Introduction To Princo Pkg Plateform

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FO-WLP, eWLP, Coreless

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Introduction To Princo Pkg Plateform

  1. 1. Reliability Moisture sensitivity level 1(MSL1) Pass Ball pull after multi-reflow Pass Thermal cycle test-IPC-TC3 Pass High temperature/humidity test Pass Biased HTMT Pass
  2. 2. At present: Wire bond/ Organic PCB/ MOS Metal layer Bump/ Substrate/ FPC/ device Princo uBump Assembly Assembly Front-end/Foundry Back-end/OSAT PCB/EMS/ Near future: Module MOS Cu pillar/ Wire bond/ Organic PCB/ TSV Metal layer Si interposer/ Bump/ Substrate/ FPC/ device Si-Si stack Princo uBump Assembly AssemblyFront-end/ Middle-end/Foundry or OSAT Back-end/ PCB/EMS/Foundry OSAT Module Chip owner’s solution Princo’s solution
  3. 3. Ready for your questions &requirement!

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