This slide contains the working process of Laser, their types and how they are used for machining purposes.

1. LASER BEAM
MACHINING
SAHIL DEV (10406EN016)
MECH IDD PART V
1

2. Contents
 Laser Beam Machining
 Laser
 Type of Laser
 Laser Application
 Parameters Affecting LBM
 Advantage
 Disadvantage
 References
2

3. What is Laser
 LASER is the acronym for Light Amplified Stimulated Emission of Radiation
 Laser is a device which generates or amplifies light
 Stimulated emission of electromagnetic radiation
 Coherent, monochromatic, directional and high power laser beam is used
3

4. Elements of Laser
 Lasing Medium (Gas, liquid, solid)
 Pumping process
 Optical feedback element
4

5. Laser Beam Machining
 Used light energy from a laser to remove
material by vaporization and ablation
 Energy is concentrated optically
 Laser emits either continuous or pulsed
light beam
5
Source: Google Images

6. Effect of Laser Beam on Material 6
Source: Internet

7. Gas Laser
Types
of Laser
Solid State
Laser
Excimer
Laser
7

8. Gas Laser
 Electric current is discharged through a gas to produce a coherent light
 Operate on the principle of converting electric energy into laser light
output
 Gas acts as pumping medium to attain the necessary population inversion
 Common gas laser are CO2 Gas Laser, He-Ne Gas Laser
8

9. He-Ne Gas Laser 9
Source: Google Images

10. Solid State Laser
 Constructed by doping a rare earth element into a variety of host materials
 Pumped optically by arc lamps or flash lamps
 Respond well to Q-switching
 Ruby or Nd:YAG is the most common host material
10

11. Ruby Laser 11
Source: HowStuffWorks

12. Excimer Laser
 Uses a combination of an inert gas and reactive
gas
 Excimer is form of Ultraviolet Chemical Laser
 Excimer is short for ‘excited dimer’
12
Source: Google Images

13. Dye & Semiconductor Laser
 Dye Laser
 use complex organic dyes, such as rhodamine 6G
 Semiconductor Laser
 sometimes called diode lasers
 very small and use low power.
13

14. Operation: Laser Cutting
 Cutting starts by drilling a hole by moving beam
 Cutting speed depends on material and thickness
 Both pulsed and continuous laser is used
 Thickness ranges from 0.5-1 inch
 Used for cutting complex geometry and for clean
cutting operation
14
Source: sciencedirect.com

15. Laser Welding
 For welding ceramics and dissimilar materials like steel and aluminum
 Produces maximum penetration and minimum distortion in materials
 Beam can be easily shaped, focused and directed
 Application
 Razor Blade
 Electronic Circuit
15

16. Laser Cladding
 Used to improve surface quality by applying a
corrosion resistant layer on product
 Laser Beam is used to create a shallow melt pool
 Metal powder is supply using an inert gas flow
 Application
 Chemical industry
 Mining and marine application
16
Source: Wikipedia

17. Laser Application
Heavy
Manufacturing
Seam & spot
welding
Cladding &
drilling
Light
Manufacturing
Engraving
Drilling
Electronics
Skiving of
circuits
Wire stripping
Medical
Cosmetic
Surgery
Hair removal
17

18. Parameter Affecting LBM• Working Material
• Assist Gases
• Focusing Lenses
• Laser Beam
• Environment
Laser Beam
Machining
18

19. Advantages
 Non Contact
 No solvent chemical
 Selective material removal
 Flexibility
 Fully automated
19

20. Disadvantages
 Requires specially trained operators
 Not for mass metal removal processes
 Requires greater control of joint tolerances
 Expensive equipment
 Consumes much energy
20

21. References
 http://www.google.com
 http://www.sciencedirect.com
 http://en.wikipedia.org/wiki/laser_cutting
 http://www.gobookee.org/powerpoint-of-laser-beam-machining/
 Laser beam machining (LBM), state of the art and new opportunities/Johan
Meijer
 http://science.howstuffworks.com/laser.htm
21

22. THANK YOU
22