Platform Circuit Technology UnderlyingHeterogeneous Nano & Tera SystemsProf. Dr. Q. Huang12 May 2011
Outline Background Motivation Sensor Interface and Data Acquisition Body Area Network and Short Range Communication W...
Great ExpectationsImpressive Advances in • Microsystems Technology • Wireless Communications • Internet ConnectivityHave S...
Great ExpectationsGlobal Interest • Chinese companies already   moving fast   • Chinese universities not far   behind   • ...
Modern Healthcare EnvisionsSophisticated, Heterogeneous Systems12 May 2011   Platform Circuit Technology Underlying Hetero...
Sophisticated Electronics Needed to Bind        Sensors & Actuators Into Useful Systems12 May 2011      Platform Circuit T...
Few Can Rely on Off-the-Shelf Components  Most Require Full Custom Integrated Circuits     Cochlear Implant               ...
The Underlying TechnologiesSensors & Systems                                                                              ...
The Underlying Platform - ICs for MedicalData Acquisition and Communication Data Acquisition             Sensor Interfac...
Project Partners    ETH Q. Huang, T. Burger    EPFL C. Deholain    CSEM C. Enz   3 Main Swiss   Institutions in   IC Resea...
Introduction       WBAN Require ULP Miniaturized Sensor Nodes        Wireless body area networks         (WBAN) for healt...
BAN Scenario and System View               WBAN                                           WWAN      battery powered nodes ...
Data Acquisition and Remote Powering  INTERFACE ELECTRONICS12 May 2011      Platform Circuit Technology Underlying Heterog...
Passive Telemetry By ETH                         Implant                                    Low-power, single-chip, fully...
Implantable Passive Telemetry By ETH                                                Chip area: 4.359 mm x 5.245 mm        ...
Multiple Purpose Sensor Interface (EPFL)                 Bio-electric                                                     ...
Wireless Powering of Implants in Human Body              The control unit which is placed on the body can remotely        ...
Remote Powering By EPFL Magnetic Coupling                                   d                      Base Station         ...
Personal and Body Area Network  SHORT RANGE WIRELESS12 May 2011      Platform Circuit Technology Underlying Heterogenous N...
Introduction       MEMS-based Short Range Transceiver Architecture        Front-end filters before the LNA              ...
BAW-based Class-E Power AmplifierTransmitter Chip 0.18µm CMOS technology 1.25 x 1.5 mm2 Integrated in a complete BAW-  ...
BAW-based Class-E Power AmplifierModulated Spectrum 1 Mb/s GFSK                                0                         ...
BAW-based Class-E Power AmplifierPower Consumption Breakdown Block                         Cons. [mW]                     ...
BAW-based Class-E Power AmplifierPrototype      © C. Enz | 2011               Ultralow-power MEMS-based Radio for Wireless...
Wide Area Network – Cellular Radio  BROAD RANGE WIRELESS12 May 2011       Platform Circuit Technology Underlying Heterogen...
Integrated Systems Laboratory   26
Multi Standard RF Transceiver for WAN12 May 2011   Platform Circuit Technology Underlying Heterogenous Nano & Tera Systems...
GSM, EDGE, WCDMA & TD-SCDMA                     64QAM TD-HSPA Rx                                                          ...
Digital Baseband Evolved EDGE                  (E‐EDGE)• International Solid‐State Circuit Conference 2010
• GSM/GPRS/EDGE Prototype    2 modulation types  IC #1      15 coding schemes (CS)  1mm2            • Low cost channel e...
IC #1       IC #2Core size                 1.0mm2 2.0mm2                   Achieve throughput Max clock frequency fmax 172...
Turbo Decoder ASICs for                 WCDMA‐HSDPA and LTE• International Solid‐State Circuit Conference 2008   • Interna...
Our      ISSCC    ISSCC   ISSCC                                               Units                                       ...
• First-generation LTE terminals will target ~100Mb/s• Maximum LTE throughput is 326.4Mb/s in downlink                   I...
• Low-power turbo decoding for HSPA+ requires 57.8mW• 8 -28 x higher power consumption is not tolerable                  I...
• 8 x radix-4 MAP                    decoder cores                  • Master/slave Batcher                    network for ...
power measurements conducted at T=300K for block‐size 3200                 Integrated Systems Laboratory               37
power measurements conducted at T=300K for block‐size 3200  • LTE maximum throughput requires 503mW  • 100Mb/s milestone r...
Summary Internet of Things Builds on Synergy of Three Major Fields Circuit Technology Platform Is a Pillar for Medical E...
Soft‐In Soft‐Out MMSE Parallel         Interference Cancellation• European Solid‐State Circuit Conference 2010• Journal of...
63mm                       7.8mm                                                                           63mm2x2 exhaust...
soft‐info      SISO                                             best                                                      ...
• Supports four Tx antennas                       MMSE filter &               • Compliant to 802.11n WLAN                 ...
Phase-ADC       Phase Analog-to-Digital Converters – Basics        Phase demodulation can be performed directly in the ph...
Phase-ADCPhase ADC – Coding                      111                               111               00011                ...
Phase-ADC       Final 4-bit Phase ADC Architecture                                                                      I(...
Switzerland Is a Leaderin ICs for Microsystems and Wireless Three teams each a leader internationally Skill sets complem...
Excellent Track Record12 May 2011   Platform Circuit Technology Underlying Heterogenous Nano & Tera Systems   48
In the Grand Scheme of Things The Technology Haves and Have-Nots             Access to semiconductor manufacturing depri...
More Than Just WearableIntegrated Circuits Serve Many Prolific Sectors Medical Electronics        Global annual revenue ...
Holding Our OwnIn Research and Entrepreneurship Amongst Top Ten at Chip Olympics                Accepted Papers at ISSCC ...
What Circuit Technology Can Do  - Making A Difference at Top Tier    ETH Startup Supplies RF Transceiver To Tier-    One M...
Demonstrators Universal Data Acquisition System for (Remotely     Powered) Sensor Networks             Applicable to a w...
Sensor Interface and Data Acquisition12 May 2011   Platform Circuit Technology Underlying Heterogenous Nano & Tera Systems
Some of the Challenges                                                                           • Large CM Voltage       ...
Multi Channel EEG Interface by ETH12 May 2011   Platform Circuit Technology Underlying Heterogenous Nano & Tera Systems
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This project investigates the challenges in mixed signal platforms, such as those embedded in biomedical electronics, micro-systems, sensor networks and wireless communications, from both device and systems perspective. Demonstrators will be developed that cover generic sensor interface/data acquisition, passive telemetry, wireless body area network, wireless sensor networking and wireless wide area networks. The achievements will benefit other Nano-Tera projects focusing on the sensor/actuator side of microsystems, as well as wireless communications SoCs that will challenge the state-of-the-art in integration level, versatility and sophistication of nano CMOS systems.

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Placitus

  1. 1. Platform Circuit Technology UnderlyingHeterogeneous Nano & Tera SystemsProf. Dr. Q. Huang12 May 2011
  2. 2. Outline Background Motivation Sensor Interface and Data Acquisition Body Area Network and Short Range Communication Wide Area Network and Cellular Link Summary12 May 2011 Platform Circuit Technology Underlying Heterogenous Nano & Tera Systems 2
  3. 3. Great ExpectationsImpressive Advances in • Microsystems Technology • Wireless Communications • Internet ConnectivityHave Set the Scene forthe Next Big ThingThe Internet of Things or M2M Communication 12 May 2011 Platform Circuit Technology Underlying Heterogenous Nano & Tera Systems 3
  4. 4. Great ExpectationsGlobal Interest • Chinese companies already moving fast • Chinese universities not far behind • National Priority and Support Giving us a run for ourmoney12 May 2011 Platform Circuit Technology Underlying Heterogenous Nano & Tera Systems 4
  5. 5. Modern Healthcare EnvisionsSophisticated, Heterogeneous Systems12 May 2011 Platform Circuit Technology Underlying Heterogenous Nano & Tera Systems
  6. 6. Sophisticated Electronics Needed to Bind Sensors & Actuators Into Useful Systems12 May 2011 Platform Circuit Technology Underlying Heterogenous Nano & Tera Systems
  7. 7. Few Can Rely on Off-the-Shelf Components Most Require Full Custom Integrated Circuits Cochlear Implant Retina Implant Defibrillator & Electronics Cochlear Impl. Electronics12 May 2011 Platform Circuit Technology Underlying Heterogenous Nano & Tera Systems
  8. 8. The Underlying TechnologiesSensors & Systems Sensors Based on Micro & Nano Technologies CSEM WL Sensor Node ETH Implantable CSEM ISM RF SoC Passive Telemetry IC Nano devices above passivation?12 May 2011 Platform Circuit Technology Underlying Heterogenous Nano & Tera Systems 8
  9. 9. The Underlying Platform - ICs for MedicalData Acquisition and Communication Data Acquisition  Sensor Interface  Instrumentation amplifier (sub-µV offset, low noise)  Signal conditioning, data conversion, calibration DSP and Control Loop Algorithm or Circuitry Energy Harvesting and Supply Regulation Short Range Wireless  Incorporating wake-up radio for low duty cycle operations Broad Range Wireless12 May 2011 Platform Circuit Technology Underlying Heterogenous Nano & Tera Systems 9
  10. 10. Project Partners ETH Q. Huang, T. Burger EPFL C. Deholain CSEM C. Enz 3 Main Swiss Institutions in IC Research battery powered nodes remote powered nodes12 May 2011 Platform Circuit Technology Underlying Heterogenous Nano & Tera Systems 10
  11. 11. Introduction WBAN Require ULP Miniaturized Sensor Nodes  Wireless body area networks (WBAN) for health monitoring, connecting wearable devices and as smart user interface  The nodes feature sensing, processing, storing and wireless communication  They are usually battery powered or use remote powering  They require ultralow-power (ULP) and miniaturized wireless sensor nodes  Combination of CMOS system-on-chip (SoC), RF and LF MEMS in a system- in-package (SiP) to achieve a 2.4 GHz, battery powered nodes <mW-level, <20 mm3 node remote powered nodes M. Contaldo, et al., TBioCAS, Dec. 2010. © C. Enz | 2011 Ultralow-power MEMS-based Radio for Wireless Body Area Networks Slide 11
  12. 12. BAN Scenario and System View WBAN WWAN battery powered nodes remote powered nodes Contaldo, Banerjee, Enz for Placitus November Meeting Slide 12
  13. 13. Data Acquisition and Remote Powering INTERFACE ELECTRONICS12 May 2011 Platform Circuit Technology Underlying Heterogenous Nano & Tera Systems 13
  14. 14. Passive Telemetry By ETH Implant  Low-power, single-chip, fully-implantable micro transponder  Wireless powering and communication Base-Unit  Accurate long-term monitoringTransmitter  Independent of time and location for diagnosis and therapy  Low risk of infection (no external catheter) Monitoring setup Systole Sensor Data Oscillator Supply Acquisition Circuit PPM-Output Magnetoresistive A Sensor LPN Diastole D Transponder Sensor PPM-AM reflected RF Magnet Voltage Rectifier Startup Modulator Regulator Artery t RF/DC-Converter Antenna Sensor-transponder-system Block diagram of microtransponder ASIC 12 May 2011 Platform Circuit Technology Underlying Heterogenous Nano & Tera Systems
  15. 15. Implantable Passive Telemetry By ETH Chip area: 4.359 mm x 5.245 mm 2 μm 40 V BiCMOS technology Measured characteristics of the micro transponder RF Carrier 27/40 MHz (ISM) Baud Rate 1 kBaud Modulation PPM-AM S/N Ratio 39.7 dB Equiv. I/P-Offset 170 μV THD (@ f=3.737 Hz, Vpp=5.8 0.16% mV) Power Consumption 0.5 mW Power Consumption of Data 250 μW @ 3V Acquisition Unit 12 May 2011 Platform Circuit Technology Underlying Heterogenous Nano & Tera Systems
  16. 16. Multiple Purpose Sensor Interface (EPFL) Bio-electric Heart Sensors & Brain Activity PH; Glucose; K+, Ca2+, Mg2+; Bio-medical CRP; ISET Sensors Motion Detect Thermal Couples Temperature Accelerometer ECG-electrode pH ISFET sensor Sensor Type ensor Sensor Type Supply Voltage 1.5V 1.7-3.6V Current 1nA 70μA 11μA Contact Resistance 100KΩ Consumption Sensitivity -56mV / pH 56 count/ g Signal Bandwidth 300Hz Sampling Rate - 100/400Hz 40/10Hz Accuracy 10 Bits Power Consumption 13nW @ pH7 ≤175μW ≤27μW 12 May 2011 Platform Circuit Technology Underlying Heterogenous Nano & Tera Systems
  17. 17. Wireless Powering of Implants in Human Body The control unit which is placed on the body can remotely powered the sensors and communicate with them12 May 2011 Platform Circuit Technology Underlying Heterogenous Nano & Tera Systems
  18. 18. Remote Powering By EPFL Magnetic Coupling d  Base Station 2 Implant Input C1 Rectifier Output AC PA M12 Reg. DC voltage voltage L1 L2 C2 CL RL Electromagnetic Coupling d  2 12 May 2011 Platform Circuit Technology Underlying Heterogenous Nano & Tera Systems
  19. 19. Personal and Body Area Network SHORT RANGE WIRELESS12 May 2011 Platform Circuit Technology Underlying Heterogenous Nano & Tera Systems 19
  20. 20. Introduction MEMS-based Short Range Transceiver Architecture  Front-end filters before the LNA  Interferers and image rejection, relax linearity requirements, avoid impedance matching network  Front-end filters after the power amplifier (PA)  Spurious filtering, avoid impedance matching network  Synthesizer  Fixed low phase noise RF LO thanks to high Q  Merged Time & Frequency reference with LF silicon resonator (SiRes) Digital Baseband D. Ruffieux, et al., ESSCIRC 2010. © C. Enz | 2011 Ultralow-power MEMS-based Radio for Wireless Body Area Networks Slide 20
  21. 21. BAW-based Class-E Power AmplifierTransmitter Chip 0.18µm CMOS technology 1.25 x 1.5 mm2 Integrated in a complete BAW- based transceiver No external components in the TX other than the BAW filter and the BALUN for test purposes © C. Enz | 2011 Ultralow-power MEMS-based Radio for Wireless Body Area Networks Slide 21
  22. 22. BAW-based Class-E Power AmplifierModulated Spectrum 1 Mb/s GFSK 0 BT mi=0.34 -10 BT LEBT modulation -20 BT mask  -21.7 dBc, -21.4 dBc @ ±500 kHz -30 dBc  ACP 2: -42 dBm -40  ACP 3: -49 dBm -50 -60BT LE modulation -70  ACP 2: -41 dBm  ACP 3: -44 dBm -80 -4 -3 -2 -1 0 1 2 3 4 Frequency offset [MHz] © C. Enz | 2011 Ultralow-power MEMS-based Radio for Wireless Body Area Networks Slide 22
  23. 23. BAW-based Class-E Power AmplifierPower Consumption Breakdown Block Cons. [mW] At Pout = 5.4 dBm Synthesis 11.11 BAW DCO 2.37 23% Dividers, ΣΔ 3.28 LC VCO 3.38 PLL div., PFD, CP 2.08 6% 55% Selective TX 36.19 IF buffer 0.56 8% RC/CR 2.34 SSB mixer 3.68 8% PPA 3.82 PA PPA PA 25.79 SSB mix RC/CR, Buf IF Chip in TX mode 47.3 Synthesis © C. Enz | 2011 Ultralow-power MEMS-based Radio for Wireless Body Area Networks Slide 23
  24. 24. BAW-based Class-E Power AmplifierPrototype © C. Enz | 2011 Ultralow-power MEMS-based Radio for Wireless Body Area Networks Slide 24
  25. 25. Wide Area Network – Cellular Radio BROAD RANGE WIRELESS12 May 2011 Platform Circuit Technology Underlying Heterogenous Nano & Tera Systems 25
  26. 26. Integrated Systems Laboratory 26
  27. 27. Multi Standard RF Transceiver for WAN12 May 2011 Platform Circuit Technology Underlying Heterogenous Nano & Tera Systems 27
  28. 28. GSM, EDGE, WCDMA & TD-SCDMA 64QAM TD-HSPA Rx WCDMA Band I Tx BS,TDS:CODE POWER DR 52.8 kbps * RBW 30 kHz Chan 1.16 * VBW 300 kHz dB TOT CF 0 Hz Slot 4 Ref 20 dBm Att 25 dB * SWT 2 s -7 10 Ref -14 A 0 A 0.00 -21 dBm -10 -28 1 RM Att CLRWR -20 0 dB -35 -42 -30 -49 -40 1 PA CLRWR -56 -50 -63 3DB -60 -70 3DB Start Code 1 1 Code/ Stop Code 16 B1M RESULT SUMMARY TABLE DR 52.8 kbps Chan 1.16 Center 1.95 GHz 2.55 MHz/ Span 25.5 MHz CF 0 Hz Slot 4 Tx Channel W-CDMA 3GPP REV GLOBAL RESULTS FOR SET 0: Bandwidth 3.84 MHz Chip Rate Error -0.14 ppm Trg to Frame --.-- Power 23.65 dBm Ref B SLOT RESULTS Carr Freq Err -72.46 Hz 0.00 Adjacent Channel dBm P Data -8.12 dBm IQ Imbal/Offs 0.12/0.51 % Bandwidth 3.84 MHz Lower -45.20 dB P D1 -8.20 dBm RHO 0.9986 Att 0 dB P D2 -8.05 dBm Composite EVM 3.77 % Spacing 5 MHz Upper -44.54 dB P Midamble -7.64 dBm Pk CDE(SF 16) -36.11 dB Active Channels 1 Average RCDE -40.04 dB Alternate Channel CHANNEL RESULTS Bandwidth 3.84 MHz Lower -55.36 dB 1 AVG Channel.SF 1.16 Data Rate 52.8 kbps Spacing 10 MHz Upper -55.93 dB ChannelPwr Rel -0.01 dB ChannelPwr Abs -8.13 dBm 3DB Symbol EVM 1.00 %rms Symbol EVM 2.31 %Pk GSM Tx Modulation Spectrum * RBW 30 kHz EDGE Tx * RBW 30 kHz Modulation Spectrum * VBW 30 kHz * VBW 30 kHz Ref 10 dBm * Att 10 dB * SWT 1 s Ref 5 dBm * Att 10 dB * SWT 1 s 10 LIMIT CHECK PASS 0 LIMIT CHECK PASS 0 1 AV GAT -10 GAT 1 AV AVG TRG TRG -10 AVG -20 -20 -30 -30 -40 -40 SWP 4 of 200 3DB -50 SWP 4 of 200 3DB -50 -60 -60 MODU_E -70 MODU_G -70 -80 -80 -90 -90 Center 915 MHz 100 kHz/ Span 1 MHz Center 915 MHz 100 kHz/ Span 1 MHz12 May 2011 Platform Circuit Technology Underlying Heterogenous Nano & Tera Systems 28
  29. 29. Digital Baseband Evolved EDGE  (E‐EDGE)• International Solid‐State Circuit Conference 2010
  30. 30. • GSM/GPRS/EDGE Prototype  2 modulation types IC #1  15 coding schemes (CS) 1mm2 • Low cost channel equalizer • Flexible Viterbi decoder Prototype IC #2 2mm2 • Supports also Level‐A E‐EDGE  4 modulation types, 23 CS • Efficient solution for 16QAM/32QAM channel equalization • Flexible Viterbi and Turbo decoder with shared memories Integrated Systems Laboratory 30
  31. 31. IC #1 IC #2Core size 1.0mm2 2.0mm2 Achieve throughput Max clock frequency fmax 172MHz 151MHz requirements withLeakage current 0.49mA 0.6mA ftarget=40MHzContinuous burst reception (8 time slots)Avg power at ftarget=40MHz and VDD=1.2V Scale supply voltageGPRS CS1 (GMSK) 2.4mW 6.8mWEDGE MCS9 (8‐PSK) 5.2mW 11.2mW Less than 5mW E‐EDGE DAS12 (32QAM) ‐‐‐ 19.9mW in fastest mode Integrated Systems Laboratory 31
  32. 32. Turbo Decoder ASICs for WCDMA‐HSDPA and LTE• International Solid‐State Circuit Conference 2008 • International Solid‐State Circuit Conference 2010• Journal of Solid‐State Circuits 2009 • Journal of Solid‐State Circuits 2011
  33. 33. Our ISSCC ISSCC ISSCC Units Early termination  chip 2003 2002 2002  Less than 10mW  UMTS UMTS, UMTS, in high SNR regimes Standard UMTS (cdma HSDPA HSDPA 2000) 60 10.8Mb/sCMOS 0.13 0.18 0.18 0.25 μm Power [mW]Die size 1.2 14.5 9.0 8.9 mm² fixed VDD and fclkMax. Θ 18.6 24 4.1 5.5 Mb/s@ 6 itersPower 57.8 956 292 mW n.a.@ (iters) (10.8) (10.8) (2.0) Mb/s 10 scaled VDD and fclkEnergy nJ/b 0.7 11.1 14.6 6.9Efficiency /iter 0.5 Eb/N0[dB] 4.5 Smallest die size, lowest power consumption  and best energy efficiency published so far Integrated Systems Laboratory 33
  34. 34. • First-generation LTE terminals will target ~100Mb/s• Maximum LTE throughput is 326.4Mb/s in downlink Integrated Systems Laboratory 34
  35. 35. • Low-power turbo decoding for HSPA+ requires 57.8mW• 8 -28 x higher power consumption is not tolerable Integrated Systems Laboratory 35
  36. 36. • 8 x radix-4 MAP decoder cores • Master/slave Batcher network for efficient address mapping • Implementation loss within 0.14dB SNRIntegrated Systems Laboratory 36
  37. 37. power measurements conducted at T=300K for block‐size 3200 Integrated Systems Laboratory 37
  38. 38. power measurements conducted at T=300K for block‐size 3200 • LTE maximum throughput requires 503mW • 100Mb/s milestone requires only 68.6mW Our ASIC achieves 10x higher throughput at the same power required by a state‐of‐the‐art HSDPA turbo decoder Integrated Systems Laboratory 38
  39. 39. Summary Internet of Things Builds on Synergy of Three Major Fields Circuit Technology Platform Is a Pillar for Medical Electronics The Placitus Consortium Aims To Create Low Power and Highly Integrated Solutions Data Acquisition, Remote Powering, Short Range Radio and WAN module Are Among the Focuses Early Results Are Promising Much Is Still To Be Done12 May 2011 Platform Circuit Technology Underlying Heterogenous Nano & Tera Systems 39
  40. 40. Soft‐In Soft‐Out MMSE Parallel  Interference Cancellation• European Solid‐State Circuit Conference 2010• Journal of Solid‐State Circuits 2011• Swisscom Award 2010
  41. 41. 63mm 7.8mm 63mm2x2 exhaustive  3x3 exhaustive 4x4 exhaustive search detector search detector 7.8mmsearch detector  64-QAM 64-QAM 64QAM  1.0mm 1.0mm • Complexity grows exponentially in the number of Tx antennas • Example: IEEE 802.11n WLAN would require evaluation of up to  0.5 quadrillion (0.5∙1015) candidate vectors per second • Smarter way: Sphere Decoder (STS‐SD)  still very complex Integrated Systems Laboratory 41
  42. 42. soft‐info SISO best Iteratively exchange  channel MIMO iterations soft‐information decodery detector a‐priori info  tremendous gain 100 SISO STS‐SD• Parallel Interference Cancellation  SISO MMSE‐PIC(PIC) cancels spatial interference soft‐output iterative 10‐1 MIMO MIMO decoding decoding• MMSE‐PIC close to (optimum) Sphere Decoder performance 7dB 10‐2• MMSE‐PIC significantly less complex 10‐3 2dB 6 8 10 12 14 16 18 20 22 24 Integrated Systems Laboratory 42
  43. 43. • Supports four Tx antennas MMSE filter & • Compliant to 802.11n WLAN soft information PIC1.225mm Clock frequency 560MHz matrix pre- inversion Core area 1.5mm2 process Data rate 750Mb/s I/O Power consumption 190mW 1.225mm Integrated Systems Laboratory 43
  44. 44. Phase-ADC Phase Analog-to-Digital Converters – Basics  Phase demodulation can be performed directly in the phase domain without the need for a multi-bit - ADC I in (t )  cos (t )  111 111 Qin (t )  sin  (t )  00011 00001 11 11 11 01 N=4 11 00 00 00 I in,k (t )  I in (t )  cos k  Qin,k (t )  Qin (t )  sin  k  k  k   with k  0 2 N  1 10 N 2 00 00 00 1 11 11 00 11110 11 11100 I k  I in,k (t )  Qin,k (t )  cos (t )   k  00 00 0 00 000 000 S. Samadian, et al., JSSC, Aug. 2003. © C. Enz | 2011 Ultralow-power MEMS-based Radio for Wireless Body Area Networks Slide 44
  45. 45. Phase-ADCPhase ADC – Coding 111 111 00011 00001 11 11 1 1 01 11 00 00 00 10 00 00 00 11 11 11 00 11110 11100 10 00 00 00 000 000 © C. Enz | 2011 Ultralow-power MEMS-based Radio for Wireless Body Area Networks Slide 45
  46. 46. Phase-ADC Final 4-bit Phase ADC Architecture I(0+) Pre- amplifiers comparators V(0+) Latch 1 V(0+) R I(1 VI+ I(0+) C1 ) 5+ V(157-) V(22+) V(0-) R gm 35 VI- I(0-) I(4 -) L R Latch 2 VI+ V(45+) V(22+) R V(135-) 2R C2 gm/2 I(45+) V(22-) VQ- R I(45+) V(112-) 2R V(67+) R VI- 2R gm/2 R VQ+ I(90-) R VQ+ I(90+) I(90+) 2R 2R V(90+) R gm V(90-) VQ- I(90-) 2R R V(67-) V(112+) 2R R VQ+ gm/2 I(135+) R VI+ V(45-) 2R V(135+) I(135-) R VQ- R I(1 gm/2 ) V(157+) V(157+) Latch 8 5- VI- V(22-) 35 R C8 I(4 V(157-) + R ) V(0-) I(0-) B. Banerjee, C. Enz, E. Le Roux, ISCAS, 2010. © C. Enz | 2011 Ultralow-power MEMS-based Radio for Wireless Body Area Networks Slide 46
  47. 47. Switzerland Is a Leaderin ICs for Microsystems and Wireless Three teams each a leader internationally Skill sets complementary to each other  EPFL & ETH in data acquisition and energy harvesting  CSEM in modeling, short range wireless and protocol  ETH in wide range wireless and sensor interface Combined to cover complete technology platform for miniaturized medical and other systems Concentration of know-how unrivalled by other countries12 May 2011 Platform Circuit Technology Underlying Heterogenous Nano & Tera Systems 47
  48. 48. Excellent Track Record12 May 2011 Platform Circuit Technology Underlying Heterogenous Nano & Tera Systems 48
  49. 49. In the Grand Scheme of Things The Technology Haves and Have-Nots  Access to semiconductor manufacturing deprived in Europe  Asian universities better funded in microelectronics  Stakes are too high to be complacent Knowledge-Based Economy More Critical than Ever  Labor abundance favors Asia in manufacturing  CH/EU must retain/create high value-add industries No Wealth Generation without Products  No products without a system (Lab sensors alone don’t suffice)  Circuit/system technology platform underlying it all12 May 2011 Platform Circuit Technology Underlying Heterogenous Nano & Tera Systems 49
  50. 50. More Than Just WearableIntegrated Circuits Serve Many Prolific Sectors Medical Electronics  Global annual revenue ~ 125bn USD  Growing at 7.2% per annum in next 5 years Cellular Communications Hardware  Global annual revenue ~ 210bn USD Swiss GDP  490bn USD in 200812 May 2011 Platform Circuit Technology Underlying Heterogenous Nano & Tera Systems 50
  51. 51. Holding Our OwnIn Research and Entrepreneurship Amongst Top Ten at Chip Olympics Accepted Papers at ISSCC 2010 75% by the proposers 100 10 1 At forefront in tech transfer 100 Spin-Off Companies Per Year 10 112 May 2011 Platform Circuit Technology Underlying Heterogenous Nano & Tera Systems 51
  52. 52. What Circuit Technology Can Do - Making A Difference at Top Tier ETH Startup Supplies RF Transceiver To Tier- One Mobile Phone Vendors ETH Startup Sold GPS Platform to Qualcomm ETH Startup Supplies Home Networking Kits Nokia Samsung BlueEarth Samsung 6788 SGH-F480i TCL: T36 Konka: E3Samsung: NC10 Dell: Inspiron Mini 10 Hasee: Q130T 12 May 2011 Platform Circuit Technology Underlying Heterogenous Nano & Tera Systems 52
  53. 53. Demonstrators Universal Data Acquisition System for (Remotely Powered) Sensor Networks  Applicable to a wide range of sensors  With continued collaborations with sensor groups Short Range Wireless System on a Chip for Body Area Networks  Relay acquired sensor info to a more powerful WL link Wide Area Wireless System on a Chip  Relay information to monitoring centers12 May 2011 Platform Circuit Technology Underlying Heterogenous Nano & Tera Systems 53
  54. 54. Sensor Interface and Data Acquisition12 May 2011 Platform Circuit Technology Underlying Heterogenous Nano & Tera Systems
  55. 55. Some of the Challenges • Large CM Voltage • Differential Offset • Low noise instrumentation • Multi channel capability • Low power drain Z  Z Z  Z  Zs2 Z i1  Z i 2 Vd  Vc  s  s  i  Z s  s1 Zi   Z Zi  2 Zi  s  212 May 2011 Platform Circuit Technology Underlying Heterogenous Nano & Tera Systems
  56. 56. Multi Channel EEG Interface by ETH12 May 2011 Platform Circuit Technology Underlying Heterogenous Nano & Tera Systems
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