TRACK A: 2.5D/3D Chip Stacking Supply Chain Integration/ Kurt Huang, Ph.D.

1,794 views

Published on

Published in: Technology, Business
0 Comments
1 Like
Statistics
Notes
  • Be the first to comment

No Downloads
Views
Total views
1,794
On SlideShare
0
From Embeds
0
Number of Embeds
873
Actions
Shares
0
Downloads
21
Comments
0
Likes
1
Embeds 0
No embeds

No notes for slide

TRACK A: 2.5D/3D Chip Stacking Supply Chain Integration/ Kurt Huang, Ph.D.

  1. 1. 2.5D/3D Chip Stacking SupplyChain IntegrationKurt Huang, Ph.D.Director, Corporate Marketing, UMCChipEx, 2013
  2. 2. Outline 2.5D/3D Applications Ecosystem Work Flow SummaryP. 2
  3. 3. 2.5D/3D Applications
  4. 4. 2.5D Si Interposer Stacking Logic/logic: FPGA, networking infrastructure Logic/memory: Gaming, HPC
  5. 5. 3D Logic/Memory Stacking- Via-Middle TSV 28nm Logic + Memory Cube Mobile WideIO, Computing WideIO, HMC
  6. 6. Never-Enough Memory Bandwidth- Mobile AP Driving Wide IO MemoryDimensioning use case: 3D video streaming playback to external display via wireless+ on-line 3D gaming local
  7. 7. Keeping Power Under Hood•LPDDR3 @800Mhzdual-channel•LPDDR3 @800Mhz
  8. 8. Real Value Drives AdoptionMotivations: Higher BW, lower W/BW, smaller form-factorOpportunity of return on 3D IC investment: Chip process node optimization Homogeneous partition Cross-node combinations BOM cost optimization Less demanding substrate/PCB,lighter cooling assembly, ... Ultimately: better product, better marginXilinx Virtex 7Micron HMC
  9. 9. Application Examples
  10. 10. Market Segment Overview High performance driving2.5DIC Mobile AP driving 3DIC SoC + Mobile Memory Next wave:heterogeneous 3DIC Logic + Memory +Analog/RF Ecosystem morecomplex Expect driving forceemerges after 3DICmatures
  11. 11. Ecosystem Work Flow
  12. 12. Example 2.5D Stacking Flow
  13. 13. Various Work Models Service scopes distinguished by MEOL inclusion Consult your foundry/OSAT Work flow optimization may depend on BOM cost,stack recipe and test strategy
  14. 14. Foundry TSV Design Collaterals Consider TSV a passive device with rule decks/models Typical foundry engagement applies under ecosystem work flow(UMC 2.5D Si interposer documents)
  15. 15. Innovations by Open Eco-System Wafer thinning and handling Thermal/stressconsideration Testability Reliability 3D EDA tool Seamless business model Cost …
  16. 16. Evolution Of the Supply Chain Technology exploration Feasibility study Interface definition Handover criteria Model convergence Flow standarization Cost down Service differentiation Further innovation
  17. 17. UMC Ecosystem Effort1Q122Q121Q132Q13
  18. 18. Summary
  19. 19. Summary Foundry TSV process demonstrated Applicable to both 2.5D/3D Leverage existing CMOS process technology Key process issues identified & conquered Ecosystem work flow Typical foundry/OSAT engagement flow applies for both2.5D/3D, among other models Foundry TSV next step: ecosystem focus Product level reliability assessment 3D package level reliability demonstrated for openecosystem model Potential EDA collaboration for emerging 3D tools
  20. 20. BTW, Dreams Do Come True!
  21. 21. Thank you for your attention!Contact: kurt_huang@umc.com

×