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2013 IEEE CPMT IMPACT Final Program
 

2013 IEEE CPMT IMPACT Final Program

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2013 IEEE CPMT IMPACT Final Program

2013 IEEE CPMT IMPACT Final Program

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    2013 IEEE CPMT IMPACT Final Program 2013 IEEE CPMT IMPACT Final Program Document Transcript

    • IMPACT-IAAC 2013 Plenary Speech Special Session IAAC Packaging Session PCB Session Poster Session Day 1-October 22 (Tuesday) 13:30-17:30 IAAC 2013 Opening & Meeting ROOM R 503 Day 2-October 23 (Wednesday) ROOM R 504 a+b+c 10:00-10:20 Opening of IMPACT 2013 10:20-11:10 Ricky Shi-Wei Lee, President of the IEEE-CPMT Society Topic: From MOOREfication to LEDification 11:10-12:00 Dyi Chung Hu, Senior Vice President of Unimicron Topic: The Challenges of IC Substrate in 3D Era 12:00-13:30 Lunch & ALC Committee Meeting 13:30-15:30 Panel Discussion- Sustainable Manufacture Topic: Designing Electronic Products for Sustainable Manufacture Chair: Dr. Charles E. Bauer & Dr. Shen-Li Fu 15:30-15:45 Poster Session (PCB) / Coffee Break ROOM ROOM 504 a ROOM 504 b+c 【2】IAAC- Global Business Council 【1】Advanced 15:45-18:00 Packaging (SPIL) ROOM 503 【3】Advanced Packaging I ROOM 501 ROOM 502 【4】Advanced and 【5】IP Session Emerging Technology TPCA Show & IMPACT-IAAC 2013 Joint Reception & Award Ceremony (3F) 18:00-20:00 Day 3-October 24 (Thursday) ROOM R 504 b+c 09:30-10:20 Yasumitsu Orii, Senior Manager of IBM Japan Topic: Next Generation Computer System for the Era of Big Data ROOM 10:30-12:30 ROOM 504 b+c 【6】ICEP Japan Session ROOM 504 a 【7】3D Integration I 12:30-13:30 ROOM 503 ROOM 501 ROOM 502 【8】Thermal 【9】Modeling, Simulation 【10】Green Materials Management I & Design I & Process Lunch ROOM R 504 b+c 13:30-14:20 Kyong Wook Paik, Professor of Materials Sci. & Eng., KAIST Topic: Recent Advances in Anisotropic Conductive Technology: Materials & Processing ROOM ROOM 504 b+c 14:30-17:30 【11】3D IC Forum 15:45-16:00 ROOM 504 a ROOM 503 ROOM 501 ROOM 502 【12】Advanced 【13】Interconnections & 【14】Modeling, Simulation 【15】Test & Quality Nanotechnology & Design II Packaging II Poster Session (Packaging) / Coffee Break Day 4-October 25 (Friday) ROOM R 504 b+c 09:30-10:20 Islam Salama, Sr. Manager of Intel Topic: Enabling Continuum Computing Thru Innovation in Packaging Substrate & Assembly ROOM 10:30-12:15 12:30-18:30 ROOM 504 b+c ROOM 504 a ROOM 503 ROOM 501 ROOM 502 【18】LED & Thermal 【19】Modeling, Simulation 【20】HDI & 【16】iNEMI Reliability 【17】3D Integration II Session Management & Design III Embedded Plant Visit & Culture Tour (Only for Overseas Attendees)
    • Floor Plan @ Organizer’s Office Registration Speaker’s Preview Room WIFI for 5F Poster 4F Poster Poster 5F Poster Poster Room 501 Room 502 Room 503 Room 504 A Room 504 B+C EAssembly Green Tech 2013 PCB Thermal TPCA SHOW 2013 .Outlook 2014 Asia Electronics Industry Trends Forum in Room 401 (Oct.24) 3F Canton Chinese Restaurant @ Conference Room Dining Room (Conference Attendees Only) Coffee Break WiFi Award Ceremony TPCA Show & IMPACT Joint Reception
    • Index Agenda of Conference. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Inside Cover Organizer, Co-Organizer and Sponsor . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 Greeting of Chair Welcome Message from Wun-Yan Chen , Conference General Chair. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2 Welcome Message from Shen-Li Fu, Conference Co-Chair . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3 . . Welcome Message from CT Liu, Conference Co-Chair. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4 Welcome Message from Rick Wu, Conference Co-Chair. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5 Committee Member. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6 General Information About Conference / Hotel Information. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9 TPCA Show & Welcomee Reception / International Welcome Dinner . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11 Registration Desk / Organizer’s Office / Speaker Preview Room. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12 City Tour / About Taiwan . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14 Inquiries. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17 Conference Plenary Speeches. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18 IAAC Opening & Meeting. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 23 Panel Discussion. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 24 Sessions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 25 Posters. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 45 Abstracts. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 49 2013 IMPACT Outstanding Paper Award. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 92 Sponsor AD Industrial session: SPIL. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 93 Gold: TSMC. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 94 Silver: ASE. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 95 Silver: ATOTECH . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 95 Note. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Pre-Announcement- IMPACT 2014 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 96 Inside Back Cover
    • IEEE COMPONENTS, PACKAGING, & MANUFACTURING TECHNOLOGY SOCIETY (IEEE CPMT Taipei) Industrial Session Award Sponsor SILICONWARE PRECISION INDUSTRIES CO., LTD.(SPIL) Career Technology (Mfg.) Co., Ltd. Special Sponsor & General Sponsor Organizer Dow Electronic Materials INTERNATIONAL MICROELECTRONICS AND PACKAING SOCIETY TAIWAN (IMAPS Taiwan) INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE, TAIWAN (ITRI) ITEQ CORPORATION ADVANCED SEMICONDUCTOR ENGINEERING INC. (ASE) Atotech Taiwan Limited Shenzhen Printed Circuit Association TAIWAN PRINTED CIRCUIT ASSOCIATION (TPCA) Shanghai Unitech Electronics Co.,Ltd. Co-Organizer Brominated Science and Environmental Forum (BSEF) Taiflex Scientific co., Ltd. Communication Research Center, NTU 2013 Dow Electronic Materials TIMA International Conference on Electronics Packaging International Conference on Electronics Packaging (ICEP) INTERNATIONAL ELECTRONICS MANUFACTURING INITIATIVE (iNEMI) I-SHOU UNIVERSITY (ISU) Surface Mount Technology Association (SMTA) Eternal Chemical Co., Ltd. 3D IC Forum Sponsor Taiwan Semiconductor Manufacturing Company Limited (tsmc) WPCA Zhen Ding Tech. CSUN MFG. LTD TAIWAN THERMAL MANAGEMENT ASSOCIATION (TTMA) ▲ 1
    • Welcome Message from Wun-Yan Chen, Conference Chair Wun-Yan Chen Chairman, IMAPS-Taiwan It gives me great pleasure to represent the Organizing Committee to welcome you participating in the IMPACT-IAAC 2013 joint conference. Over the past years, IMPACT conference continually pays attention to the latest trends of global micro-system, packaging and circuit technology, and encouraging the development and research of new materials, processes and designs in realizing the versatile system demands for advanced consumer, communication, mobile computing, medical and automobile applications. Due to the efforts, IMPACT conference has been successfully established as an international platform for information exchange and experience shared by experts from all over the world. Recently, we witnessed a significant increase of concern among the peoples of the world with the rational utilization of renewable natural resources, and also there is a greater consciousness today of the links with the research which leads to a better understanding and knowledge of environmental issues. This year, catering to the eco-technology trends, the IMPACT-IAAC 2013 joint conference highlights “Green & Cloud: Creating Value and Toward ECO Life”, and elaborately arranges the panel sessions, invited talks, industrial sessions and outstanding paper presentations, with a view to pushing the research and development of ICT products to gain further effective improvements in system performance and integration, and innovating to alleviate environmental damages. We hope this Conference to be successful and to become an important and valuable resource under your contribution and participation. The challenges in front of us are significant, but I am confident that we will succeed in your zealously dedication. I wish you have a very pleasant stay here, and have a productive and successful meeting. Finally, I would like to thank to the working team members and the organizing committee members, and also express my particular appreciations to the collaboration with ICEP (International Conference on Electronic Packaging), iNEMI (The International Electronics Manufacturing Initiative), and IAAC (IMAPS All Asia Conference). Wun-Yan Chen Chair, Organizing Committee ▲ 2
    • Greeting Welcome Message from Shen-Li Fu, Conference Co- Chair Shen-Li Fu Chairman, IEEE CPMT-Taipei Honorary President, I-Shou University Chairman, SMTA-Taiwan As the Co-Chair of the Organizing Committee, IMPACT-IAAC2013, I take it a great pleasure to welcome friends, colleagues, and participants from all over the world attending this wonderful event. IMPACT-IAAC2013 is the eighth conference jointly organized by IEEE-CPMT Taipei Chapter, IMAPS Taiwan Chapter, ITRI (Industrial Technology Research Institute), I-Shou University and TPCA (Taiwan Printed Circuit Association). It is one of the most important events of this kind in the world, and is acknowledged for its intensive connections between industries and academia. Several unique arrangements of IMPACT-IAAC 2013 are as the follows. First, the conference will be a joint event of IMPACT and IAAC this year. Second, follows the footsteps of the previous conferences, there will still be Industrial Forums this year: Advanced Packaging-SPIL and 3D IC Forum. There will also be several special forums: ICEP (Japan Packaging Session), iNEMI (iNEMI Session) and a Panel Discussion (Chaired by Dr. Charles E. Bauer). Thanks again for your participation. I hope, and I am sure, you will have fruitful discussion and expand cooperation. Wish you all have a pleasant and enjoyable stay in Taiwan and looking forward to seeing you in person. Shen-Li Fu Chairman, IEEE CPMT-Taipei Honorary President, I-Shou University Chairman, SMTA-Taiwan ▲ 3
    • Welcome Message from Dr. CT Liu, Conference Co-Chair Dr. CT Liu Vice President & General Director, ITRI On behalf of the Organizing Committee, it is my great pleasure to welcome you to “IMPACT 2013”, the 2013 International Microsystems, Packaging, Assembly and Circuits Technology Conference. The theme of 2013 IMPACT is “Green & Cloud: Creating Value and Toward Eco-Life”. All participants will enjoy many well organized technical events by our Technical Program Committee and Organizers, including IEEE, CPMT-Taipei, IMPAS-Taiwan, ISU University, TPCA, and ITRI. In this 3-day conference, you will have the chance to attend the IMPACT speeches and meet renowned Plenary Speakers who will share their visions on technology trends. In addition, there will be 4 Special Sessions and 1 Special Forum presented by experts in advanced packaging technologies moving toward system scaling and integration. Your involvement brings together the world’s leading researchers, engineers, and industrial experts. I would also like to express my sincere appreciation to everyone who has helped in organizing this conference, in particular, the Local Organizing Committee and the Technical Program Committee, and sincere gratitude to all of our sponsors and partners as well. Again, welcome to IMPACT 2013 –“Green & Cloud: Creating Value and Toward Eco-Life”! Wish you all have a pleasant and enjoyable conference and stay in Taiwan. CT Liu, Ph.D. Vice President &General Director, ITRI ▲ 4
    • Greeting Welcome Message from Rick Wu, Conference Co-Chair Rick Wu Chairman, Taiwan Printed Circuit Association (TPCA) As a Co-Chair of IMAPCT Conference, it is my pleasure and privilege in welcoming you to join IMPACT-IAAC 2013. This year, the 2nd IAAC (IMAPS All Asia Conference) is combined to IMPACT organized by IEEE CPM-Taipei, iMAPS-Taiwan, ITRI and TPCA will be held in conjunction with TPCA Show 2013 on 22nd -25th at Taipei Nangang Exhibition Center. As we know IMPACT is the largest Electronic Packaging and PCB Conference which has become the benchmark event in the world. This year, IMPACT arranges two thematic Industrial Forums-SPIL-Advanced Packaging and 3D IC Forum. In addition, there are many special sessions such as IAAC GBC session, Japan Packaging session, iNEMI session, Panel Discussion and IP Session. Furthermore, TPCA offers rich scholarship for the Outstanding Paper Award winner from PCB and Packaging and supports them traveling to join ECWC 13 conference in Germany next year. I believe it must attract many experts and elites from world-wide to participate. Moreover, as a host of TPCA Show, I would like to invite you to visit TPCA Show 2013 taking place on the fourth floor of Nangang Exhibition Center. Base on the full support from TPCA members, TPCA Show 2013 has 1,320 booths consisted by 350 exhibitors which increased 11% compared to last year. Finally, I wish TPCA show 2013 and IMPACT Conference to make a big success and to become a valuable resource under your contribution and participation. Sincerely Yours, Ricky Wu Chairman, Taiwan Printed Circuit Association (TPCA) ▲ 5
    • Committee Member Conference Chair Wun-Yan Chen iMAPS-Taiwan Conference Honorary Chair Ku-Ning Chiang NTHU Yi-Jen Chan Hermes-Epitek Corp. Conference Co-Chair Shen-Li Fu IEEE-Taiwan CT Liu ITRI Rick Wu TPCA Conference Executive Co-Chair Bo-Bin Tsai AVC Co., Ltd. Dyi Chung Hu Unimicron Heinz Ru Tong Hsing Electronic Mike Ma SPIL Shin-Puu Jeng TSMC Technical Program Committee Chair Yu-Hua Chen IMAPS-Taiwan/ITRI Co-Chair Hsiang-Chen Hsu I-SHOU University Co-Chair Hsien-Chie Cheng Feng Chia University Co-Chair Rolf Aschenbrenner Fraunhofer IZM Co-Chair Yasumitsu Orii IBM Japan SubCommittee Chair Wei-Chung Lo ITRI SubCommittee Chair Frank Bai TPCA SubCommittee Chair Jen-Dong Hwang TTMA China Haley Fu iNEMI Germany Andreas Ostmann Fraunhofer IZM Singapore(Malaysian) Chuan-Seng Tan Nanyang Technology University Taiwan Ben-Je Lwo National Defense University Taiwan C. Robert Kao National Taiwan University Taiwan Chang-Chun Lee Chung Yuan Christian University Taiwan Chao, Shin Hua ASE Taiwan Charlie Lu Altera Taiwan Chen, Kuan-Neng National Chiao Tung University Taiwan Chi-Chuan Wang National Chiao Tung University Taiwan Chih Chen National Chiao Tung University Taiwan Cho-Liang Chung I-SHOU University Taiwan D. S. Liu National Chung Cheng University ▲ 6
    • Committee Taiwan Dennis Lin TPCA Taiwan Jeffrey Lee IST Taiwan Jenn-Ming Song National Chung Hsing University Taiwan John Liu BoardTek Electronics Corporation Taiwan K. M. Chen UMC Taiwan Kuan-Jung Chung National Changhua University of Education Taiwan Kun-Nan Chen Tungnan University Taiwan L. S. Chen SMTA Taiwan M. Y. Tsai Chang Gung University Taiwan Mei-Ling Wu National Sun Yat-Sen University Taiwan Shih-Kang Lin National Cheng Kung University Taiwan Shung-Wen Kang Tamkang University Taiwan Tz-Cheng Chiu National Cheng Kung University Taiwan Yi-Shao Lai ASE Taiwan Yu-Po Wang SPIL USA John Xie Altera USA Yung-Yu Hsu MC10 Inc. Domestic Advisory Board Albert Lan 藍章益 SPIL David Wang 王 偉 ChipMOS George Yang 楊志海 Atotech Taiwan Limited James Ho 何信芳 Nan Ya Printed Circuit Board Corp. Jao-Hwa Kuang 光灼華 National Sun Yat Sen University Maurice Lee 李長明 Unimicron Technology Corp. S. J. Hwang 黃聖杰 National Cheng Kung University Stephen Wang 王仙壽 ETERNAL CHEMICAL CO.,LTD International Advisory Board Shi-Wei Ricky Lee Co Chair Finland Hong Kong Japan Japan Japan Japan Japan Japan Kwang-Lung Lin Paul Collander Enboa Wu Masahiro Aoyagi Masaru Ishizuka Masayoshi Esashi Noriyuki Miyazaki Toshio Tomimura Yutake Tsukada Hong Kong University of Science and Technology IEEE CPMT Society Materials Science & Engineering, National Cheng Kung University (NCKU) Poltronic ASTRI National Institute of Advanced Industrial Science and Technology Toyama Prefectural University Tohoku University Department of Mechanical Engineering and Science, Kyoto University Kumamoto University The president of JIEP (Japan Institute of Electronic Packaging). Both IMAPS-Japan and CPMT-Japan 7 ▲ Chair
    • Malaysia Malaysia Singapore Taiwan UK USA USA USA USA USA USA USA USA Mohd Zulkifly Abdullah Wong Shaw Fong Andrew Tay Wen-Hwa Chen Chris Bailey Charles Bauer Jay Dasai Jie Xue Michael Pecht Ning-Cheng Lee Robert C. Pfahl Sung Yi Voya Markovich Univeristy Sains Malaysia (USM) Intel Coorporation National University of Singapore National Applied Research Laboratories (NARL) University of Greenwich TechLead Corp. MFLEX Cisco Systems, Inc. Center for Advanced Life Cycle Engineering/University of Maryland Indium Corp. International Electronics Manufacturing Initiative (iNEMI) Portland State University IMAPS Local Organizing Committee Chair Long-Shien Lin (IMAPS-Taiwan/ITRI) Local Committee Co-Chair Yu-Jung Huang (ISU) Subcommittee-Chair R. S. Lee (ITRI) Hung-Yin Tsai (NTHU) Chi-Shiung Hsi (NUU) David Lai (TPCA) Michelle Hung (TPCA) Secretariat Jun-Man Lin (ITRI) Sophia Huang (TPCA) Sylvia Yang (TPCA) Erik Yu (TPCA) Registration Jessie Chiu (TPCA) Public Relations Jessie Chiu (TPCA) ▲ 8
    • Information IMPACT- IAAC Conference 2013 The 8th International Microsystems, Packaging, Assembly and Circuits Technology Conference In order to avoid dangerous climate change, provide sustainable green energy and better life for global population, the ICT products and services need to gain further effective improvements in system performance and integration, and innovate to reduce environmental impact. Over the past years, IMPACT conference, a remarkable platform, continually pay attention to the latest trends of global micro-system, packaging and circuit technology, and encourage the development and research of new materials, processes and designs in realizing the versatile system demands for advanced consumer, communication, cloud & mobile computing, medical and automobile applications. IMPACT sincerely welcomes you to IMPACT-IAAC 2013 Joint Conference which will be held in conjunction with TPCA Show 2013 on 22nd -25th at Taipei Nangang Exhibition Hall. This year, the 2nd IAAC (IMAPS All Asia Conference) is rotated in Taiwan, and a joint international conference of IMPACT and IAAC is organized by IEEE CPMT-Taipei, iMAPS-Taiwan, ITRI and TPCA. To cater for the technology trends, the theme of IMPACT-IAAC 2013 highlights “Green & Cloud: Creating Value and Toward Eco-Life” and will arrange Panel Sessions, invited talks, industrial sessions and outstanding paper presentations. Furthermore, IMPACT keeps collaborating with International organizations such as ICEP from Japan and iNEMI from U.S.A. We hope this Conference to be successful and to become an important and valuable resource under your contribution and participation General Information Date: October 22(Tue) - October 25 (Fri), 2013 Venue: Taipei Nangang Exhibition Hall, Taipei, Taiwan ■ Conference: IMPACT-IAAC Conference ■ Exhibition : TPCA Show 2013 ■ Theme: Green & Cloud: Creating Value and Toward Eco-Life ■ ■ Hotel Information To enjoy the discount for IMPACT conference attendees, please book your hotel right away and make further followup confirmation with the hotel. No. HOTEL Price Contact Person Venue 1 國賓大飯店 The Ambassador Hotel ★Contract No. E9800011 Executive Single: $5,150+10% Executive Twin: $5,750+10% 李姿瑩 Sonia Lee sonia.lee@mstp.ambhotel.com.tw Tel:886-2-25511111 Fax:886-2-25617883 捷運雙連站旁 Shuanglian Side 2 台北凱撒大飯店 Caesar Park Taipei ★Contract No. 台灣電路板協會 Single Room: $4,000 Twine Room: $4,600 葉虹吟 Fanny Yeh fanny_yeh@caesarpark.com.tw Tel:886-2-2311-5150 Ext. 2420 Fax:886-2-2371-0936 台北車站旁 Taipei Main Station 3 兄弟大飯店 Brother Hotel ★Contract No. AE648A Standard Single: $3,350 Twin Room: $4,200 訂房組 Tel:886-2-2713-0567 Fax:886-2-2717-3334 捷運南京東路站旁 Nanjing E Rd. Side ▲ 9
    • No. HOTEL Price Contact Person Venue 4 麗湖大飯店 City Lake Hotel ★Contract No. 73765919 Standard Single: $2,838 Deluxe Twin: $3,168 潘伯進 lake.hotel@msa.hinet.net Tel:886-2-26342136 Fax:886-2-26346136 捷運葫洲站旁 Huzhou Side 5 太平洋商務飯店 Pacific Business Center ★Contract No. E191 Surperior Room: $3,800(1 breakfast) Surperior Room: $4,000(2 breakfast) 林逸萍 Tina pbc.taipei@msa.hinet.net Tel:886-2-8780-8000 Fax:886-2-8780-5000 捷運站六張犁站旁 Liuzhangli Side 6 維多麗亞酒店 Grand Victoria Hotel ★Contract No. 73765919 Deluxe Room: $5,400+10% Business Room: $5,900+10% 業務組 lucy.chen@grandvictoria.com.tw Tel:886-2-85020000 Ext. 2166 Fax:886-2-66025670 捷運劍南路站旁 Jinnan Rd. Side 7 柯旅天閣-台北信義 The Tango Hotel ★Contract No. XYSC308 Deluxe King: $4,000 Executive King: $4,200 訂房組 rsvn.xy@tango-hotels.com Tel:886-2-25288000 Fax:886-2-25287676 捷運永春站旁 Yongchun Side 8 台北馥華商旅(南港館) Standard Room : $2,600 Forward Hotel Business Room : $2,800 Nangang ★Contract No. 1F2013 陳紫玲 j22684832@yahoo.com.tw Tel:886-2-66156788 Fax:886-2-66156799 捷運南港軟體園區旁 Nangang Software Park Side 9 康寧生活會館 KangNing Service Apartment ★Contract No. 73765919 Junior Suite A : $3,000 Junior Suite B : $3,250 葛觀 Tel:886-2-26348999 Fax:886-3-26347057 捷運東湖站旁 Donghu Side 10 天成大飯店 Taipei Cosmos Hotel ★Contact No. 73765919 Superior Single : 馬仲緯 Leon Ma $3,080 rv.reserve@cosmos-hotel.com.tw Executive Deluxe : $3,300 Tel:886-2-23617856 Ext. 231 Fax:886-2-23118902 台北車站旁 Taipei Main Station 11 桃園尊爵大飯店(莊敬 路) Monarch Plaza Hotel Taoyuan ★Contract No. O0003 Executive Twin : $3,102+10% Monarch Room: $3,243+10% 桃園/接駁車 Taoyuan / Shuttle Bus 12 古華花園飯店 Hotel Kuva Chateau ★Contract No. 73765919 Executive Twin: 阮梅 3,300+10% Tel:886-3-2811818 Deluxe Twin:3,700+10% Fax:886-3-2811616 ▲ 10 訂房組 sales@monarch-hotels.com.tw Tel:886-3-316-9900 Fax:886-3-317-9000 桃園 Taoyuan
    • Information Conference Venue Map TPCA Show & IMPACT Joint Reception (Taiwanese Cuisine Buffet) Date: Oct. 23, 2013 (18:00-20:00) Venue: 3F (Canton悅), Taipei Nangang Exhibition Center International Welcome Dinner Date: Oct. 24, 2013 (18:30-20:00) Venue: 4F (Formosa 寶島廳, Caesar Park Taipei) (Add : 38, Chung Hsiao W. Rd., Sec. 1, Taipei, 100, Taiwan, R.O.C.) Invited Guest: Plenary Speakers, Invited speakers, Overseas authors, VIP and Committee members Lunch Provided Organizer will arrange lunch box for every attendee. Date: Oct.23-24, 2013 Time: 12:30-13:30 Venue: 504 Identification Badges are required for admittance to all sessions, lunch and TPCA Show & IMPACT Joint Reception. Please bring it with you all the times. ▲ 11
    • Registration Desk Reception desk is located on 5th floor of Taipei Nangang Exhibition Center. Please check in and get proceedings in reception desk from 8:30AM to 17:00PM. Organizer Office Room 521 is organizer’s office on the 5th floor of Taipei Nangang Exhibition Center. Speaker Preview Room The preview room for all speakers is located in the Room 521 on the 5th floor of Taipei Nangang Exhibition Center. All speakers are advised to provide your update presentation slides or check your file in advance there. Open Hour: 9:00am - 5:30pm, October 22-25 Conference Venue Conference rooms will be located on the5th floor of Taipei Nangang Exhibition Center. Poster Session Poster session will be located on 5th floor of Taipei Nangang Exhibition Center. Internet Access Poster Registration Desk Poster Coffee Break Speaker Organizer Preview office Room Poster Wireless internet is provided on 5th floor of Taipei Nangang Exhibition Center for free. Poster Poster Room Room Room 503 501 502 ▲ 12 Room 504 A Room 504 B+C
    • Information Social Program Plant & Culture Tour Only for Oversea Attendees and Student • Schedule on Oct. 25rd afternoon *Note: The Organizer reserves the right to amend the schedule. Time Schedule Location 12:30-12:40 Gathering at 5F (in front of Impact Register Counter) Nangang Exhibition 12:40-14:00 Shuttle to Taiwan DuPont Innovation Center 14:00-15:00 Plant tour 15:00-15:30 Shuttle to Hsinchu Glass Museum 15:30-17:00 Glass Museum visit & Guided tour 17:00-18:30 Shuttle to Caesar Park Taipei Hotel DuPont Innovation Center Glass Museum • Plant tour: DuPont Innovation Center DuPont has been bringing world-class science and engineering to the global marketplace in the form of innovative products, materials, and services since 1802. The Innovation Centers bring to life the problem-solving power of private/public alliances, serve as a catalyst for growth, and serve to uncover unmet needs that will improve the lives of people everywhere. Address: No.2, Li-Hsin 4th Rd., Hsinchu Science Park Website: www.innovationcenter.dupont.com Note: the plant tour has minimum of 10 and maximum of 25 people. • Culture tour: Glass Museum Situated at the north western of Hsinchu Park, the museum was officially opened on December 18 th, 1999. The mission of the museum is to link resources of culture and tourism, assist the upgrading of Hsinchu glass industry, and introduce glass industry to the people and dealers of its development and application. Address: No.2, Sec. 1, Dongda Rd., East Dist., Hsinchu City 300, Taiwan (R.O.C.) Website: http://glassmuseum.moc.gov.tw/index.htm ▲ 13
    • City Tour Taiwan Tour Bus-Schedule Taiwan Tour Bus schedules provide many kinds of trips which include the major scenic spots in Taiwan. It will lead you to experience Taiwan’s city life, Taiwanese’s passion and hospitality, the ecology in farms, the spectacular scenery, hot springs and delicious food, shopping and Chinese holiday activities and to rediscover the charming characteristics of “Formosa.” IMAPCT organizer arranges 7 tours in Northern Taiwan, if you are interested in, you could contact South East Travel Service. TOUR NO. Pick up TOUR FARE ADULT/person NOTE (1) Taipei City tour Morning and afternoon NTD 855 Half day (2) Taipei Night Tour Every day NTD 1235 3 1/2 hours (3) Folk Arts Tour Afternoon NTD 1045 Half day (4) Yangmingshan National Park Afternoon NTD 1235 Half day (5) Chiufen Village & Northeast Coast Afternoon NTD 1045 Half day (6) Northern Coast Tour Morning NTD 950 Half day (7) Taroko Gorge Tour Morning NTD 4655 One day If you need any further information, please contact South East Travel Service Phone:(886) 2-25713001 Fax :(886) 2-25236981 About Taiwan I. Visa Visa-Exempt Entry Countries eligible for Visa-exempt entry ▲ 14 1.  he nationals of the following countries are eligible for the visa exemption program, which permits a T duration of stay up to 90 days: Austria, Belgium, Bulgaria, Canada, Croatia, Cyprus, Czech Republic, Denmark, Estonia, Finland, France, Germany, Greece, Hungary, Iceland, Ireland, Israel, Italy, Japan, Republic of Korea, Latvia, Liechtenstein, Lithuania, Luxembourg, Malta, Monaco, the Netherlands, New Zealand, Norway, Poland, Portugal, Romania, Slovakia, Slovenia, Spain, Sweden, Switzerland, U.K., U.S.A. and Vatican City State. The nationals of the following countries are eligible for the visa exemption program, which permits a duration of stay up to 30 days: Australia, Malaysia, Singapore. 2. he nationals of India, Thailand, Vietnam, Philippines and Indonesia, who also possess a valid visa or T permanent resident certificate issued by U.S.A., Canada, Japan, U.K., Schengen Convention countries, Australia or New Zealand, are eligible for the visa exemption program, which permits a duration of stay up to 30 days. Those who meet the above qualification and have never been employed in Taiwan as bluecollar workers have to apply to the “Advance Online Registration System for the Visitors of Nationals from Five Southeast Asian Countries to Taiwan” of the R.O.C. National Immigration Agency (website: https://nas. immigration.gov.tw/nase) for an "Authorization Certificate" before coming to Taiwan. After completion, the printed-out Certificate can be used by the foreign visitor for boarding the airplane and the immigration inspection. During the immigration inspection, foreign visitors who can not show a valid visa or permanent resident certificate issued by one of the aforementioned countries will not be admitted into the R.O.C. (In case a single-entry visa issued by any of the said countries has already been used, it is invalid.)
    • Information Requirements 1.  passport with validity of at least six months upon entry . a ‧visa-exempt entry only applies to foreign visitors holding formal passports (i.e. ordinary, official/service and diplomatic passports), not including those holding emergency, temporary, other informal passports or travel documents. ‧Japanese passport holders with their passports valid for more than 3 months are eligible for visa-exempt entry. ‧US passport( including emergency passport) holders with their passports valid for the period of intended stay are eligible for visa-exempt entry. 2.  confirmed return air/sea ticket or an air/sea ticket and a visa for the next destination, a and a confirmed seat reservation for departure. 3. non-criminal record and not prohibited by the local authorities to enter the R.O.C. Duration of stay 1.  he duration of stay starts from the next day of arrival and is not extendable. Foreign T visitors must depart by the end of the said duration. Please click here for " Penalty for overstay". 2.  isa-exempt entry cannot be converted to other types of visas, unless the following V exceptions: A.  oreign visitors entering the R.O.C. through visa-exemption may only apply for F converting to visitor visas within their legal stay at the Bureau of Consular Affairs or branch offices of MOFA in case of: severe acute diseases, natural disasters or other force majeure reasons, which hold them back from leaving the R.O.C. In addition, white-collar professionals who have obtained the work permits within their legal stay may apply for work visas, together with their spouse and minors (under age 20) entering the R.O.C. at the same time. B.  or U.K. and Canadian passport holders, please refer to "Notice for British & F Canadian Passport Holders Who Enter Taiwan Visa-Free and Apply for an Extension of Stay".(doc) Ports of entry Taiwan Taoyuan International Airport, Taipei Songshan Airport, Keelung Harbor, Taichung Airport, Taichung Harbor, Kaohsiung International Airport, Kaohsiung Harbor, Magong Airport, Taitung Airport, Hualien Airport, Hualien Harbor, Kinmen Airport, Shuitou Harbor and Fuao Harbor. Landing Visa Countries eligible for Visa-exempt entry 1. Nationals of Hungary , Poland and Slovak. 2.  olders of emergency or temporary passports with validity more than six months for H nationals of those countries eligible for visa-exempt and landing-visa entry. 3. Holders of USA passport with validity less than six months. 1. a passport valid for at least six months Requirements 2.  confirmed return air ticket or an air ticket and a visa for the next destination, and a a confirmed seat reservation for departure 3. fill out an application form with one photo 4.  isa fee of NT$ 1,600 (citizens of countries with reciprocal agreements shall be issued v visas gratis) plus a handling fee of NT$ 800; For U.S. citizens: see remarks 2 5. no criminal record 1.  runeian passport holders: The 14-day duration of stay starts from the next day of B Duration of stay arrival and is not extendable. 2.  ther eligible passengers: The 30-day duration of stay starts from the next day of O arrival and is not extendable. 3.  he above-said landing visa cannot be converted to visitor or resident visa under normal T circumstances. Taiwan Taoyuan International Airport, Kaohsiung International Airport. Ports of entry More information please refer to : http://www.boca.gov.tw/mp?mp=2 ▲ 15
    • II. Transportation Buses Buses from the Taoyuan International Airport to Taipei are available. Please indicate your needs at ticket counters which are located in the Arrival Passenger Reception Areas of both Terminals. Please visit more Information at http:// www.taoyuanairport.gov.tw Airport Taxi Taxi queues are outside the Arrival Halls of both terminals. To ensure the safety of passengers, only the taxis approved by the Aviation Police Bureau are permitted to operate in Taoyuan International Airport. Airport taxis charge according to the meter in addition to a 50% surcharge (highway tolls not included) and provide transport to anywhere in Taiwan. (A typical taxi fare to Taipei is approx NT$1,100.) Taiwan High Speed Rail (THSR) The Ubus and taxis to Taiwan High Speed Railway Station standby at Access Station charge according to regulation of local government without increment, passengers are welcomed to take the ride. Please visit more information at http://www.taoyuanairport.gov.tw III. Helpful Tips Climate October is one of the most pleasant months in Taiwan. The climate in October is generally mild with temperatures of 22-27℃ in Taipei. Currency The New Taiwan Dollar (NT$) is the national currency. Paper currency comes in $2,000, $1,000, $500, $200, and $100 denominations, while coins come in $50, $10, $5, and $1 denominations. The currency exchange rate at Sep. 2013 is around NT$ 29.536 to US$1. Foreign currencies can be exchanged at the Taiwan Taoyuan International Airport, government-designated banks and hotels. Please visit the Currency converter at http://www.xe.net . Major credit cards are accepted in major hotels and stores and travelers checks may be cashed at foreign-exchange banks, some tourist-oriented businesses and most international tourist hotels. Electricity 110 Volts/ 60Hz A.C. Languages Mandarin Chinese is the official language in Taiwan, but English is familiar to the younger generation, especially students, and those engaged in export trading, tourism, and hotel industries. Most taxi drivers do not speak English. Time Zone Taiwan is 8 hours ahead of Greenwich Mean Time (GMT + 0800) Tipping A 10% service charge is automatically added to room rates and meals. Other tipping is not expected. Telecommunication Services The local rate for public pay phones is NT$1 for two minutes. Most public phones provide international call services. English and Japanese speaking switchboard operators are employed at most hotels. Please dial the area code (02) for Taipei first if you are calling from the Taiwan Taoyuan International Airport. Useful Phone Numbers Taiwan Taoyuan International Airport Tourist Service Center http://www.taoyuanairport.gov.tw Tel: +886-3-3983728 ▲ 16
    • Information Tourism Bureau's Tourist Information http://www.tbroc.gov.tw/ Tel: +886-2- 2717-3737 Foreign Affairs Division, Taipei Office http://www.boca.gov.tw/english/index.htm Tel: +886-2- 2381-8341 International Phone Assistance....................................100 Emergency Service.......................................................110 Directory Assistance in English....................................(02)2311-6796 For more information about Taiwan, please refer to http://www.taiwan.net.tw/. Inquiries Requests for information about the Conference should be directed to: Ms. Sophia Huang IMPACT 2013 Secretariat No. 147, Sec. 2, Gaotie N. Rd., Dayuan, Taoyuan 33743, Taiwan Tel: +886-3-3815659 Ext. 404 Fax: +886-3-3815150 Mobile: +886-961-160-202 E-mail: service@impact.org.tw Website: www.impact.org.tw ▲ 17
    • PLENARY SPEECH Wednesday, October 23, 10:20-11:10 Ricky Shi-Wei Lee President IEEE-CPMT Society Topic: From MOOREfication to LEDification Time: 10:20-11:10 Room 504 Light-emitting diode (LED) is a semiconductor device with a p-n junction which can emit photons under forward bias. That’s why LED is called a solid-state lighting (SSL) source. Although the electroluminescence effect was discovered in early 20th century, LED did not become industrialized until 1960s. Before the turn of the millennium, LED was mainly used for signaling and display applications. That was because LED had not completed its full color spectrum and the luminous flux of LED was still low at that time. Similar to integrated circuits (IC), the evolution of LED in the past two decades is indeed more than impressive. With the substantial progress of blue LED, phosphor materials, and power wattage in 1990s, white light illumination by blue LED together with yellow phosphor for general lighting applications became possible at the dawn of the 21st century. In the Strategies in Light 2000 conference, Dr. Roland Haitz of Agilent Technologies presented his observation and prediction on LED: “for a given wavelength, the amount of light generated per LED package increases by a factor of 20 every decade and, at the same time, the cost per lumen falls by a factor of 10.” The previous statement has been known as Haitz’s Law since then and is also considered the LED counterpart to Moore's Law for IC. In recent years, commercial SSL products started to appear in the consumer markets around the world. Despite the increasingly innovative applications of LED, the propagation of SSL is not always that smooth. The main difficulty in bringing LED lighting into households is the rather high start-up cost. Nevertheless, most major countries in the world are developing and/or implementing policies to ban the production and installation of incandescent light bulbs due to their poor efficiency. With the impetus from government policies for energy saving and proper promotion of the concept of “cost of ownership”, people should be more willing to embrace SSL starting from 2015. It is my true belief that there exists a huge SSL market potential ahead of us. ▲ 18
    • Plenary Speeches Wednesday, October 23, 11:10-12:00 Dyi Chung Hu Senior Vice President Unimicron, Taiwan Topic: The Challenges of IC Substrate in 3D Era. Time: 11:10-12:00 Room 504 Semiconductor technology is moving rapidly from 28nm to 20nm and even 16nm node. Traditional laminate substrate is been challenged to meet the fine line and performance requirement of the IC. For future high performance products, fine line such as 5/5 and 3/3 even 2/2 um are required. To meet the challenges, laminate materials with low CTE, low loss and fine line capabilities are being developing in an ever increasing speed. New substrate requirement such as embedding passive and active components into the substrate is also emerging. Innovative substrate approach such as 2.5D silicon/glass interposer is an alternative solution to meet the fine line and fine via requirement. In this talk, the laminate substrate industry efforts to meet the challenges will be reviewed and new approaches to the fine line IC substrate will be discussed. ▲ 19
    • Thursday, October 24, 09:30-10:20 Yasumitsu Orii Senior Manager IBM Japan, Ltd. ,JP Topic: Next Generation Computer System for the Era of Big Data Time: 09:30-10:20 Room 504 b+c The last several years in particular has been a time when the amount of data used in the general public has been increasing dramatically. Processing speed accordingly plays a crucial role, and the packaging technology to support the system will be mentioned. ▲ 20
    • Plenary Speeches Thursday, October 24, 13:30-14:20 Kyong Wook Paik Professor of Materials Sci. & Eng. KAIST, KR Topic:  ecent Advances in Anisotropic Conductive Technology: R Materials & Processing Time: 13:30-14:20 Room 504 b+c Anisotropic Conductive Films (ACFs) have been widely used as excellent interconnection materials in semiconductor and display applications for chip-on-glass (COG), flex-on-glass (FOG), flex-on-board (FOB), chip-on-flex (COF), chip-on-board (COB) interconnections due to their fine-pitch capability, simple process, and cost effectiveness. There have been many technical innovations in terms of materials and processing technologies. In this presentation, solder ACFs, nanofiber ACFs, photo-activated ACFs and also 3D-TSV NCF materials will be presented as recent ACF materials innovation, and novel vertical ultrasonic bonding technique and wafer level ACF processing methods will be presented as recent ACF processing innovation. For nanofiber ACFs, about 500 nm diameter polymer nanofibers with coupled conductive particles are fabricated using an electro-spinning method. This novel nanofiber ACF shows excellent electrical bump contact resistance, and fine pitch handling capability. Nanofiber ACF can completely solve the electrical shortage problems at 7 μm bump-to-bump gap and 20 micron ultra fine bump pitch of COG(Chip On Glass) and COF(Chip On Flex) electronic packaging applications. In addition, new solder ACFs containing micron size Sn-Bi and SAC solder particles combined with the later described Ultrasonic(U/S) Bonding method overcome the limit of conventional ACFs in terms of current handling capability and reliability, because solder ACFs form many tiny solder alloy metallurgical joints rather than several physical contact based joints of conventional ACFs. As very high impact innovation in ACF bonding process, room temperature operating Ultrasonic (U/S) bonding method was successfully invented as an alternative of conventional thermo-compression (T/C) bonding method. Solder ACF with US bonding can be successfully used for FOB(Flex On Board) and FOF(Flex On Flex) applications to eliminate socket connectors in mobile applications. Wafer level packages using pre-applied ACFs were also invented. After ACF pre-lamination on a bumped wafer, and subsequent singulation, and singulated chips were assembled on various substrates using a thermocompression bonding method. The new wafer level packages using pre-applied ACFs can be widely used for many non-solder flip chip assembly applications such as COB (Chip-on-Board), COF (Chip-on-Flex), COG (Chip-on-Glass), and 3D-TSV. Excellent SnAg bump joints were successfully formed with stable electrical interconnection by the added flux function at 40 um pitch 3D-TSV bump pitch. ▲ 21
    • Friday, October 25, 09:30-10:20 Islam Salama Sr. Manager Substrate and packaging technology development Intel, USA Topic:  nabling Continuum Computing Thru Innovation in Packaging E Substrate & Assembly Time: 09:30-10:20 Room 504 b+c In today’s world, computing is becoming more pervasive. We have more devices per user and more functionality in each device. This is shaping a uniquely personalized computing experience and driving an explosive growth with new markets, devices and applications. It is also increasing the demands on data centers, cloud computing and giving rise to the era of “Big Data” .The economics of Moore’s law is fueling all this. At Intel we are committed to Moore’s law scaling. We are investing in several key materials, processes and equipment technologies that are critical to integrated circuit manufacturing throughout the coming decade. In this talk, we highlight the critical role high-density interconnect packaging, substrate and assembly technologies play in Moore’s law scaling. We provide our take on the current state of the industry and call for action to increase industry focus on standardization, HDI substarte scaling and structural cost reduction. ▲ 22
    • IAAC IAAC Opening & Meeting Time: 13:30-17:00, Tuesday, October 22 Chair: Wun-Yan Chen (iMAPS-Taiwan) Co-Chair: Hsiang-Chen Hsu (ISU) Remark: IAAC Room: 503 Time Topic Chairs and Panelist Affiliation 13:30-13:40 Opening Remark Wun-Yan Chen iMAPS-Taiwan 13:40-14:20 Materials and Interconnections to meet demands of future computing systems Voya Markovich iMAPS-USA 14:20-14:50 Advanced Packaging Development in Taiwan —Challenges and Opportunities Wun-Yan Chen iMAPS-Taiwan 14:50-15:20 History and Activity of Korean Semiconductor Packaging Industry Gu-Sung Kim Kangnam University 15:20-15:30 Coffee Break 15:30-16:00 JIEP Activities and Trend of Low Temperature Bonding Technology for Packaging Tadatomo Suga JIEP 16:00-16:30 The Role of IEEE-CPMT in the Evolution of Microelectronics Packaging Technologies Ricky Shi-Wei Lee IEEE-CPMT Society Voya Markovich Panel Discussion Wun-Yan Chen Gu-Sung Kim Tadatomo Suga Ricky Shi-Wei Lee 23 ▲ 16:30-17:00
    • Panel Discussion Panel Discussion Time: 13:30-15:30, Wednesday, October 23 Topic: Designing Electronic Products for Sustainable Manufacture Chair: Charles E. Bauer (TechLead Corp.) Co-Chair: Shen-Li Fu (IEEE CPMT-Taipei / ISU) Remark: Special Session Room: 504 a+b+c Time Topic Chairs and Panelist Affiliation 13:30-13:40 Opening Remarks Charles E. Bauer TechLead Corp. Shen-Li Fu IEEE CPMT-Taipei / ISU Hajime Tomokage Fukuoka University Kyong Wook Paik Korea Advanced Institute of Science and Technology(KAIST) Ricky Shi-Wei Lee IEEE-CPMT Society Klaus-Dieter Lang Fraunhofer IZM Ning Cheng Lee Indium Corporation Joseph Fjelstad Verdant Electronics 13:40-14:40 Topic:  esigning Electronic Products for Sustainable D Manufacture (1) Materials recovery & recycling (2)  uture directions for Pb free assembly (materials & F processes) (3) Smart power & energy conservation (4) Process efficiency and waste management (5)  he role of organic materials in packaging, T interconnection & assembly (6) Design efficiencies (7) Eco infrastructure in support of manufacturing operations (8) Supply chain management for conservation and efficiency (9) Components, partitioning & system architecture 14:40-15:30 Panel Discussion Charles E. Bauer Hajime Tomokage ▲ 24 Kyong Wook Paik Shen-Li Fu Ricky Shi-Wei Lee Klaus-Dieter Lang Ning Cheng Lee Joseph Fjelstad
    • Sessions SESSION INTRODUCTION IMPACT OPENING Time: 10:00 am-10:20 am, Wednesday, October 23, 2013 Room: R 504, 5F, Taipei Nangang Exhibition Center, Taipei, Taiwan Symposium Chair: Wun-Yan Chen (iMAPS-Taiwan) ORAL PRESENTATION SESSION 1: Advanced Packaging (SPIL) Time: 15:45-17:25, Wednesday, October 23 Chair: Max Lu Remark: Industrial Session Room: 504 a Time Topic 15:45-16:05 Advanced Package / Technology Integration of Interconnection – From OSAT Perspective 16:05-16:25 [Ag Wire] Interconnection Challenge in Wire Bonding - Ag alloy wire 16:25-16:45 Lead Author [SIP] SIP Techology of IOT and Wearable Application Albert Lan Jensen Tsai Ja-Yang Chen 16:45-17:05 [New Gen POP] Alternative PoP with Routable Substrate Interposer for stacking solution 17:05-17:25 [3D IC] The Innovative Integration of Advanced Package Technology Steven Lin Max Lu ▲ 25
    • SESSION 2: IAAC- Global Business Council Time: 15:45-17:30, Wednesday, October 23 Topic: More SiP or 3D IC Chair: Wun-Yan Chen & Voya Markovich Time Remark: IAAC Room: 504 b+c Topic Chairs and Panelists Affiliation Wun-Yan Chen iMAPS-Taiwan Voya Markovich iMAPS-USA 15:55-16:05 Charles E. Bauer TechLead Corp. 16:05-16:15 Gu-Sung Kim Kangnam University Y. H. Chen Unimicron 16:25-16:35 K. M. Chen UMC 16:35-16:45 Yasumitsu Orii IBM Japan Ltd. 15:45-15:55 ~Welcome Remarks~ 16:15-16:25 More SiP or 3D IC 16:45-17:30 Panel Discussion Wun-Yan Chen Charles E. Bauer ▲ 26 Gu-Sung Kim Voya Markovich Y. H. Chen K. M. Chen Yasumitsu Orii
    • Sessions SESSION 3: Advanced Packaging I Time: 15:45-17:45, Wednesday, October 23 Chair: Shih-kang Lin (National Cheng Kung University) Co-Chair: Cheng-En Ho (Yuan Ze University ) Time 15:45-16:15 Paper Code Topic INVITED EU153-1 Room: 503 A New Generation of Power Packaging Using Embedding of Active Chip Lead Author Affiliation Fraunhofer IZM Andreas Ostmann 16:15-16:30 EU083-1 Non-Etching Adhesion Promoter for Dry Film for Semi-additive Manufacturing – Advanced Dry Film Pre-treatment Rami Haidar Atotech Deutschland GmbH 16:30-16:45 TW034-1 Heat-Resistance Study of Thermal Release Tape Chieh-Yuan Chi SPIL 16:45-17:00 TW064-3 A Miniature Crystal Package of Using DPC Technology Vincent Wei Tong Hsing Electronic Industries 17:00-17:15 TW086-1 ☆ Electroplating of <111>-oriented nickel using <111>-orientated nano-twinned copper Yi-Cheng Chu Materials Science and Engineering. National Chiao Tung University 17:15-17:30 TW124-1 Phase Evolution and Nanomechanical Properties of Intermetallic Compounds in Solid-Liquid Interdiffusion Bonding Tsung-Yun Pai National Chung Hsing University 17:30-17:45 TW120-1 Fabrication of nearly void-free Cu3Sn microbumps for 3D IC packaging Wei-Lan Chiu National Chiao Tung University ☆ Outstanding Paper Award Winner ▲ 27
    • SESSION 4: Advanced and Emerging Technology Time: 15:45-18:00, Wednesday, October 23 Chair: T.M. Lee (ITRI) Co-Chair: Jenn-Ming Song (National Chung Hsing University) Time 15:45-16:15 Paper Code Topic INVITED US123-1 Room: 501 FPC deformation and its implications for the high frequency applications Lead Author Affiliation MFLEX Qiang Gao 16:15-16:30 TW085-1 ☆ On the Mechanical Behaviors of ACFtyped Ultra-Thin-Chip-On-Flex Interconnect Technology Under Bonding Process and Bending Test Chien-Hao Ma Feng Chia University 16:30-16:45 AS052-1 A Novel and Green Electroless Copper Andy Chow The Dow Chemical Company 16:45-17:00 TW145-1 Study of Interfacial Reactions between Cu Substrate and Lead-Free Solder with Low Solder Volume for 3D IC Integration Technology Ting-Li Yang National Taiwan University 17:00-17:15 AS050-1 The Evolution of organic solderability preservative process in printed circuit board application Kti Ho Tong Interconnect Technologies, Dow Electronic Materials 17:15-17:30 TW087-1 A Novel Through-Hole Filling Technology for Next Generation Organic Interposer Applications Tao-Chi Liu Enthone 17:30-17:45 TW041-1 ☆ Cu Electroless Deposition by using Cu Nanoparticles as Catalysts for a Printed Circuit Board Metallization Yi-Chun Chung National Chung Hsing University 17:45-18:00 TW122-1 ☆ Reactive Wetting of Molten Ga solder on Poly-crystalline, Single-crystalline and Ptcoated Cu Substrates Yi-kai Kuo National Cheng Kung University ☆ Outstanding Paper Award Winner ▲ 28
    • Sessions SESSION 5: IP Session Time: 15:45-18:00, Wednesday, October 23 Theme: What Makes Good Innovations into Great IPs? Chair: Kwang-Lung Lin & Kuo-Ning Chiang Remark: Special Session Room: 502 Time Topic Chairs and Panelist 15:45-15:50 Introduction 15:50-16:10 U.S. patent system overview: (i)  nique US patent features in patent procurement and enforcement U (ii) Trends of patent enforcement in US Patent litigation before US federal courts: litigation procedures and case study Kwang-Lung Lin Kuo-Ning Chiang Bing Ai John Schnurer 16:10-16:30 16:30-16:55 16:55-17:10 17:10-17:20 17:20-18:00 Patent litigation before US International Trade Commission (Section 337 investigation):ITC procedures and case study US post-grant proceedings as part of litigation defense strategy John Schnurer John Schnurer Bing Ai Break Panel discussion and Q&A from the floor Bing Ai John Schnurer Benjamin Wang No Chairs & Panelists of IP Session Chair Kwang-Lung Lin Professor of Materials Science & Engineering, National Cheng Kung University (NCKU) Co-Chair of IAC (IMPACT) Chair Kuo-Ning Chiang Chair Professor of National Tsing Hua University Honorary Chair of IMPACT Conference 1 Mr. John Schnurer is a patent litigation partner of Perkins Coie LLP and co-chair of the firm's Section 337 investigations practice. He litigates and tries cases in courts throughout the country, including Section 337 investigations before the United States International Trade Commission (ITC) including eight jury trials and eighteen bench trials, five of which were patent trials U.S. ITC. He is recognized as a premiere intellectual property strategist, particularly with respect to the development and execution of global patent litigation strategies. John also prepares provides strategic intellectual property counseling including advice on patent infringement, validity, re-examinations, and large portfolio due diligence studies, whether for acquisitions, licensing, or pre-suit purposes. He achieves optimum results by partnering with his clients to devise and execute customized legal strategies that are consistent with his clients' tactical and strategic business objectives. John represents Taiwanese companies in patent litigation before U.S. ITC and federal courts, including HTC, ASUS, Largan Precision, ATEN and Pegatron. Dr. Bing Ai is a partner in the patent group at Perkins Coie LLPand is the co-chair of the firm's patent post-grant proceeding practice. Bing was a physicist before entering law practice. His practice emphasizes patent prosecution, patent counseling and strategy, patent portfolio management, freedom to operate analyses, patent validity and infringement issues, patent re-examinations and inter partes review (IPR) proceedings, patent due diligence and support for patent litigation, and patent due diligence for corporate financing, mergers and acquisitions. Bing practices in a wide range of technology fields, including electronics, semiconductors, wireless technologies, telecommunications, computer hardware, software, Internet-based technologies, medical devices, batteries and fuel cells, lasers and optics, and nanotechnology. Bing represents Taiwanese companies including HTC and Largan Precisionin post-grant proceedings in connection with patent litigation. Benjamin Wang has been the general director of Technology Transfer Centre at Industrial Technology Research Institute since 2007. Before that, he was the deputy general director at the centre from 2000 to 2007. He has also acted as the director of the business programme, computer and communication laboratories at ITRI. 3 Mr. Wang holds a PhD in management of technology from National Chiao Tung University, Taiwan (2007), an MS in IP rights law from the Franklin Pierce Law Centre in the United States (1992) and an MBA from National Taiwan University Taiwan (1981). Mr. Wang has make contributions not only in advancing IP rights but also in managing business and marketing for more than 30 years. Mr. Wang was awarded “Innovative Model Promoter Award”, Award for National Industrial Innovation, Ministry of Economic Affairs (MOEA), Taiwan (2011), “Best Marketing Manager”, National Management Excellence Award, Chinese Professional Management Association, Taiwan (2008) and “Value-created Pioneer Award”, Ministry of Economic Affairs (MOEA), Taiwan (2006). 29 ▲ 2 Photo
    • SESSION 6: ICEP Japan Session Time: 10:30-12:20, Thursday, October 24 Chair: Yasumitsu Orii Time 10:30-11:50 Paper Code Topic INVITED AS168-1 Remark: Special Session Room: 504 b+c Technical Review of ICEP 2013 Lead Author Affiliation Renesas Electronics Corporation Shintaro Yamamichi 10:50-11:10 INVITED AS163-1 Waseda University Study on Surface Treatment Process Using VUV/O3 Treatment for Reduction of Au-Au Bonding Temperature Jun Mizuno 11:10-11:30 INVITED AS171-1 Senju Metal Industry Co., Ltd Advanced Micro Soldering Technology with Semiconductor device Derek Daily 11:30-11:50 INVITED AS167-1 J-DEVICES CORPORATION A New Embedded Package Structure and Technology for Next Generation of WLP Akio Katsumata 11:50-12:10 INVITED AS169-1 Sekisui Chemical Co. ltd. Advanced Build-up Electrical Insulation Material for IC Packages Koichi Shibayama 12:10-12:20 ▲ 30 Q&A
    • Sessions SESSION 7: 3D Integration I Time: 10:30-12:30, Thursday, October 24 Chair: Shin Hua Chao (ASE) Co-Chair: Tao-Chih Chang (ITRI) Time 10:30-11:00 Paper Code Topic INVITED AS166-1 Room: 504 a TSV Technology Solution for Advanced Packaging Lead Author Affiliation ULVAC,Inc.,Japan Koukou Suu AS081-1 ☆ TW028-1 ☆ 300 mm Wafer 3D Integration Technology using Hybrid Wafer Bonding 11:30-11:45 11:00-11:15 Kazuyuki Hozawa Central Research Laboratory, Hitachi, Ltd. Effects of Overlaying Dielectric Layer and Its Local Geometry on TSV-Induced KOZ in 3D IC PuShan Huang Chang Gung University EU001-1 Thin Wafer Handling and Chip to Wafer Stacking Technologies Pauzenberger  GuumlFnter EV Group EVG 11:45-12:00 TW030-1 Determination of the Equivalent Thermal Conductivities of a Through Glass Via TGV Structure Used for 3D IC Integration Heng Chieh Chien Industrial Technology and Research Institute 12:00-12:15 TW105-1 Intermetallic Compound Growth Behavior during Multiple Reflows of Ni/SnAg/Ni and Cu/SnAg/Ni Microbumps in ThreeDimensional Integrated Circuits Yuan-wei Chang Dept. of Materials Sci. & Eng., National Chiao Tung Univ. 12:15-12:30 TW049-1 The 3-D Parallel Processor applied to Matrix Inversion Karl Cheng Innotest Inc. 11:15-11:30 ☆ Outstanding Paper Award Winner ▲ 31
    • SESSION 8: Thermal Management I Time: 10:30-12:00, Thursday, October 24 Chair: Chien-Yuh Yang (National Central University) Co-Chair: Shung-Wen Kang (Tamkang University) Time 10:30-11:00 Paper Code INVITED AS150-1 Topic Room: 503 Lead Author A THERMAL DESIGN APPROACH FOR NATURAL AIR COOLED ELECTRONIC EQUIPMENT CASINGS Affiliation Toyama Prefectural University Masaru Ishizuka 11:00-11:15 AS093-1 Thermal Design Method of Printed Circuit Board with Measured Effective Thermal Conductivity 11:15-11:30 TW099-1 Thermal Radiation Material for Electronic Devices Applications Sha Yi-An Polytronics Technology Corp. 11:30-11:45 TW074-1 ☆ Interfacial Reactions in the Cu/In/Ni Sandwich Couples at 280°C Yu-Hsiang Wang National Cheng Kung University Department of materials science and engineering 11:45-12:00 TW022-1 A Case Study of Thermoelectric Generator Application on Rotary Cement Furnace Hsu Cheng-Ting Industrial Technology Research Institute ☆ Outstanding Paper Award Winner ▲ 32 Daiji Kondo Toyama Prefectural University
    • Sessions SESSION 9: Modeling, Simulation & Design I Time: 10:30-12:30, Thursday, October 24 Chair: M. Y. Tsai (Chang Gung University) Co-Chair: Yu-Po Wang (SPIL) Time 10:30-11:00 Paper Code INVITED US114-1 Topic Room: 501 Lead Author Power and Ground Co-referencing for High Speed 10-28Gbps Transceivers in FPGA and ASIC Devices Affiliation Xilinx Hong Shi TW146-1 Signaling Enabler in High-speed System Design by Using Hybrid Stack-up Printed Circuit Board Thonas Su Intel Corporation 11:15-11:30 TW135-1 Analysis of LED Wire Bonding Process Using Arbitrary Lagrangian-Eulerian and Explicit Time Integration Methods Kuo-Ning Chiang National Tsing Hua University 11:30-11:45 TW133-1 Analytical Description of the Out-of-Plane Equivalent Mechanical Properties of ThroughSilicon Via Interposers Sheng-Tsai Wu ITRI 11:45-12:00 TW038-1 A Novel Decoupling Capacitor for Power Integrity Application in High-Speed 3D-IC Package System Robert Sung Siliconware Precision Industries Co., Ltd. 12:00-12:15 TW053-1 A New Detection Method for the Onset of PCB Pad Cratering Graver Chang Integrated Service Technology 12:15-12:30 TW137-1 Transition Behavior in Large Deflection of Elastically-Bossed Unsymmetrically Layered Plate under Initial Tension Chun-Fu Chen Chung-Hua University 33 ▲ 11:00-11:15
    • SESSION 10: Green Materials & Process Time: 10:30-12:15, Thursday, October 24 Chair: Jay Desai (MFLEX) Co-Chair: LC Chen (DuPont Taiwan Co., Ltd) Time 10:30-11:00 Paper Code Topic INVITED AS161-1 Room: 502 Why TBBPA in FR-4 Laminates is a Green Solution for Printed Circuit Boards? Lead Author Affiliation Chemtura Grace Han 11:00-11:15 TW023-1 ☆ Reliability Evaluation on ENEPIG, Ultrathin NiP, and EPIG Surface Finishes in Soldering Applications Shih-Ju Wang Yuan Ze University 11:15-11:30 Effective retardation of Sn-58Bi/Cu interfacial reactions with minor Ga addition Trong Lan Nguyen National Cheng Kung University 11:30-11:45 TW072-1 ☆ TW142-1 High Frequency Substrate Materials with Highly Thermal Resistance and Low Dielectric Properties Feng-Po Tseng Industrial Technology Research Institute 11:45-12:00 TW098-1 A SIMPLE PRINTABLE ETCHANT FORMULATION FOR ETCHING OXIDIC,TRANSPARENT AND CONDUCTIVE LAYERS Shin-Shin Wang Industrial Technology Research Institute, Material and Chemical Research Lab. 12:00-12:15 US154-1 A High Reliability, Stress-Free Electroless Copper Process for FPC, Polyimide and RigidFlex William Bowerman OMG Electronic Chemicals, Inc. ☆ Outstanding Paper Award Winner ▲ 34
    • Sessions SESSION 11: 3D IC Forum Time: 14:30-17:30, Thursday, October 24 Chair: Shin-Puu Jeng (TSMC) Remark: Speical Session Room: 504 b+c Time Topic Chair and Panelists Affiliation 14:30-14:35 Opening Remarks Shin-Puu Jeng TSMC 14:35-14:55 Advanced 3D Waferlevel System in Package Technologies Klaus-Dieter Lang Fraunhofer IZM 14:55-15:15 3D IC Integration: A Foundry Perspective Vic, J.C. Lin TSMC 15:15-15:35 Technologies for Multi-chip Integration: Equipment perspective Seshadri Ramaswami Applied Materials 15:35-15:50 Poster Session (Packaging) / Coffee Break 15:50-16:10 Key Focus for Flip-Chip Substrate Zachery Lin Nan Ya PCB 16:10-16:30 Advanced Build-up Electrical Insulation Material for IC Packages Calvin Yang Csun Mfg 16:30-16:50 Besides & Beyond 2.5D / 3D IC Walter Jau ASE 16:50-17:30 Panel Discussion Shin-Puu Jeng Vic, J.C. Lin Seshadri Ramaswami Zachery Lin Calvin Yang Walter Jau 35 ▲ Klaus-Dieter Lang
    • SESSION 12: Advanced Packaging II Time: 14:30-17:30, Thursday, October 24 Chair: Hsiang-Chen Hsu (I-Shou University) Co-Chair: K. M. Chen (UMC) Time 14:30-15:00 Room: 504 a Paper Code Topic INVITED AS159-1 Advanced packaging and high-data transmission technology for "Smart Society" Lead Author Affiliation RENESAS ELECTRONICS CORPORATION Michitaka Kimura 15:00-15:15 AS058-1 Analysis of Stress Buffer Effect of Polyimide for Board Level Drop Test by a Finite Element Analysis Nobuhiro Anzai Asahi Kasei E-materials Corporation 15:15-15:30 TW064-2 Stress-Reduced Thick Copper Ceramic Substrate for High Power Module Applications Vincent Wei Tong Hsing Electronic Industries 15:30-15:45 TW148-1 The First MIT 600 V / 450 A IGBT Power Module For EV / HEV Application Tao-Chih Chang ITRI 15:45-16:00 Poster Session (Packaging) / Coffee Break 16:00-16:15 TW036-1 ☆ Grain Refinement of Solder Materials by Minor Element Addition Cheng Kai Chung Department of Materials Science and Engineering, National Taiwan University 16:15-16:30 TW109-1 EFFECTIVE 3DIC CHIP MODULE WARPAGE WITH UF DESIGN BY ANALYTICAL METHOD LI PAI YUAN SPIL 16:30-16:45 TW089-1 An Innovative Packaging Process for Low Power Loss Solar Modules HsinHsin Hsieh Industrial Technology Research Institute 16:45-17:00 TW118-1 Effect of Ag Concentration on Ni-Sn Interfacial Reaction for Micro joints Jen-Jui Yu National Taiwan University 17:00-17:15 TW119-1 Necking of low-bump-height solder induced by reactive wetting of solder on Au finishes in print circuit board Chih Chia Hu Department of Materials Science and Engineering. National Chiao Tung University, Taiwan 17:15-17:30 TW039-1 Periodic Pulse Reverse Cu Electroplating for Through Hole Filling Fang-Yu Shen National Chung Hsing University ☆ Outstanding Paper Award Winner ▲ 36
    • Sessions SESSION 13: Interconnections & Nanotechnology Time: 14:30-17:30, Thursday, October 24 Chair: De-Shin Liu (Nationnal Chung Cheng University) Co-Chair: Chih Chen (National Chiao Tung Univ) Time 14:30-15:00 Paper Code Topic INVITED US010-1 Room: 503 A Novel Epoxy Flux On Solder Paste For High Reliability POP Assembly Lead Author Affiliation Indium Corporation Ning-Cheng Lee 15:00-15:15 AS008-1 Effects of Wire Type and Mold Compound on Wearout Reliability of Semiconductor Flash Fineline BGA Package Gan Chong Leong Spansion Penang Sdn Bhd 15:15-15:30 TW152-1 High Performance Ag-Pd Alloy Wires for High Frequency IC Packages Hsing-Hua TSAI WIRE TECHNOLOGY CO. LTD 15:30-15:45 TW014-1 An Efficient Evaluation Method for Packaging Interconnection CHIA YEN LEE Delta Electronics, Inc. 15:45-16:00 Poster Session (Packaging) / Coffee Break 16:00-16:15 TW045-1 ☆ Wet Processes for Glass Surface Metallization and Cu Filling Through Glass Vias (TGVs) Shao-Ping Shen Department of Chemical Engineering National Chung Hsing University 16:15-16:30 TW132-2 An Investigation on Nanoscale Bondability between Cu-Al Intermetallic Compound HSIANG-CHEN HSU I-SHOU UNIVERSITY 16:30-16:45 TW067-1 A novel Ga-based TSV Interconnection with Pt UBM Hao-miao Chang National Cheng Kung University 16:45-17:00 TW127-1 Electro-Thermal-Mechanical Modeling of Wire Bonding Failures in IGBT Huang-Kang Tseng Department of Mechanical Engineering, National Sun Yat-Sen University 17:00-17:15 TW124-2 Chemical and Thermal Reductions of Carboxylate-Protected Nanoparticle-based Ag Conductive Films Tsung-Yun Pai National Chung Hsing University 17:15-17:30 TW047-1 Thermomigration in Micro-bumps of Threedimensional Integrated Circuit Packaging Wei-Neng Hsu National Tsing Hua University ☆ Outstanding Paper Award Winner ▲ 37
    • SESSION 14: Modeling, Simulation & Design II Time: 14:30-17:00, Thursday, October 24 Chair: Tz-Cheng Chiu (National Cheng Kung University) Co-Chair: Yu-Jung Huang ( I-Shou University) Time 14:30-15:00 Paper Code INVITED EU170-1 Topic Room: 501 Lead Author Modelling & Co-Design for Power Module Packaging - Current Status and Future Challenges Affiliation University of Greenwich Chris Bailey 15:00-15:15 TW056-2 The Reliability Performance of Copper Wire Bonding BGA Package by Way of HAST Methodology Dem Lee IST-Integrated Service Technology 15:15-15:30 TW129-1 Investigation of the Responses in the Environmental Stress Screening System Activated by Different Combinations of Hammers Le Hong Chuong YuanZe University 15:30-15:45 TW132-3 Electrochemical Migration Failure on FR-4 PCB Plated with Cu by Hygro-Thermo-Vapor Pressure Coupled Analysis HSIANG-CHEN HSU I-SHOU UNIVERSITY 15:45-16:00 Poster Session (Packaging) / Coffee Break 16:00-16:15 TW060-1 IC-Package Co-design by Computational Thermographics Jui-Hung Chien National Tsing Hua University 16:15-16:30 TW080-1 Design optimization for wafer level package reliability by using artificial neural network Po Chen Lai National Cheng Kung University 16:30-16:45 TW018-1 Thermal and Thermo-Mechanical Simulations on High Power Diode Packaging for a Typical Power Adapter Ben-Je Lwo National defense University 16:45-17:00 TW088-1 A New Edge Strength Evaluation Method and Apparatus for Flexible Brittle Material Chih-Ming Shen ITRI/EOL ▲ 38
    • Sessions SESSION 15: Test & Quality Time: 14:30-17:00, Thursday, October 24 Chair: Jeffrey Lee (IST-Integrated Service Technology Inc.) Co-Chair: Jerry Huang (Tripod Technology Co.) Time 14:30-15:00 Paper Code INVITED US172-1 Topic Room: 502 Lead Author Quality: Value and Cost  Affiliation Scimaxx Solution Herbert J. Neuhaus 15:00-15:15 15:15-15:30 15:30-15:45 TW025-1 ☆ TW091-1 ☆ Unusual IMC Growth in 3D-IC Solder Joints Cheng-En Ho Yuan Ze University Temperature-dependent failure mechanism of SnAg solder joints with Cu under-bumpmetallization after electromigration: experimentation and analysis Chung Kuang Lin National Chiao Tung University AS070-1 Remotely-Controlled Tensile Test of CopperCored Lead-Free Solder Joint in Liquid Using Permanent Magnet Naoya Tada Okayama University 15:45-16:00 Poster Session (Packaging) / Coffee Break 16:00-16:15 TW151-1 The Effect of Current Stressing on Grain Growth Tin and Orientation Yu-Lung Lin Department of Materials Science Engineering, National Chiao Tung University 16:15-16:30 TW057-1 Inhibition of Whisker Formation by Forming Uniform Intermetallic Layer Han-wen Lin National Chiao Tung University 16:30-16:45 TW055-1 Effect of grain orientations of Cu seed layers on the growth of <111>-oriented nanotwinned Cu Chien-Min Liu National Chiao Tung University 16:45-17:00 TW136-1 Investigation of the Characteristics and Impact Energy of the Pneumatic Hammers Used in Highly Accelerated Life Test Systems Chen Yeong-Shu Yuan Ze University ☆ Outstanding Paper Award Winner ▲ 39
    • SESSION 16: iNEMI Reliability Session Time: 10:30-12:10, Friday, October 25 Chair: Haley Fu Time Paper Code Topic 10:30-10:55 US164-1 Remark: Special Session Room: 504 b+c iNEMI Projects on Medical Electronics Lead Author Affiliation iNEMI Bill Bader 10:55-11:20 AS162-1 iNEMI iNEMI Copper Wire Bonded Package Reliability Project Haley Fu 11:20-11:45 TW165-1 UL Improving UL Certification of Laminates and PCBs Carl Wang 11:45-12:10 US155-1 Intel Striking the Balance – Driving Increased Density and Cost Reduction in Printed Circuit Board Designs Tim Swettlen ▲ 40
    • Sessions SESSION 17: 3D Integration II Time: 10:30-12:15, Friday, October 25 Chair: R. S. LEE (ITRI) Co-Chair: Chang-Chun Lee (Chung Yuan Christian University) Time 10:30-11:00 Paper Code Topic INVITED TW064-1 ☆ Room: 504 a Through-Ceramic Vias TCVs Interposer of Using Direct Plated Copper Technology for 2.5DIC Packaging Lead Author Affiliation Tong Hsing Electronic Industries Vincent Wei 11:00-11:15 EU094-1 FABRICATION, ELECTRICAL CHARACTERIZATION AND RELIABILITY STUDY OF PARTIALLY ELECTROPLATED TAPERED COPPER THROUGH-SILICON VIAS PRADEEP DIXIT VTT TECHNICAL RESEARCH CENTER OF FINLAND 11:15-11:30 TW139-1 Investigation of the process for Glass interposer Ching-Kuan Lee Industrial Technology Research Institute 11:30-11:45 TW090-1 Wafer Bonding Type Selection for 3D IC Designs Shih-Hsu Huang Chung Yuan Christian University 11:45-12:00 TW028-2 Strength Evaluation of Thin 3D-TSV Memory Chips by Pin-on-Elastic-Foundation Test PuShan Huang Chang Gung University 12:00-12:15 TW090-2 Temperature Rise Minimization through Simultaneous Layer Assignment and Thermal Through-Silicon-Via Planning Shih-Hsu Huang Chung Yuan Christian University ☆ Outstanding Paper Award Winner ▲ 41
    • SESSION 18: LED & Thermal Management Time: 10:30-12:15, Friday, October 25 Chair: Jen-Dong Hwang (TTMA) Co-Chair: Chien-Yuh Yang (National Central University) Time 10:30-11:00 Paper Code Topic INVITED TW160-1 Room: 503 Application of Heat Transfer Enhanced Fins in Electronic Devices Cooling Systems Lead Author Affiliation National Central University Chien-Yuh Yang 11:00-11:15 EU156-1 Electro-Optical PCBs for Optical Interconnects in Data Centers Marika Immonen TTM Technologies 11:15-11:30 Analysis of Hot Spot Temperature in Power Si MOSFET with Electro- thermal Analysis Risako Kibushi Toyama Prefectural University 11:30-11:45 AS101-1 ☆ TW004-1 The Analysis of the Thermal Resistance Structure of LEDs by Measuring Its Transient Temperature Variation Wei-Keng Lin Enginnering System Science Dept., National Tsing-Hua Univ. 11:45-12:00 TW065-1 Implement of a Silicon-based LED Packaging Module with Temperature Sensor Chingfu Tsou Department of Automatic Control Engineering, Feng Chia University 12:00-12:15 TW132-1 Thermal Design for High Power Arrayed LED Heat-Dissipating System HSIANG-CHEN HSU I-SHOU UNIVERSITY ☆ Outstanding Paper Award Winner ▲ 42
    • Sessions SESSION 19: Modeling, Simulation & Design III Time: 10:30-12:00, Friday, October 25 Chair: Tz-Cheng Chiu (National Cheng Kung University) Co-Chair: Ben-Je Lwo (National Defense University) Time 10:30-11:00 Paper Code INVITED TW029-1 Topic Room: 501 Lead Author Review on Silver Wire Bonding Affiliation Altera Corp. Charlie Lu 11:00-11:15 TW003-1 Simulations and Characterizations for Stress Reduction Designs in Wafer Level Chip Scale Packages Ming-Che Hsieh STATS ChipPAC Taiwan 11:15-11:30 AS131-1 Fatigue strength around through hole in printed circuit board Takahiro Kinoshita Toyama Prefectural University 11:30-11:45 TW149-1 ☆ TW048-1 On the Non-Polarity Effects of the Bi/Ni Interfaces under Current Stressing Liu Yu-chen NCKU Three Dimensional Compression Molding Simulation for Wafer Level Packaging Chih-Chung Hsu National Tsing-Hua University 11:45-12:00 ☆ Outstanding Paper Award Winner ▲ 43
    • SESSION 20: HDI & Embedded Time: 10:30-12:00, Friday, October 25 Chair: Eric Hsu (Nan Ya PCB Corp) Co-Chair: Anderson Cheng (ITEQ) Time 10:30-11:00 Paper Code Topic INVITED US113-1 Room: 502 Multi-island platform for realization of wearable electronics Lead Author Affiliation MC10 Inc. Yung-Yu Hsu 11:00-11:15 US046-1 Integrated Metallization System for High Density Interconnects and Modified Semi Additive processing Kesheng Feng MacDermid 11:15-11:30 A Novel Cu Plating Formula for Filling Through Holes of a PCB Jhih-Jyun Yan National Chung Hsing University 11:30-11:45 TW033-1 ☆ TW024-1 Investigation of Through Hole Filling by Electrolytic Cu Deposition Using Electron Backscatter Diffraction Chia-Wei Fan Yuan Ze University 11:45-12:00 TW157-1 Advanced Thin Copper Electroplating Process for HDI Microvia Filling Application Ming-Yao Yen The Dow Chemical Company ☆ Outstanding Paper Award Winner ▲ 44
    • Posters POSTER (PCB) Time: 15:30-15:45, Wednesday, October 23 Venue: 5F, Taipei Nangang Exhibition Center, Taipei, Taiwan Paper Code Topic Lead Author Affiliation AS020-1 ☆ An efficient rough vacuum chlorinated separation method for recovery of indium from waste liquid crystal display panels En Ma Shanghai Jiao Tong University AS117-1 Design and Reliability Analysis of Voltage Reference Circuit in 180 nm CMOS Process Yasuhiro Takahashi Gifu University EU112-1 Advanced Via Filling for improved Within-Unit Distribution Henning Hübner Atotech Deutschland GmbH TW005-1 OPTICALLY-INDUCED DIELECTROPHORETIC TECHNOLOGY FOR PARTICLES MANIPULATION AND SEPARATION Chen Hsiu-Hsiang Industrial Technology Research Institute TW027-1 The Failure Investigation of The Polymer Ball Interconnect Under Board Level Bending Stress Cheng-Chih Chen IST-Integrated Service Technology, Inc. TW056-1 The Methodology to Monitor Gaseous Contamination in Data Centers Dem Lee IST-Integrated Service Technology TW059-1 Anisotropic grain growth and crack propagation in eutectic microstructure under cyclic temperature annealing in flip-chip SnPb composite solder joints Yu-Chun Liang NCTU TW063-1 When “Signal” meets “Temperature” Albert Chen Elite Material Co., Ltd. TW096-1 Investigation of Interfacial Reactions in the Sn/Fe-xNi Couple Yi- Shan Li National Taiwan University of Science and Technology TW100-1 Power density effect on the microstructures and thermoelectric properties of p-type Bi-Sb-Te nanocrystalline thin films deposited by RF sputtering Chen Tai-Sheng ITRI TW103-1 ☆ PROCESS FEASIBILITY OF A NOVEL DIELECTRIC MATERIAL IN A CHIP EMBEDDED, CORELESS AND ASYMMETRICALLY BUILT-UP STRUCTURE Yu-wei Huang Industrial Technology Research Institute TW111-1 The Investigation of the Inkjet Printing Metallization Technology on Flexible Substrate Yan-Yu Nian National Defense University TW116-1 The Inkjet Printing of Catalyst Pd Ink for Selective Metallization Apply to Product Antenna on PC/ABS Substrate Po-Chiang Wang National Defense University TW128-1 Surface Clean of Readily Oxidized Metals for Interconnections with Organic Acid Vapor Shang-Kun Huang National Chung Hsing University TW140-1 Electroless Nickel deposition on the hybrid polyimide Yi-Ling Lo Industrial Technology Research Institute ☆ Outstanding Paper Award Winner ▲ 45
    • POSTER (PACKAGING) Time: 15:45-16:00, Thursday, October 24 Venue: 5F, Taipei Nangang Exhibition Center, Taipei, Taiwan Paper Code Topic Lead Author Affiliation AS051-1 Characterization and performance study of packaged micropump for drug delivery Vinaya kumar K.B Indian institute of science AS073-1 Packaging of Polyvinylidene fluoride nasal sensor for biomedical applications Roopa Manjunatha Indian institute of science EU156-2 Optical Backplane Demonstrator with 10Gbps Video Transmission Link on Printed Circuit Board Using Optical Waveguides Qian Xia Shanghai University TW006-1 Thermal Stability of Hydrogen Annealed Aluminum Doped Zinc Oxide Films Investigated by Thermal Desorption Spectroscopy Shang-Chou Chang Kun Shan University TW007-1 Parameters Optimization of Electroporation Chip for Gene Transfection Yung-Chiang Chung Ming Chi University of Technology TW009-1 Nugget Shape Control in Resistance Spot Welding P. S. Wei Department of Mechanical and Electro-Mechanical Engineering, National Sun Yat-Sen University TW011-1 WiFi SiP Module Using IPD Rx Balun Applications Hin-Han Chuang Siliconware Precision Industries Co., Ltd TW031-1 Novel Assembly Framework of Bi-Layered Molding Materials for 3D-ICs Packaging Lee Chang-Chun Department of Mechanical Engineering, Chung Yuan Christian University TW035-1 Thermomigration of Ag in Pb-free SnAg solder joints Mulaine Shih National Tsing Hua University TW042-1 Electrical Model Analysis and Measurement of TSV to TSV Coupling Capacitance Yang Shiuan-hau Siliconware Precision Industries Co., Ltd. TW061-1 CU WIRE HAST FAIL MECHANISM INVESTIGATION FOR BGA PACKAGE Chih Hung Chang NXP Semiconductors Taiwan TW062-1 Cu wire Development for Thin QFN Package using Die Attach Film (DAF) Ho-Chin Hsieh NXP TW066-1 ☆ Interfacial reacions between pure tin and electroplated copper substrates fabricated using different formulas Wu Je-Yi National Chung Hsing University TW069-1 Film Over Wire (FOW) Selection for Copper Wire Application Ming-Wei Lee NXP Semiconductors Taiwan TW075-1 Formation of alternating interfacial layers in the Au12Ge/Ni joints Ming-yueh Tsai National Cheng Kung University ☆ Outstanding Paper Award Winner ▲ 46
    • Posters Venue: 5F, Taipei Nangang Exhibition Center, Taipei, Taiwan Paper Code Topic Lead Author Affiliation TW077-1 Interfacial reaction in Cu/Pb-free solders/Co couples during reflowing process Shen Chang Lee Department of Engineering and System Science, National Tsing Hua University TW078-1 Molded Underfill for Flip Chip Package Chen Yu-Kai National Cheng Kung University Department Of Mechanical Engineering TW079-1 Study on thermal conductive BN/VGCF/polyimide resin composites Chin Si-Yi Industrial Technology Research Institute TW084-1 Cu Pillar Bump-on-Trace BoT Design for Ultra Low-K Packaging Harold Wu United Microelectronics Corporation TW084-2 Bill of Material and Geometry of FCBGA Impacts on Packaging Warpage Harold Wu United Microelectronics Corporation TW092-1 An Efficient and Effective Simulation Approach for Solder Joint Reliability Prediction of Through-Silicon-Via TSV 3D Integration Lin Sheng-Chuen National Tsing Hua University TW095-1 Effects of Annealing on Sn Whisker Formation: Role of Cu Alloy Seed Layer Wahyu Diyatmika National Taiwan University of Science and Technology TW097-1 TSV-less BSI-CIS Wafer-Level Package and Stacked CIS Module Zhi-Cheng Hsiao Industrial Technology Research Institute TW102-1 Reflow Heat Source Impact on IMC Formation of Micro Bump Interconnection for 3D Package Yi-Chian Liao Siliconware Precision Industries Co., Ltd. TW106-1 Interfacial reactions in microbumps of Ni/SnAg/Cu with different SnAg thicknesses Yi Sa Huang NCTU TW107-1 UNDERFILL ADHESION ENHANCEMENT VIA OPTIMIZATION OF PLASMA TREATMENT FOR 3DIC Chi Tung Yeh Siliconware Precision Industries Co., Ltd. TW110-1 The investigation of dielectric properties measurement method of packaging materials Meng-Sheng Chen ITRI TW115-1 Fabrication of Robust Polyaniline Thin Film Electrodes on the Surface of Elastomeric Polydimethylsiloxane for Polymeric MEMS Applications Kuan-Hsun Li National Tsing Hua University TW115-2 Investigating the Influence of Various Organosilanized Substrates and Dopant Species on the Properties of Transparent Polypyrrole Thin Films Deposited on Glass Surfaces Kuan-Hsun Li National Tsing Hua University ▲ 47
    • Venue: 5F, Taipei Nangang Exhibition Center, Taipei, Taiwan Paper Code Topic Lead Author Affiliation TW143-1 Warpage study of power module Wei Li Industrial Technology Research Institute TW144-1 High Thermal Conductivity Underfill study for fine pitch Cu pillar bump Huang Huei-Nuan SPIL TW158-1 The Improvement of Thermoelectric Element and People’s Livelihood Applications Kuen-Shan Jaw Taipei Chengshih University of Science and Technology ▲ 48
    • 20 14 16th International Conference on Electronic Materials and packaging IMPACT-EMAP 2014 Save your dates for Oct 22-24, 2014 Taipei, Taiwan www.impact.org.tw 9th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT 2014) 16th International Conference on Electronics Materials and Packaging (EMAP 2014)