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Powerlink pcb innovation from EI
 

Powerlink pcb innovation from EI

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See how EI has innovated a new technology to handle the heat dissipation in PCB. This leads to extended PCB life and safety in overall functioning!!

See how EI has innovated a new technology to handle the heat dissipation in PCB. This leads to extended PCB life and safety in overall functioning!!

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    Powerlink pcb innovation from EI Powerlink pcb innovation from EI Presentation Transcript

    • Thermal ManagementBy using PLPCB technology with HEAVY Copper in PCB
    • www.eiconnect.com PLPCB What is PLPCB technology….. •PLPCB (PowerLink Printed Circuit Boards) technology allows multiple copper weights on the PCB for the Buss Bar Application. “PowerLink” “PowerLink” is defined as the use of 2 or more copper weights on the same external layer of a printed wiring board. What is Heavy / Extreme Copper…… •“Heavy Copper” is defined as any circuit with a copper weight in excess of 4oz/ft2 on a printed circuit board. “Extreme Copper” refers to 10oz/ft2 to 50oz/ft2 (.014” to .07”).Quality on Time: All the Time
    • www.eiconnect.com Why use Heavy Copper?  Increased mechanical strength at connector sites and plated holes.  Increase in cross-sectional area of conductors without increasing trace width or decreasing trace/trace spacing.  Higher current carrying capacity in traces AND in through holes or vias.  Use of high temperature dielectric materials to their full potential. •PowerLink PCB can reduced:  In size reduction.  To protect circuit failure when it’s NOT an option  Reduce number of connectors w/PLPCB.Quality on Time: All the Time
    • www.eiconnect.com Design Considerations For Heavy Copper and “PowerLink” circuitsQuality on Time: All the Time
    • www.eiconnect.com Board Size & Overall Layout  Board size is limited: • 1-2 layers, max. board size is 16” x 22” • 3-14 layers, max. board size is 16” x 22”  Board size is limited by process equipment  Symmetrical construction minimizes bow & twist  Balanced circuit density minimizes uneven plating and prevents poor lamination (de-lam)Quality on Time: All the Time
    • www.eiconnect.com Construction Stack-Up Final Thickness is based on the heaviest Copper weights. • Copper thickness (1.4mil / oz) • Final thickness tolerance is +/- 10%Quality on Time: All the Time
    • www.eiconnect.com Holes & Interconnections Maximum Copper thickness in the holes is depending upon the size of the holes. • Average 3mil of diameter for every oz. of Copper plated to accommodate the heavy copper plating. Minimum pad diameter : = (oz Cu plated x 3) + required drill size + 10 mil (internal or external layers). •Minimum clearance diameter: = (oz Cu plated x 3) + required drill size + 20 mil (internal layers)Quality on Time: All the Time
    • www.eiconnect.com Holes & Interconnections • Vias can be plated shut as necessary. • “PLPCB” requires 1 drill file per copper weight. • Non supported holes (NPT with copper pad) are not affected by heavy copper. • Edge plating. • Plated castellation.Quality on Time: All the Time
    • www.eiconnect.com Current Carrying Capacity A baseline method of SIZING CONDUCTORS: • Current, temperature rise and cross-sectional area. • Energy generated by the flow of electrical current and the resulting power dissipation. • Use of computer aided thermal analysis; this is due to the multitude of factors affecting power dissipation.Quality on Time: All the Time
    • www.eiconnect.com Current Carrying Capacity Baseline Calculation •External traces: I = 0.025 X ΔT 0.45 X W 0.79 X Th 0.53 I= Current in Amps, ΔT = Temp. rise due to power loss, •W= Trace width, Th= Trace thickness •Internal traces should be derated by 50%Quality on Time: All the Time
    • www.eiconnect.com Thermal Management •Some variables to consider: •• Environment (exposed to air, space, another gas) •• Board material properties such as: •• Thermal conductivity •• Material density •• Fluid velocities and viscosities •• Thickness between layers/planes •• Number of copper planes and their thickness •• Number of plated vias, their diameter and Cu weight •• Heat sources other then trace power loss.Quality on Time: All the Time
    • www.eiconnect.com Methods of Heat Transfer 1) Conduction depends on: - Copper planes and their thickness 2) Convection depends on: - Fluid Temperature & Velocity, Forced or natural 3) Radiation depends on: - Heat sources or sinks Consider all three when optimizing a designQuality on Time: All the Time
    • www.eiconnect.com “Built-In” Copper Heat-sinks Dissipate heat away from the source • By conduction and emit this heat to the environment by convection. • Use of Thermal Dielectric like “Thermal Clad” or “T-Preg” in the heat sinks. • Use of Heavy copper “Thermal” vias for the heat transfer. • Use of Heavy copper circuits to create “built-in” copper heat-sinks.Quality on Time: All the Time
    • www.eiconnect.com Why EI? The power electronics industry is one of our focus group. We have years of experience developing processes and manufacturing heavy copper circuits. We have …  Aggressive R&D program Unique manufacturing capabilities:  PLPCB (PowerLink PCB) with multi-copper weights capabilities.  Heavy / Extreme copper tracks and vias.  Edge Plating & Plated Castellations.Quality on Time: All the Time
    • www.eiconnect.com Production Capabilities Layer count: 1 - 25 Overall board thickness: 5 - 250 mil Smallest drilled holes size: 6 mil, (Pad to Hole size may limit heavy copper, contact us for more detail. Copper weights: Outer-layers: up to 50 doz/ft2 (3.12 lbs./ft2) Inner-layers: up to 8 oz/ft2, with standard processes & up to 90 oz w/special processing. •Dielectric Materials: FR4, Polyimide, BT-epoxy, Cyanate, Ester, High Frequency laminates – otherQuality on Time: All the Time
    • www.eiconnect.com Production Capabilities LPI Solder-mask : • Green, Red, Black in semi-gloss. Silkscreen Ink: • LPI White ink (5 mil or larger features) • Available in : white, black or yellow (8 mil or greater) Final Finishes: • Lead Free HASL Solder, HASL PbSn Solder, ENIG, OSP Electrical testing: • Net listed (with fixture), flying probe(fixtureless) • Insulation Resistance and HI-POT testing Production Lot traceability on all partsQuality on Time: All the Time
    • www.eiconnect.comQuality on Time: All the Time
    • www.eiconnect.comQuality on Time: All the Time
    • www.eiconnect.comQuality on Time: All the Time
    • www.eiconnect.comQuality on Time: All the Time
    • www.eiconnect.com Conductor Width, Spacing and Thickness • Trace sizing is determined by the current carrying capacity required and the temperature rise permitted. • Minimum trace thickness width limited by the manufacturing process and/or voltage constraints. • Maximum trace thickness is limited by the line width and/or spacing. • A circuit board trace, depending on its size and manufacturing process, may not be rectangular in shape. • Additive (plating) processes are preferred to subtractive (etching) processes but are more expensive. Typical conductor width/spacing/thickness tolerance is +/- 20%, although tighter tolerance is achievable.Quality on Time: All the Time
    • www.eiconnect.com Thank YouQuality on Time: All the Time