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[SEMI Theater] Recent Developments in Advanced Packaging Materials and Markets

by on Jul 15, 2010

  • 8,074 views

E. Jan Vardaman, President, TechSearch Intl ...

E. Jan Vardaman, President, TechSearch Intl
Over the last few years, companies have seen the price of silicon fabrication fall and the cost of packaging, assembly, and test rise. As semiconductor companies move to the next technology node, packaging and assembly (including materials interactions) are becoming critical to the success of new designs. This presentation examines new developments in advanced packages and the market for materials.

Presented at the SEMI Theater at SEMICON WEST on July 14, 2010

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[SEMI Theater] Recent Developments in Advanced Packaging Materials and Markets [SEMI Theater] Recent Developments in Advanced Packaging Materials and Markets Presentation Transcript