intel  PDF  	32nm Technology Update Mark Bohr
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  • 1. Intel 32nm Technology Mark Bohr Intel Senior Fellow Logic Technology Development Feb. 10, 2009 1
  • 2. Risk Factors • Today’s presentations contain forward-looking statements. All statements made that are not historical facts are subject to a number of risks and uncertainties, and actual results may differ materially. Please refer to our most recent Earnings Release and our most recent Form 10-Q or 10-K filing for more information on the risk factors that could cause actual results to differ. • If we use any non-GAAP financial measures during the presentations, you will find on our website, intc.com, the required reconciliation to the most directly comparable GAAP financial measure. 2
  • 3. Key Messages • Intel has developed a 32nm logic technology with industry-leading features • Intel is first to demonstrate working 32nm processors • Intel’s 32nm process is on track for production readiness in Q4 ’09 • Both CPU and SoC versions of this 32nm process will be available • Intel’s strength as an integrated device manufacturer allows us to continue to deliver new generations of advanced process technology on a 2 year cadence 3
  • 4. Intel Logic Technology Development Process Name P1264 P1266 P1268 P1270 P1272 Lithography 65nm 45nm 32nm 22nm 16nm 1st Production 2005 2007 2009 2011 2013 Manufacturing Development 4
  • 5. 45nm High-k + Metal Gate Transistors Revolutionary transistor technology for improved performance and lower leakage 5
  • 6. 45nm Microprocessor Products Quad Core Dual Core Single Core 6 Core 8 Core 45nm production ramp has been the fastest yet Twice as fast as the 65nm ramp in its first year 6
  • 7. Intel Logic Technology Evolution Process Name P1264 P1266 P1268 P1270 P1272 Lithography 65nm 45nm 32nm 22nm 16nm 1st Production 2005 2007 2009 2011 2013 Manufacturing Development 7
  • 8. 32nm Technology • 2nd generation high-k + metal gate transistors • Immersion lithography on critical layers • 9 copper + low-k interconnect layers • ~70% dimension scaling from 45nm generation • Pb-free and halogen-free packages 8
  • 9. 32nm Transistors • 2nd generation high-k + metal gate 0.9nm equivalent oxide thickness high-k − (scaled from 1.0 nm on 45nm) Replacement Metal Gate process flow − 30nm gate length − 4th generation strained silicon − • >22% performance increase • Tightest reported gate pitch • Highest reported drive currents 9
  • 10. Transistor Pitch Scaling 1000 Pitch Gate Pitch (nm) 0.7x every 2 years 32nm Generation 112.5 nm Pitch 100 1995 2000 2005 2010 Transistor gate pitch continues to scale 0.7x every 2 years Tightest gate pitch of all reported 32nm technologies 10
  • 11. 32nm Transistor Performance NMOS PMOS 1000 1000 1.0 V 1.0 V Intel Intel Intel Intel 45nm 32nm 45nm 32nm IOFF (nA/um) IOFF (nA/um) 100 100 +14% +22% >5x 10 10 >10x Better Better 1 1 0.8 1.0 1.2 1.4 1.6 1.8 2.0 0.6 0.8 1.0 1.2 1.4 1.6 1.8 ION (mA/um) ION (mA/um) 32nm provides improved performance or reduced leakage Highest drive current of all reported 32nm technologies 11
  • 12. SRAM Cell Size Scaling 10 Cell Area 1 2 (um ) 0.5x every 2 years 32nm Generation 0.171 um2 Cell 0.1 1995 2000 2005 2010 Transistor density doubles every 2 years Moore’s Law continues! 12
  • 13. 32nm SRAM Test Chip • 0.171 um2 cell • 291 Mbit • >1.9 billion transistors • 4 GHz operation • First demonstrated Sep ’07 13
  • 14. Rapid Yield Improvement 90 nm 65 nm 45 nm 32 nm Higher Defect 2 year Chip Density Yield (log scale) 2002 2003 2004 2005 2006 2007 2008 2009 2010 32nm yield improvement on track for Q4 ’09 production 14
  • 15. 32nm Manufacturing Fabs D1D Oregon - Now D1C Oregon - 4Q 2009 Fab 32 Arizona - 2010 Fab 11X New Mexico - 2010 15
  • 16. System Integration Discrete SoC Power Memory I/O Regulator High Perf. Logic Memory High Low Power Performance Power Reg. Logic Graphics Logic Low Power Logic Analog I/O I/O Graphics Analog System integration will continue, using key elements such as the AtomTM core, to realize improved performance and power in a smaller form factor 16
  • 17. 32nm SoC Process 45 nm 32 nm 22 nm Process: P1266 P1266.8 P1268 P1269 P1270 P1271 Products: CPU SoC CPU SoC CPU SoC Intel is developing both CPU and SoC versions of each process generation, to provide transistors, interconnects and other device features optimized for each product line 17
  • 18. Integrated Device Manufacturer Advantage Process Product Design for Manufacturing Co-Optimized Process+Product Rapid Yield Learning Early Product Ramp Design Tools Manufacturing Masks Packaging 18
  • 19. Summary • Intel has developed a 32nm logic technology with industry-leading features • Intel is first to demonstrate working 32nm processors • Intel’s 32nm process is on track for production readiness in Q4 ’09 • Both CPU and SoC versions of this 32nm process will be available • Intel’s strength as an integrated device manufacturer allows us to continue to deliver new generations of advanced process technology on a 2 year cadence 19
  • 20. Risk Factors The above statements and any others in this document that refer to plans and expectations for the first quarter, the year and the future are forward-looking statements that involve a number of risks and uncertainties. Many factors could affect Intel’s actual results, and variances from Intel’s current expectations regarding such factors could cause actual results to differ materially from those expressed in these forward-looking statements. Intel presently considers the following to be the important factors that could cause actual results to differ materially from the corporation’s expectations. Current uncertainty in global economic conditions pose a risk to the overall economy as consumers and businesses may defer purchases in response to tighter credit and negative financial news, which could negatively affect product demand and other related matters. Consequently, demand could be different from Intel's expectations due to factors including changes in business and economic conditions, including conditions in the credit market that could affect consumer confidence; customer acceptance of Intel’s and competitors’ products; changes in customer order patterns including order cancellations; and changes in the level of inventory at customers. Intel operates in intensely competitive industries that are characterized by a high percentage of costs that are fixed or difficult to reduce in the short term and product demand that is highly variable and difficult to forecast. Revenue and the gross margin percentage are affected by the timing of new Intel product introductions and the demand for and market acceptance of Intel's products; actions taken by Intel's competitors, including product offerings and introductions, marketing programs and pricing pressures and Intel’s response to such actions; Intel’s ability to respond quickly to technological developments and to incorporate new features into its products; and the availability of sufficient supply of components from suppliers to meet demand. The gross margin percentage could vary significantly from expectations based on changes in revenue levels; capacity utilization; excess or obsolete inventory; product mix and pricing; variations in inventory valuation, including variations related to the timing of qualifying products for sale; manufacturing yields; changes in unit costs; impairments of long-lived assets, including manufacturing, assembly/test and intangible assets; and the timing and execution of the manufacturing ramp and associated costs, including start-up costs. Expenses, particularly certain marketing and compensation expenses, as well as restructuring and asset impairment charges, vary depending on the level of demand for Intel's products and the level of revenue and profits. The tax rate expectation is based on current tax law and current expected income. The tax rate may be affected by the jurisdictions in which profits are determined to be earned and taxed; changes in the estimates of credits, benefits and deductions; the resolution of issues arising from tax audits with various tax authorities , including payment of interest and penalties; and the ability to realize deferred tax assets. The recent financial crisis affecting the banking system and financial markets and the going concern threats to investment banks and other financial institutions have resulted in a tightening in the credit markets, a reduced level of liquidity in many financial markets, and extreme volatility in fixed income, credit and equity markets. There could be a number of follow-on effects from the credit crisis on Intel’s business, including insolvency of key suppliers resulting in product delays; inability of customers to obtain credit to finance purchases of our products and/or customer insolvencies; counterparty failures negatively impacting our treasury operations; increased expense or inability to obtain short-term financing of Intel’s operations from the issuance of commercial paper; and increased impairments from the inability of investee companies to obtain financing. Gains or losses from equity securities and interest and other could also vary from expectations depending on gains or losses realized on the sale or exchange of securities; gains or losses from equity method investments; impairment charges related to debt securities as well as equity and other investments; interest rates; cash balances; and changes in fair value of derivative instruments. The current volatility in the financial markets and overall economic uncertainty increases the risk that the actual amounts realized in the future on our debt and equity investments will differ significantly from the fair values currently assigned to them. The majority of our non-marketable equity investment portfolio balance is concentrated in companies in the flash memory market segment, and declines in this market segment or changes in management’s plans with respect to our investments in this market segment could result in significant impairment charges, impacting restructuring charges as well as gains /losses on equity investments and interest and other. Intel's results could be impacted by adverse economic, social, political and physical/infrastructure conditions in the countries in which Intel, its customers or its suppliers operate, including military conflict and other security risks, natural disasters, infrastructure disruptions, health concerns and fluctuations in currency exchange rates. Intel's results could be affected by adverse effects associated with product defects and errata (deviations from published specifications), and by litigation or regulatory matters involving intellectual property, stockholder, consumer, antitrust and other issues, such as the litigation and regulatory matters described in Intel's SEC reports. . 20
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