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µPOST IC Package


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µPOST is a new technology enabling low cost rapid deployment of die on board

µPOST is a new technology enabling low cost rapid deployment of die on board

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  • Save wafer real-estateMore connections per die geometry due to improved pin densityEnables greater pin-out, better CTE tolerance and less transmission line effectsSave test NREWafer level die testing facilitating known good die program improving yieldTurn your die into a probe head and pressure contact to board a fully functional system testSave assembly costsDie can be mounted directly to the circuit boardUses standard pick & place, benefits of imbedded with none of the costsSave on prototype/bring-up costsA device can be uPost processed and mounted onto a bring up board within one dayRapid die to operational bring up board, 400 µPOST’s attached in around 10 minutesFurther overall savings possibleFunctional die per wafer increased, less handling, better imbedding solutionsDie could be tested in-circuit of complete system before final attachmentNext StepContact SemiDice to understand further how you can For instance we can provide a BGA de-process to enable early µPOST samples
  • Transcript

    • 1. Packageless Test and SMT assembly
    • 2. Summary on µPOST1
      Removes many aspects of die to board assembly
      Die can be assembled directly onto copper based circuit boards
      Allows die to be fully tested at the wafer level with minimal cost
      Known good die program with board level build savings possible
      Save wafer real-estate
      For example 400 connections 2.5x2.5mm with 100µm spacing
      Enable for increased connections within existing die geometry
      Save on prototype/bring-up costs
      A device can be mounted onto a bring up board, within one day
      Further overall savings are possible
      Overall component height down to 0.2mm.
      Devices can be attached to yielded SMT boards
      1. Micro-Precision-Optimised-Shaped-Termination , µPOST is pronounced Micro POST
    • 3. µPOST formationuses a standard thermo-sonic bonding tool
      1) Starts as normal, with ball formed on end of wire
      3) Wire breaks as capillary rises, ready for new ball formation, whilst performing 100% connection pull test
      2) Ball is attached & ultrasonically extruded into the capillary to form the characteristic µPOST shape
    • 4. Save Wafer Real Estate
      The patented µPOST technology allows die to be designed with asymmetric sub 150µm area array pads.
      A typical die with 400 external connections….
      3.5x3.5mm with peripheral wire bond pads
      4.5x4.5mm with 200µm full array solder bump
      2.5x2.5mm with 100µm full array µPOST
    • 5. Save Test NRE
      The µPOST technology allows die to be FULLY TESTED at the wafer level, using a simple pressure contact onto a multilayer board.
      Transmission line effects minimised to enable operational speed testing while containing costs
      Remove probe cards costs
      for 400 I/O die are around…….
      $20k and not suitable for hi-speed, analogue or hi-power.
      Pyramid and flex probe cards cost even more
    • 6. Outperform BGA with µPOST
      Solder balls have a low height and a large radius
      Typically 100µm (h) x 100µm (w) on a 250µm pitch
      µPOST have superior height to radius
      For example 100µm (h) x 65µm (w) on a 100µm pitch
      Provides improved tolerance to mismatched Coeff. Thermal Expansion
      Improved mechanical and electrical characteristics with less cost
      Height( L )
      Radius( r )
      For a given displacement:
      A contact Half Height will receive 8 x Force
      A contact double Radius will receive 16 x Force
      The Euler-Bernoulli Beam Equation states Displacement equals (Force x L3 )/3(E x r4)
    • 7. FEA Results
      The gold column stretches, in response to the strain, diffusing shear stress away from the attachment area
      Provide for a more reliable connection than lead free solder or tin
      Important in devices subject to mechanical shock during use (i.e cell phones)
      Displacement 23.5 µm
      Stress 131N/mm2
    • 8. Save Assembly Costs
      µPOSTed die can be assembled directly onto copper based circuit boards.
      Simple, low cost, reliable connections
      Can be made using standard Ultrasonic or Thermosonic
      Can use conductive or non-conductive adhesive
      Can use a hot air gun
      Typical 400 I/O die would require FBGA technology
      Design charges ~$10k
      Lead Time 6 to 8 weeks
      Assembly Charges ~$1/unit @ 1M/month
    • 9. Comparing BGA and µPOSTAssembly
      Wafers In
      Wafers In
      Mount on frame
      Dice Wafer
      Pick off frame
      Die Attach
      Wire bond
      Transfer mold
      Part mark
      Ball Attach
      Bake & Pack
      Screen Print
      Pick & Place
      Reflow Solder
      Final Test
      1. Bond µPOSTs
      2. Test
      3. Mount on Frame
      4. Dice Wafer
      5. Pick off Frame
      6. Tin coat Board
      7. Apply glue
      8. Hot Place Die
      9. Final Test
      Boards Out
      Boards Out
    • 10. Save on Prototype costs
      As soon as Wafers are available, a device can be µPOSTed and mounted onto a bring up board, easily within one day.
      Mounted using standard equipment
      Heated pick & place or pick & place and bake
      Typical Engineering lot for standard assembly….
      $2k adder to standard assembly charge
      Min lot size ~ 50 units
      Lead time 3 days plus freight times
    • 11. Further savings
      Overall component height down to 0.2mm.
      Mobile and handheld growth with high pin-count, high functionality devices can benefit
      Pre-underfill can be applied at wafer level.
      Superior to imbedded chip on board, significantly less handling
      Rapid attach to circuit board with support via pre-underfill
      Devices can be attached to yielded SMT boards using localised heating.
      After passive and SMD reflow the µPOST devices can be attached
      Possible development of test head and heated pick and place
      Allows for complete system test before device is committed to be attached
      No need for subsequent liquid encapsulation (‘glob top’)
      Speeding the assembly line and reducing operational costs
      Less raw materials, Pb free process.
      Less gold than BGA, no die attach material, no expensive laminate, no plastic encapsulation, no solder balls.
    • 12. Conclusion
      Save wafer real-estate
      Save test NRE
      Save assembly costs
      Save on prototype/bring-up costs
      Further overall savings are possible with minimal development
      Contact Jim Palmer at
      for further information
    • 13. The COB technology provides an attractive alternative to packaging, saving on cost and time to market. We are keen on the µPOST technology for these obvious benefits as well as providing improved RF performance. We are looking forward to see the wide adoption of the technology by board assemblers”. EbrahimBusherhri, Lime Micro,
      “Micropost interconnect technology has the potential to both shave time off the critical package design/NPI schedule, and offer a rapid route to the benefits of minimum size packaging.” Mike Warren, Frontier Silicon,
      What the customers say …