Sputtering Many Machines

740 views
514 views

Published on

We sell from Lab Research models to full production Batch systems and Clusters with sputter down or sideways.

Published in: Business, Technology
0 Comments
0 Likes
Statistics
Notes
  • Be the first to comment

  • Be the first to like this

No Downloads
Views
Total views
740
On SlideShare
0
From Embeds
0
Number of Embeds
15
Actions
Shares
0
Downloads
11
Comments
0
Likes
0
Embeds 0
No embeds

No notes for slide

Sputtering Many Machines

  1. 1. ConfidentialNovember 2008 1 Nordiko Technical Services Limited 500/550 Nest Business Park Martin Road Havant Hampshire PO9 5TL United Kingdom Corporate Member
  2. 2. Confidential 1 Location 50° 51’ 54.67”, 0° 58’ 15.49” Nordiko Technical Services Limited Nest Business Park 500 m2 (5,380 ft2) 70 m2 (750 ft2) cleanroom
  3. 3. Confidential 2 Introduction Nordiko Limited Founded in 1972. Sputtering - magnetron and RF diode sputtering. Ion Beam technology - introduced in 1989. First commercially available RF ion source. Ion Beam Deposition. Ion Beam Milling. Nordiko Limited Acquired by Shimadzu Corporation 1998. Shimadzu decided to close Nordiko in 2003. •Nordiko Technical Services Limited - May 2003. • Acquired by Anelva Corporation - June 2005. • Anelva 100% owned subsidiary of NEC. • NEC sold Anelva to Canon - October 2005. • Bought out Canon - October 2011.
  4. 4. Sputtering At It’s Best A company I used to work for has 4 Nordiko Sputtering Systems and they are 10 years old at this point and being used daily for manufacturing. Darwin King 3 Confidential
  5. 5. Confidential 4September 2013 N2000 - Magnetron Electrodes Features Up to four confocal. Magnet module not immersed in water. Available for magnetic targets. RF diode avaialble.
  6. 6. Confidential 5September 2013 N2000 Module Features Four 150 mm cathodes. Central 200 mm rotary table, 20 rpm. 100 mm vertical travel. Source to substrate separation variable from 100 to 200 mm. Options RF, DC. Co-sputtering. Cooling. Heating. Magnetic field projection. RF bias. Turbomolecular pump, 1400 l.s-1. Cryogenic pump, 1200 l.s-1. WaterPump, 20000 l.s-1 for H2O.
  7. 7. SPUTTERING SYSTEMS N2000 – Up to 4- 150mm (6”) targets N2500 – Up to 4 -250mm (10”) or 6- 150mm (6”) targets 8000 and 8500, Up to 4- 250mm (10”) targets or 6- 200 mm (8”) targets 9000 and 9500, Up to 4- 330 mm (13”) targets or 6- 250 mm (10”) targets Targets can be RF Diode, RF magnetron, DC magnetron or even an Ion etch beam for substrate cleaning. Sputtering at it’s best, Nordiko’s, 2000, 2550, 5000, 8000, 8550, 9000 and 9550 are reliable and long production machines. 6Confidential
  8. 8. With Magnetic Orientation No magnetic Orientation 7 The First Magnetic Orientated Machine was shipped in 1987. Confidential
  9. 9. 8Confidential Top Plate from a 9000 sputtering system. Two sputtering targets and ion source.
  10. 10. Confidential 9 A top Plate for a 9000 system, two Al2O3 targets and an ion source.
  11. 11. Confidential 10 Side view of table for the an 8000 unit.
  12. 12. Confidential 11 Chase area for a 9000 system.
  13. 13. Nordiko’s Cluster tool, Single wafer, Rotating magnetron sputtering With Loadlock! 12Confidential
  14. 14. Magnetic Orientated No Magnetic Orientation
  15. 15. 13 Confidential
  16. 16. Confidential 14 Random access vacuum cassette load lock/s. Standard 25 wafer cassette. Optical sensors for slide out detection. Optical sensors for cassette mapping. 700 l.s-1 turbomolecular pump. 30 m3.hr-1 dry mechanical pump. Combined vacuum gauge covering he range from atmosphere to 1E-08 Torr. VAT series 02. VAT series 62 pipeline isolation valve. Vacuum Cassette Load Lock
  17. 17. Confidential 15 Static cassette load lock. Static four (4) wafer cassette. Vertical travel of the transfer arm (35 mm) is used to pick from four wafer slots within a static cassette. Common vacuum environment to the robot transfer chamber. No isolation valve between the load lock and the transfer chamber. 700 l.s-1 turbomolecular pump. 28 m3.hr-1 dry mechanical pump. Combined vacuum gauge covering he range from atmosphere to 1E-08 Torr. VAT series 02. VAT series 62 pipeline isolation valve. Ideal for research applications where small batches are often processed Vacuum Load Lock - Static Cassette
  18. 18. Confidential 16 Transfer Chamber Transfer chamber. Six port or Eight port. Six port; two load ports and four process ports. Eight port; two load ports and six process ports. Optical sensors for wafer tracking. 700 l.s-1 turbomolecular pump. 30 m3.hr-1 dry mechanical pump. Three axis robot. SCARA style - single end effector. Rotary vacuum seal, magnet fluid feedthrough. Z-axis seal, edge welded bellows. Aligner. Optical CCD aligner. Operates in concert with the robot. Wafer centre alignment ±0.25 mm. Angular alignment ±0.1 degree.
  19. 19. Control Automation System Features System is not a PLC. • Modular computer with industrial I/O. • Intel micro-processor. • OS is Windows CE. • HMI on a separate PC. Installations Fourteen installations. • Three new systems +. • Eleven field retro-fits. • Ten in USA. • One in Japan. ⎬production tools. Confidential 1719
  20. 20. Control Automation System Confidential 18 Features CPU - only Ethernet & COM1 ports. • No video, no keyboard, no mouse. • Networked PC for user interface, HMI. • Flash storage, no rotating hard disc. • Low power CMOS - no fans. • Serial, digital & analogue I/O modules. • No back-plane - I/O modules build the bus. • Intelligent Instrumentation.

×