System for Data Center Grounding

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System for Data Center Grounding

  1. 1. S TRUCTURED G ROUND ™GSystem for DataFOR DATA Grounding S TRUCTURED ROUND ™ SYSTEM Center CENTER GROUNDING Introduction S TRUCTURED G ROUND ™ GROUNDING SYSTEM C ATA LO G – W W - P CC B 04 Table of Contents Introduction INTRODUCTION How to Use This Catalog . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .2 The Purpose of Grounding . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .3 GROUNDING ROADMAPS Common Bonding Network (CBN) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .4 Service Entrance Grounding Roadmap . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .5 Data Center Grounding Roadmap . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .6 Grounding Data Center Rack Grounding (Raised Floor) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .7 Roadmaps Telecommunications Room Grounding Roadmap . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .8 Telecommunications Room Rack Grounding . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .9 EQUIPMENT & RACK GROUNDING KITS Features and Benefits — PANDUIT ® STRUCTUREDGROUND ™ System for Data Center Grounding . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ..... . . . . . . . . . . .10 Rack Grounding Strip Kits . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ..... . . . . . . . . . . .11 Equipment & Rack Common Bonding Network (CBN) to Rack Jumper Kit . . . . . . . . . . . . . . . . . . . . . . . . . . . . ..... . . . . . . . . . . .11 Grounding Equipment Jumper Kits . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ..... . . . . . . . . . . .12 Kits Paint Piercing Grounding Washer Kits . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ..... . . . . . . . . . . .13 Electrostatic Discharge (ESD) Port Kit . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ..... . . . . . . . . . . .13 Retrofit Rack Grounding Kits . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ..... . . . . . . . . . . .14 Thread-Forming Screws . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ..... . . . . . . . . . . .14 Bonding Screws . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ..... . . . . . . . . . . .14 Common COMMON BONDING NETWORK (CBN) COMPONENTS Bonding Network BICSI/J-STD-607-A Telecommunications Grounding Busbars . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .15 (CBN) Telecommunications Grounding and Bonding Conductor Label Kit . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .15 Components Ring Terminal, Vinyl Expanded Insulation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .16 Code Conductor, Two-Hole, Long Barrel with Window Lug . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .16-17 Flex Conductor, Two-Hole, Long Barrel with Window Lug . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .18 Code/Flex Conductor HTAP Kit . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .19 Code/Flex Conductor HTAP . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .20 Clear Covers for HTCT HTAPs . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .21 Grounding Clamp, U-Bolt, Bronze . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .22 Crimping Grounding Clamp for Water Pipes, Bronze . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .23 Tools Grounding Rod Clamp, Bronze . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .23 CRIMPING TOOLS Hand Operated Plier Type Tool . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .. . . . . . . . . . . . .24 CONTOUR CRIMP ™ Controlled Cycle Tools . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .. . . . . . . . . . . . .24 Die Type, Manual Hydraulic, 14 Ton, Crimping Tool . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .. . . . . . . . . . . . .25 Die Type, Battery Powered Hydraulic, 12 Ton, Crimping Tool . . . . . . . . . . . . . . . . . . . . . . . . . .. . . . . . . . . . . . .26 Technical CD-920 Crimping Dies . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .. . . . . . . . . . . . .27 Information TECHNICAL INFORMATION ® ™ PANDUIT STRUCTUREDGROUND System for Data Center Grounding Application Standards . . . . . . . . . . . . . . .28 Specification Layout for Data Center Grounding per BICSI TDM Manual, 10th Edition . . . . . . . . . . . . . . . . . . . .29 Recommended Sizing of the Telecommunications Bonding Backbone (TBB) and Grounding Equalizer (GE) per J-STD-607-A . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .30 Recommended Cable Sizes for Grounding Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .30 Key Terminology . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .30 Index INDEX Part Number Index . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .31 Related Catalogs . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .32 1
  2. 2. S TRUCTURED G ROUND ™ SYSTEM FOR DATA CENTER GROUNDING How to Use This Catalog Introduction Common Bonding Network (CBN) S TRUCTURED G ROUND ™ SYSTEM FOR DATA CENTER GROUNDING page 4 Common Bonding Network (CBN) • PANDUIT ® STRUCTUREDGROUND™ System for Data Center Grounding is a complete, highly reliable line of products to ground your building and network equipment in compliance with BICSI TDM Manual, 10th Edition and J-STD-607-A, TIA-942, IEEE Std 1100 (IEEE Emerald Book), UL and CSA Introduction Telecommunications Room (see roadmap on page 8) Grounding Roadmaps Equipment & Rack Grounding Kits Data Center Grounding (see roadmap on page 6) Roadmaps Common Bonding Network (CBN) Components Crimping Tools Service Entrance (see roadmap on page 5) Technical Information Index See page 28 for PANDUIT ® STRUCTUREDGROUND™ System for Data Center Grounding Application Standards. For more data center grounding information, see www.panduit.com/dcgrounding. Equipment 4 & Rack Grounding Kits Grounding Roadmaps S TRUCTURED G ROUND ™ SYSTEM FOR DATA CENTER GROUNDING S TRUCTURED G ROUND ™GSystem for DataFOR DATA Grounding S TRUCTURED ROUND ™ SYSTEM Center CENTER GROUNDING Introduction pages 5-9 Data Center Grounding Roadmap • Complies with BICSI TDM Manual, 10th Edition and J-STD-607-A, TIA-942, IEEE Std 1100 (IEEE Emerald Book), UL and CSA • Bonding screws are recommended to mount all panels, equipment, shelves, etc. to ensure electrical continuity between Data Center Rack Grounding (Raised Floor) Introduction Introduction metallic components and the grounded rack • Can be used to ground equipment mounted in cabinets which meet EIA-310-D; installer should bond all cabinet members Back of Rack Shown to the rack grounding strip Paint Piercing Grounding Washer Kit: RGW Back of Racks Shown (see page 13) 3 Data Equipment Racks Bonding Screws are used to 4 mount patch panels to the front of Grounding Grounding Roadmaps the rack: RGTBS (see page 14) Roadmaps 5 3 Equipment Jumper Kit 24" L, 90° Bent: RGEJ (see page 12) 1 Equipment Electrostatic Discharge (ESD) Equipment & Rack 3 Port Kit recommended for & Rack Grounding use on front and back of rack: Grounding Kits Kits RGESD (see page 13) AC Panel* 1 Common Telecommunications Bonding Backbone (TBB) Bonding Common Bonding Network Conduit Rack Grounding Strip Kit: RGS (see page 11) Common Bonding Network Network (CBN) Components Building Steel 2 (CBN) Components (CBN) Components Crimping Tools Common Bonding Network (CBN) Equipment Jumper Kit 36" L, 90° Bent: RGEJ (see page 12) Crimping Tools Raised Floor Pedestal 2 Equipment Jumper Kit 24" L, 45° Bent: RGEJ (see page 12) Copper Compression HTAP and Telecommunications Grounding 1 Clear Cover: HTWC 4 Busbar (TGB) and Busbar Label (see page 19) (see page 15) Technical Technical Information Information Bronze, U-Bolt Grounding Clamp: GPL Telecommunications Grounding and Bonding 2 (see page 22) 5 Conductor Label Kit: LTYK Common Bonding Network (CBN) to (see page 15) Rack Jumper Kit: RGCBNJ (see page 11) Copper Compression, Two-Hole, Long 3 Barrel with Window Lug: LCC-W (see pages 16-17) Common Bonding Network – typically #2 AWG Index Index bare copper code conductor is used underfloor *AC Panel should be grounded per NEC standards. Enclosure should be grounded per manufacturer’s specifications. A typical raised floor includes a multitude of metallic components which are connected together. It is the responsibility of the manufacturer and installer of the raised floor to insure all the raised floor metallic components are bonded which means that they are connected together electrically in accordance with applicable specifications. The PANDUIT Bonding/Grounding System does not insure required bonding of the raised floor metallic components. 6 For technical assistance in the U.S., call 866-405-6654 (outside the U.S., see inside back cover for directory) 7 Crimping Tools Detailed Product S TRUCTURED G ROUND ™ SYSTEM FOR DATA CENTER GROUNDING Detailed Tool S TRUCTURED G ROUND ™ SYSTEM FOR DATA CENTER GROUNDING Information Code/Flex Conductor HTAP Information Die Type, Battery Powered Hydraulic, 12 Ton, Crimping Tool • Two stage rapid advance hydraulic system minimizes • Tool provided with two, high capacity 12 VDC rechargeable Introduction For Making Parallel and Multiple Tap Connections on Code and Flex Conductors Introduction pages 11-23 pages 24-27 cycle time nickel-metal hydride batteries — provides for continuous • Provides UL Listed and CSA Certified connections on operation and eliminates "memory" build-up, one hour • Used to tap into continuous conductors as a • Tap grooves are separated from one another charge time splice or pigtailing allowing them to function independently so PANDUIT ® PAN-LUG ™ copper and aluminum lugs and HTAP can be used with a single or multiple splices and copper taps • Eight second crimp cycle time provides quick terminations, • Each HTAP terminates a wide range of saves time conductor sizes and combinations of code taps providing maximum design and • Open "C-Head" design allows easy loading of crimping and flex conductors Class G, H, I and installation flexibility dies and connectors, saves time • Uses industry standard Makita* batteries and charger — Locomotive to suit a variety of applications • Color coded and marked with PANDUIT die • Rubber boot on crimp head provides abrasion protection industry proven reliability easy to obtain from local index numbers for proper crimp die selection retail sources • Slotted design allows quick and easy • Ram automatically retracts when crimp cycle is complete assembly of conductor to HTAP using 3 • Requires crimping tools and dies, see pages • Requires crimping dies, see page 27 Grounding Grounding Roadmaps PANDUIT 94 V-0 cable ties included 25, 26 and 27 Roadmaps • Dies installed using spring loaded die retention pins — no • UL Listed and CSA Certified for applications need for tools HTAP up to 600V when crimped with PANDUIT • Crimp head rotates 360 degrees — provides versatility for RUN and specified competitor crimping tools and use in restricted spaces PANDUIT crimping dies • Tin plated to inhibit corrosion TAP Technical Equipment & Rack Grounding W RUN W L RUN W L Equipment & Rack Grounding Information W RUN L Kits RUN L Kits Std. H Pkg. H H H Part Number Part Description Qty. CT-2931 Terminates PANDUIT ® PAN-LUG ™ Compression Connectors: 1 TAP 1 TAP 2 TAP 3 • Copper compression lugs and splices for #8 AWG – 750 kcmil code conductor TAP 1 TAP 1 TAP 2 TAP 1 • Copper compression lugs and splices for #8 AWG – 600 kcmil flex conductor Common Common Bonding HTCT6-6 HTCT2-2 HTCT250-2 HTCT250-250 Bonding • Copper compression CTAPF taps for #10 AWG – 3/0 AWG code conductor Network Network • Copper compression CTAP taps for #8 AWG – 4/0 AWG code conductor (CBN) (CBN) • Copper compression HTCT taps for #14 AWG – 250 kcmil code conductor, #14 AWG – 4/0 AWG flex conductor Components Figure Components • Aluminum compression lugs and splices for #6 AWG – 600 kcmil code conductor Copper Conductor Size Range Dimensions (In.) Wire • Aluminum compression HTAPS for #14 AWG – 500 kcmil code conductor Wire PANDUIT PANDUIT Strip Std. • PANDUIT ® PAN-TERM ® Tubular Terminals for #8 AWG – 250 kcmil code conductor Strand Crimping Die Color Length Pkg. Part Number Type Run Tap 1 Tap 2 Tap 3 L W H Tool & Die No. (In.) Qty. Warranty: 3 years HTCT6-6-1 #6 - #10 #6 - #14 .61 .40 .99 CT-930, CT-2931 Orange, 11/16 1 Code AWG AWG PH6 CT-2931 includes: — — • Tool #6 - #10 #6 - #14 • Two 12 VDC, rechargeable NiMH batteries Crimping Flex AWG AWG Crimping • One battery charger Tools Tools • Steel tool case with storage for batteries, charger and crimp dies HTCT2-2-1 #2 - #6 #2 - #6 AWG #8 - #14 #8 - #14 .76 .61 1.55 CT-930, CT-2931 Brown, 13/16 1 Code AWG STR/SOL AWG AWG PH2 STR/SOL For the complete line of PANDUIT crimping tools and dies, see the Termination Solutions Catalog SA-TMCB02. CG-920 crimp force measurement gauge available, sold separately, see the Termination Solutions Catalog SA-TMCB02. #2 - #8 #2 - #8 AWG #8 - #14 #8 - #14 *Makita is a registered trademark of Makita Corporation in the United States. Flex AWG AWG AWG HTCT250-2-1 250 kcmil - #2 - #6 AWG #8 - #14 .92 .96 1.92 CT-930, CT-2931 Purple, 1 1 Code #2 AWG STR/SOL AWG PH25 — 4/0 - #2 #2 - #8 AWG #8 - #14 Flex AWG AWG Technical Technical Information HTCT250-250-1 250 kcmil - 250 kcmil - .90 .89 1.92 CT-930, CT-2931 Purple, 1 1 Information Code #2 AWG #2 AWG PH25 — — 4/0 - #2 4/0 - #2 Flex AWG AWG For additional sizes and configurations and to see the complete line of PAN-LUG ™ Power and Grounding Connectors, see the Termination Solutions Catalog SA-TMCB02. Index Index Index 20 26 Technical Information — Includes Application Standards and BICSI TDM Manual, 10th Edition pages 28-30 2
  3. 3. S TRUCTURED G ROUND ™GSystem for DataFOR DATA Grounding S TRUCTURED ROUND ™ SYSTEM Center CENTER GROUNDING Introduction The Purpose of Grounding The grounding system is not just an insurance policy against a lightning strike. It is an active, Introduction functioning system that provides protection for personnel and equipment. Proper grounding is essential for efficient network performance. The purpose of the grounding system is to create a low impedance path to earth ground for electrical surges and transient voltages. Lightning, fault currents, circuit switching (motors turning on and off), and electrostatic discharge are the common causes of these surges and transient voltages. An effective grounding system minimizes the detrimental effects of these electrical surges. Grounding A properly designed grounding system is one that is intentional, visually verifiable, adequately sized Roadmaps to handle expected currents safely, and one that directs these potentially damaging currents away from sensitive communication equipment. Any metallic component that is part of the data center infrastructure (such as equipment, racks, ladder racks, enclosures, cable trays, etc.) must be bonded to the grounding system. What are the effects of improper grounding? Equipment & Rack Decreased Efficiency Grounding • Electrical noise is introduced on data cables when surges are not properly dissipated by the grounding system.They cause Kits faulty data signals and dropped packets, thus decreasing the throughput and overall efficiency of your network. Lower Reliability • According to insurance industry data, improper grounding of communication systems leads to $500 million per year of damage to property and/or equipment due to lightning. (1) Common • The Information Technology Industry Council states that grounding is the single-most important factor in reliable network Bonding Network equipment performance. (2) (CBN) • More than 90% of problems in data communications equipment, including reboot, lockup, and data corruption, are Components traced to problems with grounding. (3) • Industry experts estimate that 27%-33% of damaged equipment in a user's facility is caused by electrostatic discharge. The component cost of repairing damaged equipment is substantial for complex circuit boards, especially when labor and downtime are considered. (4) • According to the IEEE, the typical AC third prong ground is almost never sufficient to prevent damage to network equipment. (5) Crimping Safety Risks Tools • Personal injury from electric shock caused by improper grounding can cause immeasurable human suffering and significant expense. • Potential fire hazards exist when heat is generated from electrical surges that find a high resistance path to ground. Can you afford improper grounding? Network equipment, such as switches, routers and storage devices, costs anywhere from thousands of dollars to hundreds of Technical thousands of dollars.The cost of proper grounding is only a tiny fraction of the cost of the equipment it is protecting. Information Clearly the biggest cost of improper grounding is the inability to service customers properly. PANDUIT ® STRUCTUREDGROUND™ System for Data Center Grounding gives you what you need to properly protect your investment. 1. Mike Holt, "Prevent Shocks in Your Communications: Understanding How the NEC Relies on Ground Resistance Theory Leads to a Successful Application of Communications Grounding," Electrical Construction & Maintenance, September 2002. 2. Information Technology Industry Council (ITI, formerly CBEMA), Guidelines for Grounding Information Technology Equipment. Information Letter, ITI, 15 February 1997. Index 3. Donald G. Pennington and Paul Holzer, "Doing Battle with Those Ground Transients," Electronic Engineering Times, 8 January 1996. 4. ESDA, "Fundamentals of ESD: Part 1 — An Introduction to ESD," 2001, <http://www.esda.org/basics/part1.cfm> (1 October 2004). 5. Institute of Electrical and Electronics Engineers, Inc., IEEE Recommended Practice for Powering and Grounding Electronic Equipment, IEEE Std 1100-1999, 1999. For service and technical support, call 800-777-3300 (outside the U.S. and Canada, see back cover). 3
  4. 4. S TRUCTURED G ROUND ™ SYSTEM FOR DATA CENTER GROUNDING Common Bonding Network (CBN) • PANDUIT ® STRUCTUREDGROUND™ System for Data Center Grounding is a complete, highly reliable line of products to ground your building and network equipment in compliance with BICSI TDM Manual, 10th Edition and J-STD-607-A, TIA-942, IEEE Std 1100 (IEEE Emerald Book), UL and CSA Introduction Telecommunications Room (see roadmap on page 8) Grounding Roadmaps Equipment & Rack Grounding Kits Data Center (see roadmap on page 6) Common Bonding Network (CBN) Components Crimping Tools Service Entrance (see roadmap on page 5) Technical Information Index See page 28 for PANDUIT ® STRUCTUREDGROUND™ System for Data Center Grounding Application Standards. For more data center grounding information, see www.panduit.com/dcgrounding. 4
  5. 5. S TRUCTURED G ROUND ™GSystem for DataFOR DATA Grounding S TRUCTURED ROUND ™ SYSTEM Center CENTER GROUNDING Introduction Service Entrance Grounding Roadmap • Complies with J-STD-607-A and IEEE Std 1100 (IEEE Emerald Book) • Grounding Equalizer (GE) is required when two or more Telecommunications Bonding Backbones (TBB) are used within a multi-story building; bond TBBs together with a GE at the top floor and at a minimum of every third floor in between Introduction Telecommunications Bonding Backbone (TBB)** 2 2 Conduit Grounding Equalizer (GE) 3 Grounding 1 Roadmaps 5 6 Earth Ground 3 7 Equipment & Rack Grounding Kits 3 AC Panel* Cable Entrance Common Bonding Network (CBN) Components AC Service Entrance 3 4 Water Meter 4 Crimping Tools Copper Compression HTAP and Bronze, Grounding Rod Clamp: WB 1 Clear Cover: HTWC 5 (see page 23) connected by a cable to (see page 19) 2 (U-Bolt Grounding Clamp) Bronze, U-Bolt Grounding Clamp: GPL Telecommunications Main 2 (see page 22) connected by a cable to 6 Grounding Busbar (TMGB) and 1 (HTAP) Busbar Label (see page 15) Technical Information Copper Compression, Two-Hole, Long Telecommunications Grounding and Bonding 3 Barrel with Window Lug: LCC-W 7 Conductor Label Kit: LTYK (see pages 16-17) (see page 15) Bronze, Water Pipe Grounding Clamp: KP 4 (see page 23) Index *AC Panel should be grounded per NEC standards. Enclosure should be grounded per manufacturer’s specifications. **Specification J-STD-607-A specifies different size conductors based on the length of the Telecommunications Bonding Backbone (TBB). See page 30 for Recommended Sizing of the Telecommunications Bonding Backbone (TBB) and Grounding Equalizer (GE) Per J-STD-607-A. For service and technical support, call 800-777-3300 (outside the U.S. and Canada, see back cover). 5
  6. 6. S TRUCTURED G ROUND ™ SYSTEM FOR DATA CENTER GROUNDING Data Center Grounding Roadmap • Complies with BICSI TDM Manual, 10th Edition and J-STD-607-A, TIA-942, IEEE Std 1100 (IEEE Emerald Book), UL and CSA • Bonding screws are recommended to mount all panels, equipment, shelves, etc. to ensure electrical continuity between Introduction metallic components and the grounded rack • Can be used to ground equipment mounted in cabinets which meet EIA-310-D; installer should bond all cabinet members to the rack grounding strip Back of Racks Shown 3 Data Equipment Racks 4 Grounding Roadmaps 5 3 1 Equipment & Rack 3 Grounding Kits AC Panel* 1 Telecommunications Bonding Backbone (TBB) Common Bonding Network Conduit (CBN) Components Building Steel 2 Crimping Common Bonding Network (CBN) Tools Raised Floor Pedestal 2 Copper Compression HTAP and Telecommunications Grounding 1 Clear Cover: HTWC 4 Busbar (TGB) and Busbar Label (see page 19) (see page 15) Technical Information Bronze, U-Bolt Grounding Clamp: GPL Telecommunications Grounding and Bonding 2 (see page 22) 5 Conductor Label Kit: LTYK (see page 15) Copper Compression, Two-Hole, Long 3 Barrel with Window Lug: LCC-W (see pages 16-17) Index *AC Panel should be grounded per NEC standards. Enclosure should be grounded per manufacturer’s specifications. A typical raised floor includes a multitude of metallic components which are connected together. It is the responsibility of the manufacturer and installer of the raised floor to insure all the raised floor metallic components are bonded which means that they are connected together electrically in accordance with applicable specifications. The PANDUIT Bonding/Grounding System does not insure required bonding of the raised floor metallic components. 6
  7. 7. S TRUCTURED G ROUND ™GSystem for DataFOR DATA Grounding S TRUCTURED ROUND ™ SYSTEM Center CENTER GROUNDING Introduction Data Center Rack Grounding (Raised Floor) Introduction Back of Rack Shown Paint Piercing Grounding Washer Kit: RGW (see page 13) Bonding Screws are used to mount patch panels to the front of Grounding the rack: RGTBS (see page 14) Roadmaps Equipment Jumper Kit 24" L, 90° Bent: RGEJ (see page 12) Electrostatic Discharge (ESD) Equipment Port Kit recommended for & Rack use on front and back of rack: Grounding Kits RGESD (see page 13) Rack Grounding Strip Kit: RGS (see page 11) Common Bonding Network (CBN) Components Equipment Jumper Kit 36" L, 90° Bent: RGEJ (see page 12) Crimping Tools Equipment Jumper Kit 24" L, 45° Bent: RGEJ (see page 12) Technical Information Common Bonding Network (CBN) to Rack Jumper Kit: RGCBNJ (see page 11) Common Bonding Network — typically #2 AWG Index bare copper code conductor is used underfloor For service and technical support, call 800-777-3300 (outside the U.S. and Canada, see back cover). 7

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