Board Design and System Software

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At eInfochips, our deep technology expertise in Board Design and Development, Prototype Development, Testing and Certification and Reengineering sets us apart from our competitors. With 9 Reference Designs, 10 Design IPs, 11 Evaluation Modules and 30 Verification IPs, we have a 132 step checklist for production on second spin.

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Board Design and System Software

  1. 1. eInfochips Board & System Software Practice Overview April 2014
  2. 2. 2 Product Engineering Services Company Bangalore Chennai Pune Ahmedabad Noida Tokyo London BostonChicago Dallas Austin Cedar Rapids Cincinnati Raleigh Sunnyvale 10 Design Centers 12 Sales Offices 1200 Professionals 19 Years Solid Track Record Stable & Secure Cash Positive, Debt-free and Profitable
  3. 3. BOARD DESIGN & DEVELOPMENT eInfochips Offerings 3
  4. 4. Product Level Capabilities Vertex Spartan Kintex Cyclone Flex Nios A3P Series High Speed • USB 2.0 • DDR2 / DDR3 • HDMI • PCIe • SRIO • XAUI / 10G Ethernet • Serial ATA Wireless • GSM / CDMA • GPS • Wi-Fi a/b/g/n • Zigbee • Bluetooth • RFID Display • LVDS • DVI • SDI • HDMI • LCD • Component • Composite Others • PoE • NAND • I2C • SPI • RS232 / RS485 • CAN • Touch Screen Design Tools •Cadence OrCAD •Mentor DxDesigner •Allegro •PADS •Expedition •Betasoft •Hyperlinx •Spectra-Quest
  5. 5. Board-Level Capabilities •400+ Product Design •150+ Hardware Design to Prototype/Production •15+ CMs in 6 Countries Summary •Multi-core SoC design •Multi-processor (8 dual-core on a single board) designs •FPGA based designs Processors •Size: 1.5 to 140+ square inches •Layers: Up to 16 Layer PCB •Frequency: Few KHz to 3.0 Gbps •Technology: HDI (2-level micro vias, Via on Pad) Board •4200 + with 25 BGAs - 1031 pins with 0.65mm pitch Components 5% 3% 0% 71% 21% Layout density >1 0.5 to 0.9 0.1 to 0.49 0.05 to 0.09 <0.05 31% 28% 41% PCB layer count Up to 8 layers 8 to 10 layers 10 to 16 layers 38% 35% 27% Board Frequencies >1GHz 500MHz to 1GHz <500MHz
  6. 6. Testing and Production Capabilities •Assembly Inspection •Power up •Boot prompt •Kernel Prompt Bring-up Testing •Peripheral test •Performance Optimization •Diagnostics Code Functional Test •Timing Analysis •Waveform Shaping •Performance Analysis •Boundary Conditions Testing EDVT •Reliability test •Thermal •Humidity •Destructive Testing Stress Testing •Pre-Compliance Testing •FCC, CE, IC (Class A/B) •Environment testing (Shock, Bump, Vibration) •Safety test (UL294 etc) Prototype Testing •DFM measures •Test Jig/Fixture •Penalization Requirements •Pilot Production •Ensure high first pass yields Contract Manufacturer
  7. 7. Design Phase Detailed design •Use case Analysis •Component Selection •Power tree & Clock tree •Protection Circuits •Circuit Simulations Multi-pass reviews •Requirement Traceability Matrix •Schematics Review Tracker •Layout Guidelines Document Tools •DOORS (Requirements) •PREP (Reviews) •CLEARQUEST (CRN) •ARENA (BOM) •Others (Proprietary) Component Selection Criteria Reusability Lead Time Cost Product Family Package Footprint Special Properties Vendor Alternates Manufacturer Temperature Value Tolerance RoHS / REACH Part Life Status Software Re-usability Schematic Tools Cadence OrCAD Mentor DxDesigner
  8. 8. Development Phase Layout • Mixed Signal Designs • PoE, Protections (ARINC), Cross Talk, • GbE, PCIe, SRIO, SDI Video, DDR3, SATA etc • Multi processor Designs • Electro-Mechanical Integration • Blind and Buried Vias • Special high performance dielectric materials Layout Allegro PADS Expedition Thermal Analysis Betasoft Signal Integrity Analysis Hyperlinx Spectra- Quest
  9. 9. Industrial Design Tools • Autovue • eDrawings • Solidworks Design Experience • IP65 Designs • MIL-STD-810F • Fan-Less Designs • Power Hungry designs • High level of modularity • Aesthetics + Ergonomics Research •Scope •Audit •Interview •Observations •Personas Product Goals •Concept •Scenarios •Elements •Framework •Performance Specifications
  10. 10. SUCCESS STORIES Board design & Development 10
  11. 11. Multiprocessor Dome Camera Key Highlights • Multi Processor, FPGA Design, Industrial Grade Applications • Surveillancee Processor & Peripheral Highlights • Multi-processors + FPGA based Complex Hardware Platform • TI – DaVinci • Freescale PowerPC • Maxim – Video Encoder SoC • Nethra Image Signal Processor • Sony CMOS Imager and • Altera Cyclone- III • Gigabit Ethernet Support with POE Powered Option • USB 2.0 Interface for Mass Storage application • SATA Hard disc support (In-built Hard disc recording – DVR functionality) • IP66 rated design Special Features • FCC Class-B Certified Product • Wide temperature range including sub zero temperatures
  12. 12. High-Resolution Surveillance Camera • FPGA RTL design and integration with third party IPs • Video Scaling from 4K x 3K to 320 x 240 • Video Compression (H264 and MJPEG), Audio Compression (AAC) • Device driver development and porting for Linux v2.6.37 • Record and/or live play of up-to four 3M pixel MJPEG streams • WebUI to configure camera parameters • 12M Pixel surveillance camera product involving Software, Hardware and FPGA based design • Support for Auto/manual White Balance, Auto Focus, Auto Exposure, Gain control, Flip, Tilt • Contrast, Brightness, Sharpness support • Image Enhancement Pipeline (Pixel correction, CFA Interpolation, Color conversion, Gamma Correction, Noise reduction, Edge enhancement etc.) TI DM8168 TI AM3894 4 x 3MPix MJPEG 2 x 1080P HD 2 x SD 1 x QSD FPGA Image Sensor 12M Pixel OR 4 x 3M Pixel RAW Data 2 x HD Video Ports PCI-ExpressImage Enhancement Pipeline
  13. 13. Product Design Applications: Surveillance, Video Processing Special Features: 4x DDR3-800| 2DDR2-400| Gigabit Ethernet | Portable | SATA | HDMI |AV Encoding + Decoding |4-channel video| 13 Design before Processor was in the market! •TI DM8168 based design •One of the first few Netra Designs in the world •Multi-pass Design reviews •Reviews by Semiconductor vendors design team •Back up Plan: Dual Processor Design •Flexible architecture for 8 product variants •Fan-less Design (14W) •High Speed interconnects •Dual Processor Design •Scalable architecture
  14. 14. Mobile Network Video Recorder Applications: Video Surveillance | Driver behavior Analysis Special Features: 12 IP camera recording | 3G Module with GPS | LCD connectivity | Temperature range -20°C to +60°C 14 • High Definition Recording • Seamless Connectivity • Vibration Proof (MIL-STD-810F method 514.5C) • Modular design for multiple product variants roadmap • Scalable Architecture by cascading multiple units • RS232, USB, MicroUSB, Dual Gigabit Ethernet Interfaces • 128GB SSD, 1TB HDD, 32GB SDHC Storage • Power to 12 Cameras on PoE • 3-axis accelerometer • Redundant Power supply
  15. 15. Case Study - Handheld HD Live Video Streaming Applications: Live video broadcasting over GSM network for professional applications like media coverage Special Features: Modular design to support various video interfaces | 4 different PCAs in a system| Wide operating temperature -40°C to +85°C | Optimized power consumption | Wireless modem support 15 Processor & Peripheral Highlights: • Multi-processors + FPGA based multi board Complex Hardware Platform • TI – DaVinci (DM6467T) , Sitara (AM3505) and MSP430 • Xilinx – Spartan-6 FPGA • DDR3-800, NAND, SD Card • SDI, HDMI and Analog Audio/Video support • Four 3G Modems • Fast Ethernet • 802.11 b/g/n WLAN (Wi-Fi) • Bluetooth 2.1 • USB 2.0 OTG and SD CARD Interface for Mass Storage application • 4.3” LCD with Touch Screen • Battery Operated
  16. 16. Thank you For more information, write us at marketing@einfochips.com or visit www.einfochips.com

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