E. Jan Vardaman, President, TechSearch Intl
Over the last few years, companies have seen the price of silicon fabrication fall and the cost of packaging, assembly, and test rise. As semiconductor companies move to the next technology node, packaging and assembly (including materials interactions) are becoming critical to the success of new designs. This presentation examines new developments in advanced packages and the market for materials.
Presented at the SEMI Theater at SEMICON WEST on July 14, 2010
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