1




          CMC	
  Laboratories,	
  Inc.
          Client	
  Presenta4on	
  
          March	
  2009




Friday, Septe...
2




     •	
  	
  CMC	
  Laboratories	
  was	
  founded	
  in	
  2003	
  by	
  a	
  group	
  of	
  
     packaging	
  in...
3




              CMC	
  Laboratories	
  provides	
  a	
  high	
  level	
  of	
  
               technical	
  service	
 ...
4




                             Technical	
  Exper4se




Friday, September 11, 2009
4




                                  Technical	
  Exper4se
         • Advanced	
  electronic	
  packaging	
  materials
...
5



                             CMC	
  Business	
  Focus	
  
        • Materials	
  Analysis
        • Electrical	
  and...
Business Sectors
                                                               6



                                 CMC	...
Business Sectors
                                                                              6



                      ...
7



          Technical	
  Support	
  to	
  Medical	
  Device	
  Manufacturers




Friday, September 11, 2009
7



          Technical	
  Support	
  to	
  Medical	
  Device	
  Manufacturers

               • Reliability	
  evalua:on...
8



                 Medical	
  Device	
  Manufacturers:	
  Recent	
  Projects




Friday, September 11, 2009
8



                 Medical	
  Device	
  Manufacturers:	
  Recent	
  Projects
                        1. Electronic	
  r...
9



                 Experience	
  Base	
  in	
  Op4cal	
  Applica4ons	
  for	
  
                   Semiconductors




F...
9



                 Experience	
  Base	
  in	
  Op4cal	
  Applica4ons	
  for	
  
                   Semiconductors
     ...
10



                 Optoelectronics	
  and	
  Photovoltaics:	
  Recent	
  Projects




Friday, September 11, 2009
10



                 Optoelectronics	
  and	
  Photovoltaics:	
  Recent	
  Projects

               1.	
  Characteriza:o...
11



                 Experience	
  in	
  RF	
  and	
  Microwave	
  Device	
  Packaging




Friday, September 11, 2009
11



                 Experience	
  in	
  RF	
  and	
  Microwave	
  Device	
  Packaging

                      • 	
  Cell...
12



                 RF	
  and	
  Microwave	
  Device	
  Packaging:	
  Recent	
  Projects




Friday, September 11, 2009
12



                 RF	
  and	
  Microwave	
  Device	
  Packaging:	
  Recent	
  Projects
                      1.	
  	
...
13


                 CMC	
  Supports	
  The	
  Worlds	
  Most	
  Innova4ve	
  Advanced	
  
                  Materials	
 ...
13


                 CMC	
  Supports	
  The	
  Worlds	
  Most	
  Innova4ve	
  Advanced	
  
                  Materials	
 ...
14



                         Advanced	
  Materials:	
  Recent	
  Projects




Friday, September 11, 2009
14



                         Advanced	
  Materials:	
  Recent	
  Projects

                  1.	
  	
  Process	
  develo...
15



                 Core	
  Exper4se	
  in	
  Specialized	
  Technology	
  for	
  Military	
  
                   and	
...
15



                 Core	
  Exper4se	
  in	
  Specialized	
  Technology	
  for	
  Military	
  
                   and	
...
16



                 Military	
  and	
  Aerospace	
  Applica4ons:	
  Recent	
  Projects




Friday, September 11, 2009
16



                 Military	
  and	
  Aerospace	
  Applica4ons:	
  Recent	
  Projects

               1.	
  	
  Develo...
17



                             Technology	
  Services




Friday, September 11, 2009
17



                                      Technology	
  Services

                                  Failure Analysis    ...
18



       Failure	
  Analysis	
  and	
  Material	
  Characteriza4on	
  Capabili4es




Friday, September 11, 2009
18



       Failure	
  Analysis	
  and	
  Material	
  Characteriza4on	
  Capabili4es
                 • Package	
  decons...
19




       Failure	
  Analysis	
  and	
  Material	
  Characteriza4on	
  
         Capabili4es-­‐	
  Con4nued




Friday...
19




       Failure	
  Analysis	
  and	
  Material	
  Characteriza4on	
  
         Capabili4es-­‐	
  Con4nued

         ...
20



       Failure	
  Analysis	
  and	
  Material	
  Characteriza4on:	
  Recent	
  
         Projects




Friday, Septem...
20



       Failure	
  Analysis	
  and	
  Material	
  Characteriza4on:	
  Recent	
  
         Projects
                  ...
21



                             Metal	
  Fractography




Friday, September 11, 2009
22



                             IC	
  Level	
  Cross	
  Sec4on	
  Analysis




Friday, September 11, 2009
23



                             X-­‐ray	
  Radiography	
  and	
  Acous4c	
  Microscopy




Friday, September 11, 2009
24



                Custom	
  Design	
  for	
  Specialized	
  Tes4ng	
  Requirements




Friday, September 11, 2009
24



                Custom	
  Design	
  for	
  Specialized	
  Tes4ng	
  Requirements

                             • Mic...
25




                Custom	
  Design	
  for	
  Specialized	
  Tes4ng	
  Requirements:	
  
                             ...
25




                Custom	
  Design	
  for	
  Specialized	
  Tes4ng	
  Requirements:	
  
                             ...
26



                     Technology	
  Development	
  and	
  Fabrica4on
        • 	
  Pla:ng	
  metalliza:on	
  developm...
27



                             Pla4ng	
  Process	
  Development




Friday, September 11, 2009
27



                                        Pla4ng	
  Process	
  Development
                             • Development	...
28



                             Pla4ng	
  Process	
  Development




Friday, September 11, 2009
28



                                     Pla4ng	
  Process	
  Development

                             • CMC’s	
  Pla4n...
29



          Technology	
  Development	
  and	
  Fabrica4on-­‐	
  Recent	
  Projects

        • 	
  Fabricate	
  specia...
30




                             CMC	
  Wireless	
  Packaging	
  Experience




Friday, September 11, 2009
31



                             Mul4layer,	
  Co-­‐Fire	
  AlN	
  Technology	
  Licenses




Friday, September 11, 2009
31



                              Mul4layer,	
  Co-­‐Fire	
  AlN	
  Technology	
  Licenses
                    • Non-­‐e...
32



                             Technology	
  Market	
  Analysis




Friday, September 11, 2009
32



                                     Technology	
  Market	
  Analysis
                        •    Technical	
  Mark...
33



                Technology	
  Market	
  Analysis-­‐	
  Recent	
  Projects




Friday, September 11, 2009
33



                Technology	
  Market	
  Analysis-­‐	
  Recent	
  Projects
                             1. Developed	...
34




Friday, September 11, 2009
34




                                CMC	
  Laboratories,	
  Inc.
                              7755	
  South	
  Researc...
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Cmc Laboratories Client Presentation 2009

  1. 1. 1 CMC  Laboratories,  Inc. Client  Presenta4on   March  2009 Friday, September 11, 2009
  2. 2. 2 •    CMC  Laboratories  was  founded  in  2003  by  a  group  of   packaging  industry  veterans. •    Today,  CMC  has  over  200  clients  ranging  from  start-­‐ups  to   Fortune  100  companies. •    CMC  supports  clients  across  North  America,  Europe,    and   throughout  Asia  including  China,  Taiwan,  Singapore,  and   Malaysia. Friday, September 11, 2009
  3. 3. 3 CMC  Laboratories  provides  a  high  level  of   technical  service  focussed  on  advanced   materials  within  the  electronic  industry.   Innova&ve  Materials  Solu&ons  for  Electronics Friday, September 11, 2009
  4. 4. 4 Technical  Exper4se Friday, September 11, 2009
  5. 5. 4 Technical  Exper4se • Advanced  electronic  packaging  materials • Micro-­‐structural  Characteriza:on • Failure  Analysis  and  Destruc:ve  Physical  Analysis • Electrical,  Thermal  and  Mechanical  Test  and  Proper:es  of   Packaging  Materials • Custom  Reliability  Tes:ng:  Test  Development  and   Implementa:on • Thin  and  Thick  FIlm  Metalliza:on • Electro  and  Electro-­‐less  pla:ng  for  electronic  applica:ons Friday, September 11, 2009
  6. 6. 5 CMC  Business  Focus   • Materials  Analysis • Electrical  and  Thermal  Tes:ng •  Technology  Development  and  Prototype/  Low   Volume  Fabrica:on Friday, September 11, 2009
  7. 7. Business Sectors 6 CMC  Client  Industries Friday, September 11, 2009
  8. 8. Business Sectors 6 CMC  Client  Industries Medical Device Photovoltaic Military and Aerospace Advanced Materials Telecommunications Semiconductor Friday, September 11, 2009
  9. 9. 7 Technical  Support  to  Medical  Device  Manufacturers Friday, September 11, 2009
  10. 10. 7 Technical  Support  to  Medical  Device  Manufacturers • Reliability  evalua:on  and  failure  mode  analysis. • Device  and  component  construc:on  analysis  for  supplier   qualifica:on. • Microstructural  analysis  in  support  of  process    op:miza:on   and    verifica:on. • Design,  development  and  FA  support  to  assist  clients  with   FDA  submissions. Friday, September 11, 2009
  11. 11. 8 Medical  Device  Manufacturers:  Recent  Projects Friday, September 11, 2009
  12. 12. 8 Medical  Device  Manufacturers:  Recent  Projects 1. Electronic  reliability  and  failure  mode  evalua:on  of  a   PCB  assembly  used  in  a  hand  held  medical  device. 2. Evalua:on  of  Pb  and  Pb-­‐free  solder  processing   parameters  and  rework  limita:ons  for  high  reliability   implantable  devices. 3. Assisted  in  the  development  of  an  improved  herme:c   feed-­‐thru  for  an  implantable  device. Friday, September 11, 2009
  13. 13. 9 Experience  Base  in  Op4cal  Applica4ons  for   Semiconductors Friday, September 11, 2009
  14. 14. 9 Experience  Base  in  Op4cal  Applica4ons  for   Semiconductors •Solar  cells,  high  brightness  LEDs,  Laser  Diodes •Thin  film,  thick  film  and  direct  bond  copper   metalliza:on •Material  structure,  composi:on  and  defect   characteriza:on  in  Opto-­‐electronic  assemblies •  Ceramic  packages  including  alumina  and  AlN •  Cu  pla:ng Friday, September 11, 2009
  15. 15. 10 Optoelectronics  and  Photovoltaics:  Recent  Projects Friday, September 11, 2009
  16. 16. 10 Optoelectronics  and  Photovoltaics:  Recent  Projects 1.  Characteriza:on  and  op:miza:on  of  high  thermal  demand   packaging  for  cuUng  edge  solar  concentrator  technology. 2.  Thick  Cu  pla:ng  process  development  for  an  HBLED   package   3.  New  material  selec:on  and  assembly  process  development   for  a  high  frequency  MEMs  op:cal  transmiWer. Friday, September 11, 2009
  17. 17. 11 Experience  in  RF  and  Microwave  Device  Packaging Friday, September 11, 2009
  18. 18. 11 Experience  in  RF  and  Microwave  Device  Packaging •  Cellular  base-­‐sta:on  power  amplifier  packages  including   GaAs  and  Silicon  LDMOS •  Microwave  communica:on  devices   •  Packaging  materials  and  processing  for  high  frequency   applica:ons •  Alumina,  LTCC  and  LCP TELECOMUNICATIONS Friday, September 11, 2009
  19. 19. 12 RF  and  Microwave  Device  Packaging:  Recent  Projects Friday, September 11, 2009
  20. 20. 12 RF  and  Microwave  Device  Packaging:  Recent  Projects 1.      Working  with  a  leading  edge  advanced  packaging  material  supplier  to   introduce  a  new  genera:on  of  RF  packages  for  cellular  base-­‐sta:on   applica:ons. 2.  Supported  the  introduc:on  to  market  of  a  new  high  frequency  passive   component  technology  with  enhanced  performance  from  20-­‐100  GHz. 3.  Assisted  in  the  development  of  a  novel,  low  stress  die  aWach   technology  for  RF  devices  which  enhances  thermal  managment.   Supported  client  patent  submissions. TELECOMUNICATIONS Friday, September 11, 2009
  21. 21. 13 CMC  Supports  The  Worlds  Most  Innova4ve  Advanced   Materials  Suppliers  Worldwide Friday, September 11, 2009
  22. 22. 13 CMC  Supports  The  Worlds  Most  Innova4ve  Advanced   Materials  Suppliers  Worldwide •  CMC  provides  clients  cri4cal  exper4se  for  advanced  materials  development •  CMC  assists  in  market  introduc4on  for  advanced  materials  in  electronic  applica4ons •  High  thermal  performance  materials • Expansion  matched  systems • Advanced  solder  systems • Specialized  thick  film  and  thin  film  metalliza4on • Polymer  composites • High  frequency  materials • LTCC,  HTCC,  and  AlN • Pla4ng  layers Friday, September 11, 2009
  23. 23. 14 Advanced  Materials:  Recent  Projects Friday, September 11, 2009
  24. 24. 14 Advanced  Materials:  Recent  Projects 1.    Process  development  to  reclaim/rework  high-­‐end  specialty   components  preven:ng  mul:-­‐million  dollar  yield  loss. 2.Valida:on  of  material  proper:es  and  market  opportuni:es  for   advanced  polymer  composites  used  in  high  thermal  demand  packaging   applica:ons. 3.Licensing  of  CMC  developed  AlN  mul:layer  ceramic  technology  for   military,  space,  medical,  wafer  tes:ng,  and  telecommunica:ons. Friday, September 11, 2009
  25. 25. 15 Core  Exper4se  in  Specialized  Technology  for  Military   and  Aerospace  Applica4ons Friday, September 11, 2009
  26. 26. 15 Core  Exper4se  in  Specialized  Technology  for  Military   and  Aerospace  Applica4ons •    Ceramic  packaging  technologies  including  LTCC,  AlN  and  HTCC • Thin  film  metalliza4on • High  performance  organic  packaging  solu4ons • High  thermal  demand  packaging  materials  including  AlSiC  and   other  composite  metal  solu4ons • Herme4c  package  sealing  technologies •  Custom,  aerospace  focussed  reliability  test  development Friday, September 11, 2009
  27. 27. 16 Military  and  Aerospace  Applica4ons:  Recent  Projects Friday, September 11, 2009
  28. 28. 16 Military  and  Aerospace  Applica4ons:  Recent  Projects 1.    Developed  and  implemented  custom  electrical  test   program  for  power  components  for  space  under   environmental  stress  condi:ons. 2.  LTCC  component  op:miza:on  and  failure  analysis  for  next   genera:on  short  wave  military  communica:ons. 3.  Root  cause  analysis  of  wirebond  failures  in  guidance  system   control  module. Friday, September 11, 2009
  29. 29. 17 Technology  Services Friday, September 11, 2009
  30. 30. 17 Technology  Services Failure Analysis Reliability and Test Materials Characterization Process Development AlN Licensing Market Analysis Friday, September 11, 2009
  31. 31. 18 Failure  Analysis  and  Material  Characteriza4on  Capabili4es Friday, September 11, 2009
  32. 32. 18 Failure  Analysis  and  Material  Characteriza4on  Capabili4es • Package  deconstruc4on • Electrical  resis4vity • Interfacial  structure • Dielectric  constant  and  loss • Elemental  analysis  and   • Surface  roughness mapping • Adhesion  Tes4ng • Microstructure  and  phase   • Mechanical  Tes4ng analysis • Thermal  conduc4vity • Grain  structure  and  size   • Interfacial  thermal   distribu4on resistance • Failure  interface   • Micro-­‐hardness iden4fica4on Friday, September 11, 2009
  33. 33. 19 Failure  Analysis  and  Material  Characteriza4on   Capabili4es-­‐  Con4nued Friday, September 11, 2009
  34. 34. 19 Failure  Analysis  and  Material  Characteriza4on   Capabili4es-­‐  Con4nued • SEM  with  SE  and  BSE  imaging • IC  Level  Analysis • Energy  Dispersive   • Metal  Fractography Spectrometry • Acous4c  Microscopy   • Metallographic  Evalua4on (CSAM) • X-­‐Ray  Radiography • Secondary  Ion  Mass   • XRF  Thickness  Measurement Spectroscopy  (SIMS) Friday, September 11, 2009
  35. 35. 20 Failure  Analysis  and  Material  Characteriza4on:  Recent   Projects Friday, September 11, 2009
  36. 36. 20 Failure  Analysis  and  Material  Characteriza4on:  Recent   Projects 1. Failure  determina:on  of  a  herme:c  feed-­‐thru  in  an   implantable  medical  device. 2. Construc:on  evalua:on  of  a  discrete  device  for  patent   infringement  li:ga:on. 3. Compe::ve  analysis  of  advanced  graphics  processor   including  the  device,  package/substrate  and  graphics  board. 4. Advanced  solder  process  evalua:on  and  op:miza:on  for   major  medical  device  manufacturer. Friday, September 11, 2009
  37. 37. 21 Metal  Fractography Friday, September 11, 2009
  38. 38. 22 IC  Level  Cross  Sec4on  Analysis Friday, September 11, 2009
  39. 39. 23 X-­‐ray  Radiography  and  Acous4c  Microscopy Friday, September 11, 2009
  40. 40. 24 Custom  Design  for  Specialized  Tes4ng  Requirements Friday, September 11, 2009
  41. 41. 24 Custom  Design  for  Specialized  Tes4ng  Requirements • Micro-­‐Controllers • Air  to  air  thermal   • High-­‐Speed  Data   stress Acquisi:on • HAST  Chamber • Lab  View  Programming • Wide  range  of   • Environmental  Test   electrical  test   Chambers equipment  from  DC  to   • Mechanical  Tes:ng GHz Friday, September 11, 2009
  42. 42. 25 Custom  Design  for  Specialized  Tes4ng  Requirements:   Recent  Projects Friday, September 11, 2009
  43. 43. 25 Custom  Design  for  Specialized  Tes4ng  Requirements:   Recent  Projects 1.  System  design  and  development  to  test  and  capture  extremely   short  :me  scale  events  in  an  advanced  satellite  component  while   undergoing  environmental  stress. 2. Burn-­‐in  and  precision  electrical  monitoring  of  military  components   under  rigid  temperature  condi:ons. 3. Design  and  development  of  a  custom  op:cal  reflectometer  to  set  laser   weld  condi:ons  for  high  reliability.   Friday, September 11, 2009
  44. 44. 26 Technology  Development  and  Fabrica4on •  Pla:ng  metalliza:on  development • Low  volume  electro-­‐pla:ng,  electro-­‐less  pla:ng  and  barrel   pla:ng •  Fabrica:on  and  assembly  process  development –  Solder  profiles –  Braze  profiles –  Die  aWach  processes •  Low  volume  fabrica:on  and  assembly  capability •  Thick  film  metalliza:on  produc:on  facility •  Module  re-­‐work  for  military  and  medical  applica:ons Friday, September 11, 2009
  45. 45. 27 Pla4ng  Process  Development Friday, September 11, 2009
  46. 46. 27 Pla4ng  Process  Development • Development  of  custom  pla4ng  processes –  Evaluate  pla4ng  chemistry  op4ons –  Create  prototypes  for  func4onal  and  reliability   tes4ng –  Detailed  documenta4on  of  pla4ng  procedures –  Transfer  to  high  volume  processors •  Small  volume,  fully  func4onal  pla4ng  facility –  Rack  and  barrel  pla4ng –  DC  and  pulsed  rec4fica4on Friday, September 11, 2009
  47. 47. 28 Pla4ng  Process  Development Friday, September 11, 2009
  48. 48. 28 Pla4ng  Process  Development • CMC’s  Pla4ng  Development  Customers: –  Semiconductor  manufacturers –  Electronic  Package  fabricators –  Specialty  materials  manufacturers • Cu,  Ni,  Au,  Sn  and  co-­‐deposited  alloys • Cleaning  and  etching  chemistry Friday, September 11, 2009
  49. 49. 29 Technology  Development  and  Fabrica4on-­‐  Recent  Projects •  Fabricate  specialized  direct  bond  copper  substrates •  Plate  Al-­‐SiC  flanges  over  wide  composi:on  range •  Re-­‐work  and  re-­‐assemble  module  used  for  medical   imaging •  Produce  range  of  high  temperature  thick  film   metalliza:on  pastes  for  AlN  ceramics •  Assemble  MEMs  diode  laser  switching  module  for   telecommunica:ons  applica:ons Friday, September 11, 2009
  50. 50. 30 CMC  Wireless  Packaging  Experience Friday, September 11, 2009
  51. 51. 31 Mul4layer,  Co-­‐Fire  AlN  Technology  Licenses Friday, September 11, 2009
  52. 52. 31 Mul4layer,  Co-­‐Fire  AlN  Technology  Licenses • Non-­‐exclusive  Licensing  of  CMC’s  proprietary  co-­‐fired,  mul4layer   AlN  process –  Thermal  conduc:vity  as  high  as  190  W/m-­‐K –  Up  to  20  metalliza:on  layers   –  Required  materials,  processes  and  equipment  details  transferred  to   licensees • Process  has  been  u4lized  for  high  volume  produc4on • Applica4ons  in  telecommunica4ons  infrastructure,  power   electronics,  op4cal  communica4ons,  HBLED  and  industrial   equipment. ALUMINUM NITRIDE TECHNOLOGY LICENSING Friday, September 11, 2009
  53. 53. 32 Technology  Market  Analysis Friday, September 11, 2009
  54. 54. 32 Technology  Market  Analysis • Technical  Market  Studies  focused  on  Electronic   Interconnect,  Packaging,  New  Materials,  Assembly   Technology,  or  Passive  Components • Compe44ve  Analysis  including  Compe4tor’s  Technical   Performance,  Target  Markets,  Key  Strengths/Weaknesses   and  Product  Roadmaps • Iden4fica4on  of  Acquisi4on  Candidates  to  fit  Client’s   Growth  Objec4ves. • Industry  Wide  Surveys  and  Survey  Data  Analysis Friday, September 11, 2009
  55. 55. 33 Technology  Market  Analysis-­‐  Recent  Projects Friday, September 11, 2009
  56. 56. 33 Technology  Market  Analysis-­‐  Recent  Projects 1. Developed  a  customized  market  analysis  for  a  large  advanced  materials  company,   evalua:ng  the  market  poten:al  of  a  new  polymer-­‐based  product  line  used  in  high   thermal  demand  electronic  applica:ons.  Developed  a  market  strategy  and  iden:fied   poten:al  customers  throughout  the  US  and  Asia  (2008). 2. Introduced  a  small  advanced  materials  company  specializing  in  new  polymer  formula:ons   for  packaging  applica:ons  to  poten:al  strategic  partners  to  assist  in  scale-­‐up  and   marke:ng  of  this  technology  (2008). 3. Performed  a  detailed  market  analysis  for  an  advanced  electronic  materials  company  in   China,  delinea:ng  commercial  market  opportuni:es  for  ceramic  products.  Created  a   technology  roadmap  for  this  client  based  on  the  study.  Provided  technical  support  to   implement  the  roadmap  (2007,  2008). Friday, September 11, 2009
  57. 57. 34 Friday, September 11, 2009
  58. 58. 34 CMC  Laboratories,  Inc. 7755  South  Research  Drive Tempe,  AZ  85284 (480)  496-­‐5000 Contact  Us: info@CMCLaboratories.com   Friday, September 11, 2009
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