .022 / .012 / .008 .020 / .010 / .005 .024 / .013 / .009 .022 / .012 / .008 N/A N/A .187 Thick Board: .024 / .014 / .010 .022 / .012 / .008 .024 / .014 / .010 .022 / .012 / .008 .026 / .016 / .012 .024 / .014 / .010 N/A N/A Micro Drilling: Laser Via Blind Via: .012/.006/.003 .010/.005/.003 .012/.004/.004 .011/.004/.004 NO NO N/A N/A Micro Drilling: Mechanical Via Blind Via: .012/.006/.003 .010/.005/.003 .020 / .010 / .006 .019 / .008/ .004 NO NO .024 / .014 / .010 .022 / .012 / .008 Merix Corporation Page 3 of 5 Rev:090128
    • San Jose Oregon Huiyang Huizhou Volume Production Controlled Volume Production Volume Production Controlled Volume Production Volume Production Controlled Volume Production Volume Production Controlled Volume Production Class A Class B Class A Class B Class A Class B Class A Class B 5.0 Solder Mask and Silkscreen 5.1 Solder Mask Minimum Solder Mask Clearance: (LPI) Pad size larger than NPTH: .010 .006 .010 .006 .010 .006 .010 .006 Over Surface Image (pad relief): .006 .003 .005 .004 .006 .005 .006 .005 Web Between Surface Mount Pads: .004 .003 .003 .002 .004 .003 .004 .003 IPC SPEC COVERAGE IPC SPEC COVERAGE IPC SPEC COVERAGE IPC SPEC COVERAGE Solder Mask Thickness Over Metal: (SPC RANGES .0002 - .003 TYPICAL = .0007 over (SPC RANGES .0002 - .003 TYPICAL = .0007 over (SPC RANGES .0002 - .003 TYPICAL = .0007 over (SPC RANGES .0002 - .003 TYPICAL = .0007 over conductor) conductor) conductor) conductor) BLUE, RED, BLACK, Solder Mask Colors: GREEN GREEN RED, BLUE, BLACK GREEN BLUE, RED,BLACK GREEN, BLUE RED, BLACK YELLOW, WHITE TAIYO PSR4000-G23K semi-gloss, Huntsman Solder Mask Type: TAIYO-PSR4000 - HFX TAIYO-PSR4000 - HFX (Probimer77) TAIYO, Huntsman Minimum Mask Defined Pad Diameter: .012 .010 .012 .010 .012 .010 .012 .010 Mask Defined Pad Minimum Overlap of Copper: .005 .0025 .005 .0025 .005 .0025 .005 .0025 5.2 Silkscreen Minimum Width Silk Screen Image: .007 .005 .006 .005 .006 .005 .007 .006 Nomenclature Colors WHITE BLACK, YELLOW WHITE BLACK, YELLOW WHITE BLACK, YELLOW WHITE BLACK, YELLOW 6.0 Via-in-Pad - HDI 6.1 Epoxy Filled – Non Conductive Epoxy Filled Thru Hole Capability: YES YES YES YES NO Yes NO NO Epoxy Filled Thru Hole Minimum: .010 .0072 .010 .008 NO .010 NO NO Epoxy Filled Thru Hole Maximum: .018 .020 .020 .035 NO .020 NO NO Epoxy Filled μVia Process: YES YES YES YES NO NO NO NO Epoxy Filled μVia Hole Minimum: .0055 .004 .0055 .004 NO NO NO NO Minimum Board Thickness: .025 .020 .020 .020 NO .020 NO NO Maximum Board Thickness: .125 .180 .120 .180 NO .120 NO NO Via Fill Aspect Ratio: 8:1 12:1 10:1 12:1 NO 12:1 NO NO Maximum Panel Size for μVia: 12 X 18 18 X 24 18 X 24 21 X 24 NO 18 X 24 NO NO .004 / .0045 with Wrap Spec Outerlayer Trace Widths/Spacing .004 / .005 .0035 / .0045 .004 / .005 Class II NO .0045 / .005 NO NO 6.2 Copper Plated/ Filled Copper Filled μVia Process: NO NO NO YES NO NO NO NO Copper Filled μVia Hole Minimum: NO NO NO .004” NO NO NO NO Copper Filled μVia Hole Maximum: NO NO NO .005” NO NO NO NO Via Fill Aspect Ratio: NO NO NO .85:1 NO NO NO NO Maximum Board Thickness: NO NO NO <.150” NO NO NO NO .004”/.004” with LB to Outerlayer Trace Widths/Spacing: NO NO NO Pattern NO NO NO NO Combined with other fill technologies NO NO NO Must be reviewed NO NO NO NO 7.0 Military 7.1 Etch Back 2 Pt. Connection YES YES FR406, 370HR, FR408, Nelco-13, IS415, and Polyimide NO NO NO NO 3 Pt. Connection ( glass etch) YES YES FR406, 370HR and Polyimide NO NO NO NO 8.0 Cavity Boards - TMS Through Rout Technology: NO YES YES YES NO NO NO YES Step Rout Technology: NO YES YES YES NO NO NO YES 9.0 Thermal Management Technology 9.1 Coin Attached Conductive Adhesive: NO NO YES YES NO NO NO YES Solder Adhesive: NO NO NO YES NO NO NO NO 9.2 Pallet Attached Conductive Adhesive: NO NO YES YES NO NO NO YES Embedded Copper Technology(Merix Patent Pending): NO NO YES YES NO NO NO NO 10.0Surface Finishes Options 10.1 Surface Finishes Selection Hot Air Solder Level: YES YES YES YES YES YES YES YES Immersion Silver: Enthone Alpha Star MacDermid Sterling MacDermid Sterling MacDermid Sterling Lead Free OSP : Shikoku F2(LX) Shikoku F2(LX) Enthone 106AX-HT Shikoku F2(LX) Electroless Nickel Immersion Gold: YES YES YES YES YES YES YES YES Immersion Tin: YES YES NO Yes – thru SJ YES YES NO Processed in Huiyang Full Body Gold: YES YES – 4 mil spacing on .5 oz YES YES NO NO YES – 5:1 YES Bondable Gold: YES YES – 4 mil spacing on .5 oz NO NO NO NO NO NO Merix Corporation Page 4 of 5 Rev:090128
    • San Jose Oregon Huiyang Huizhou Volume Production Controlled Volume Production Volume Production Controlled Volume Production Volume Production Controlled Volume Production Volume Production Controlled Volume Production Class A Class B Class A Class B Class A Class B Class A Class B 10.2 Mixed Finishes Immersion Silver with Selective Hard Gold: YES YES YES YES NO YES – tie bar NO YES – tie bar HASL with Selective Gold: YES YES YES YES NO YES NO YES Dual Gold Plating: YES YES YES YES NO NO YES YES Immersion Gold with OSP: YES YES NO NO NO NO NO NO Immersion Gold with Selective Hard Gold: NO YES NO YES NO YES – tie bar NO Yes Selective Hard Gold with OSP: YES YES YES YES YES YES – tie bar YES YES Recessed Fingers: YES YES NO NO NO NO YES YES 10.3 Lead-Free Surface Finishes Immersion Silver: YES YES YES YES YES YES YES YES Lead Free OSP : Shikoku F2(LX) Shikoku F2(LX) Shikoku F2(LX) Enthone 106AX-HT Electroless Nickel Immersion Gold: YES YES YES YES YES YES YES YES Immersion Tin: YES YES NO YES YES YES NO NO Full Body Gold: Processed in Huizhou YES YES YES YES NO NO YES Lead-Free HASL: NO YES – Outside Service NO YES – Outside Service NO NO NO NO 11.0 Testing Capabilities Minimum Test Continuity Resistance: 20 OHMS 10 OHMS 20 OHMS < 20 OHMS 50 OHMS 20 OHMS 50 OHMS 20 OHMS Maximum Test Voltage: 100V 200V 100V 250V 250V 250V 250V 250V Maximum Test Isolated Resistance: 10M OHMS 50M OHMS 10M OHMS 100M OHMS 10M OHMS 20M OHMS 20M OHMS 30M OHMS Largest Test Bed Fixtured: 12 X 19.3 16.5 X 22.5 29.6 x 19.2 DD 29.6 x 19.2 DD DOUBLE SIDED DOUBLE SIDED Largest Test Bed Flying Probe: 20 X 24 20 X 24 24X27 24X27 24 X 26 24 X 36 15.6x21.6 15.6x21.6 Electrical Test Pitch (Fixture Test): 0.019 0.016 .020 .016 .025 .020 .025 .020 Electrical Test Pitch (Flying Probe Test): 0.008 0.004 .010 .005 .010 .005 .010 .008 DC Line Resistance Testing: NO YES NO YES NO NO NO YES Prop Delay: NO NO YES YES NO NO NO NO 12.0 Electrical Performance TDR Test Tolerance (Print and Etch): +/- 10% +/- 7.5% +/- 10% +/- 7.5% +/- 15% +/- 10% +/- 10% +/- 10% TDR Test Tolerance (Plated Copper): +/- 15% +/- 10% +/- 10% +/- 10% +/- 15% +/- 10% +/- 15% +/- 10% TDR Test Tolerance Differential Measurements: +/- 15% +/- 10% +/- 10% +/- 10% +/- 15% +/- 10% +/- 15% +/- 10% TDR Tolerance Single Ended Tolerance: +/- 10% +/- 7.5% +/- 10% +/- 10% +/- 15% +/- 10% +/- 15% +/- 10% HiPot Testing (AC & DC): NO YES YES YES NO YES YES (DC) YES (DC) 13.0 Data & Documentation 13.1 Tooling Formats Film Data Formats: ODB++ RS-274X ODB++ RS-274X ODB++ RS-274X ODB++ RS-274X Drill Data Formats: ODB++ NC DATA & GERBER ODB++ NC DATA & GERBER ODB++ NC DATA & GERBER ODB++ NC DATA & GERBER Route Data Formats: ODB++ NC DATA & GERBER ODB++ NC DATA & GERBER ODB++ NC DATA & GERBER ODB++ NC DATA & GERBER Electrical Test Formats: ODB++ IPC-D-356A ODB++ IPC-D-356A ODB++ IPC-D-356A ODB++ IPC-D-356A IPC-D-356A OR MENTOR IPC-D-356A OR MENTOR IPC-D-356A OR MENTOR Netlist Compare Formats: ODB++ ODB++ ODB++ ODB++ IPC-D-356A OR MENTOR NEUTRAL FILE NEUTRAL FILE NEUTRAL FILE 13.2 Tooling Communication FTP FTP FTP FTP Media Types & Data Transfer: ftp.sj.merix.com ftp.merix.com ftp.asia.merix.com ftp.asia.merix.com E-mail E-mail E-mail E-mail cam@sj.merix.com cam@fg.merix.com cam@hy.merix.com hzphoto@asia.merix.com Compression Formats: ZIP, TAR, TGZ RAR, ARC ZIP, TAR, TGZ RAR, ARC ZIP, TAR, TGZ RAR, ARC ZIP, TGZ RAR Secured Transfer: FTP PGP ENCRYPTION FTP PGP ENCRYPTION FTP PGP ENCRYPTION FTP PGP ENCRYPTION Merix – San Jose Merix – Oregon Merix - Huiyang, China Merix – Huizhou, China 355 Turtle Creek Court 1521 Poplar Avenue 23 Yin Ling Lu, Chen Jiang Town, Hui Yang City 16 Gu Tang Au, Industrial District, Huizhou City San Jose, California 95125 Forest Grove, Oregon 97116 Guang Dong Province, 516229 China Guang Dong Province, China Phone: (800) 800-3278 Phone: (888) 256-3749 Phone: 86 752 2617 111 Phone: 86 752 2266 111 Direct: (408) 280-0422 Direct: (503) 359-9300 FTP: ftp.asia.merix.com FTP: ftp.asia.merix.com FTP: ftp.sj.merix.com FTP: ftp.merix.com Merix Corporation Page 5 of 5 Rev:090128