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TECHNICAL  CAPABILITY
<ul><li>Thru hole : </li></ul><ul><li>Aspect ratio =<  14 </li></ul><ul><li>Drilling diameter  150 µ  </li></ul><ul><li>Ma...
General capability
Technical investments
Technical investments Laser vias filling line Router with CCD camera and Z axis control Drilling (OIR & 300KT/MN) LDI (Par...
Reliability
<ul><ul><li>12 layers  </li></ul></ul><ul><ul><li>2.4 mm thickness </li></ul></ul><ul><ul><li>8000 interconnected holes   ...
Process Control Board <ul><ul><li>Production of  3 boards per week </li></ul></ul><ul><ul><li>Base Materials control (Tg  ...
Industrial designs & examples for high reliable boards
or Base materials : high Tg (175°C°) epoxy with fillers and phenolic hardener
BGA from 0.8 to 1 mm pitch
 
Blind holes Thru holes BGA at 1 mm pitch (1500 boules)
Main technology in the case of “large” BGA’s  (number of balls from 800 to 1800)  Main markets : Avionics, Military, Indus...
High Density PCB’s Designs & examples for HDI boards (Advanced technology)
High Density PCB’s The packaging “orientation” is mainly due to :  - the market segment (”consumer” vs “professional”...) ...
High Density PCB’s BGA at 0.5 to 0.3 mm pitch
High Density PCB’s BGA at 0.5 mm pitch without lines between pads
High Density PCB’s Example Thru holes drilled at 0.25 mm Laser holes drilled at 0.1 mm 100 µ lines Thickness : 1 mm BGA pi...
High Density PCB’s BGA at 0.5 mm pitch with one line between 2 pads
High Density PCB’s BGA at 0.4 mm pitch with one line between 2 pads
High Density PCB’s BGA at 0.3 mm pitch without lines between pads
High Density PCB’s Main packaging when BGA pitch  =< 0.5 mm  Main markets : communication and/or handled  Electronic devic...
High Density PCB’s Advanced technology  for Specific Needs (close to silicon devices)
High Density PCB’s
High Density PCB’s  BGA at 0.5 mm pitch : one line between 2 pads   sequential board Drilled holes at 150µ 60 µ lines
High Density PCB’s Double sided board : - Flip-chip at 250 µ pitch - 165 µ pad - Drilling at 100 µ - Base material : Hitac...
High Density PCB’s
High Density PCB’s 58 µ 55 µ 30 µ 35 µ 45 µ 90 µ 110 µ External line with Nickel & Gold Inner line Inner line 100 µ drille...
High Density PCB’s
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Technical Capability

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Transcript of "Technical Capability"

  1. 1. TECHNICAL CAPABILITY
  2. 2. <ul><li>Thru hole : </li></ul><ul><li>Aspect ratio =< 14 </li></ul><ul><li>Drilling diameter 150 µ </li></ul><ul><li>Materials (RoHS) : </li></ul><ul><li>High Tg epoxy (Tg 175°C) completely compatible RoHS (Filler et phenolic hardener) ‏ </li></ul><ul><li>Materials for high frequencies (4 to 15 GHz) ‏ </li></ul><ul><li>Green materials (Halogen free) </li></ul><ul><li>Low deformation materials (X,Y,Z) ‏ </li></ul><ul><li>Lines & spacing : </li></ul><ul><li>AOI check </li></ul><ul><li>Clean room classe 100 </li></ul><ul><li>40 µ lines / 60 µ spacing </li></ul><ul><li>Laser vias : </li></ul><ul><li>Sequential multilayers (3 levels) </li></ul><ul><li>Stacked Microvias </li></ul><ul><li>Laser Holes 75 µ </li></ul><ul><li>Finishes : </li></ul><ul><li>Electroless nickel-gold </li></ul><ul><li>Electroless tin - OSP </li></ul><ul><li>HASL- Fused tin-lead </li></ul><ul><li>Ionic contamination < 0.3 µg/cm2 </li></ul><ul><li>Blind vias : </li></ul><ul><li>drilling 100 µ </li></ul>General capability
  3. 3. General capability
  4. 4. Technical investments
  5. 5. Technical investments Laser vias filling line Router with CCD camera and Z axis control Drilling (OIR & 300KT/MN) LDI (Paragon 8W) Laser plotter (LP5008) DES line AOI & AOR (Automatic Optical Repair) Electroless nickel-gold line 2009 2008 2007
  6. 6. Reliability
  7. 7. <ul><ul><li>12 layers </li></ul></ul><ul><ul><li>2.4 mm thickness </li></ul></ul><ul><ul><li>8000 interconnected holes ( « daisy chain ») ‏ </li></ul></ul><ul><ul><li>Drilled holes from 0.25 mm to 1.1 mm </li></ul></ul><ul><ul><li>BGA’s au pas de 1 et 1.27 mm </li></ul></ul><ul><ul><li>CMS pads </li></ul></ul><ul><ul><li>Internal connections at several levels </li></ul></ul>Reliability : Process Control Board
  8. 8. Process Control Board <ul><ul><li>Production of 3 boards per week </li></ul></ul><ul><ul><li>Base Materials control (Tg 175°C) ‏ </li></ul></ul><ul><ul><li>Plating Control (Electroless & electrolytic copper baths) </li></ul></ul><ul><ul><li>Thermal shocks and microsections : - 1 to 4*10s at 287 °C on “standard” high Tg epoxy - 2 to 8*10s at 300 °C on high Tg epoxy « ROHS » </li></ul></ul><ul><ul><li>--> Controls according to IPC A600 (classe 3) </li></ul></ul>Advance detection of board failure modes Process and Material board qualification
  9. 9. Industrial designs & examples for high reliable boards
  10. 10. or Base materials : high Tg (175°C°) epoxy with fillers and phenolic hardener
  11. 11. BGA from 0.8 to 1 mm pitch
  12. 13. Blind holes Thru holes BGA at 1 mm pitch (1500 boules)
  13. 14. Main technology in the case of “large” BGA’s (number of balls from 800 to 1800) Main markets : Avionics, Military, Industriel, “big” computers Evolutions : high number of layers (+ 40% in 4 years) Base copper thickness of 35µ (Low voltage ; “differential” signals) Controlled impedances “ Sequential” boards
  14. 15. High Density PCB’s Designs & examples for HDI boards (Advanced technology)
  15. 16. High Density PCB’s The packaging “orientation” is mainly due to : - the market segment (”consumer” vs “professional”...) - the BGA pitch - the “matrix” size (number of balls) - the electrical constraints (impedance, signal quality ...) - the assembly constraints (thermal shocks, finishes ...)
  16. 17. High Density PCB’s BGA at 0.5 to 0.3 mm pitch
  17. 18. High Density PCB’s BGA at 0.5 mm pitch without lines between pads
  18. 19. High Density PCB’s Example Thru holes drilled at 0.25 mm Laser holes drilled at 0.1 mm 100 µ lines Thickness : 1 mm BGA pitch 0.5 mm External Layer Internal Layer
  19. 20. High Density PCB’s BGA at 0.5 mm pitch with one line between 2 pads
  20. 21. High Density PCB’s BGA at 0.4 mm pitch with one line between 2 pads
  21. 22. High Density PCB’s BGA at 0.3 mm pitch without lines between pads
  22. 23. High Density PCB’s Main packaging when BGA pitch =< 0.5 mm Main markets : communication and/or handled Electronic devices (mobile phones, Bluetooth, PDA ...) Future : high packages matrix (more balls) stacked vias Less total plated thru holes thinner lines & spacing
  23. 24. High Density PCB’s Advanced technology for Specific Needs (close to silicon devices)
  24. 25. High Density PCB’s
  25. 26. High Density PCB’s BGA at 0.5 mm pitch : one line between 2 pads sequential board Drilled holes at 150µ 60 µ lines
  26. 27. High Density PCB’s Double sided board : - Flip-chip at 250 µ pitch - 165 µ pad - Drilling at 100 µ - Base material : Hitachi 679F 100µ 200µ Cuivre Nickel-Or chimique
  27. 28. High Density PCB’s
  28. 29. High Density PCB’s 58 µ 55 µ 30 µ 35 µ 45 µ 90 µ 110 µ External line with Nickel & Gold Inner line Inner line 100 µ drilled hole
  29. 30. High Density PCB’s
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