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Brochure Electronics Cooling Products

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Brochure describing our electronics cooling capabilities and cooling products for electroinic equipment

Brochure describing our electronics cooling capabilities and cooling products for electroinic equipment

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  • 1. MECHANICAL ENGINEERING CONSULTANTS ELECTRONICS COOLING & TESTING SERVICES
  • 2. MECHANICAL ENGINEERING CONSULTANTS ELECTRONICS COOLING & TESTING SERVICES The Benefits of Our Thermal Engineering Services • Design functional and reliable electronic equipment that will work in the intended environmental conditions. • Save money by understanding the thermal issues early and correcting them before they are too serious to fix in a cost-effective manner. • Use prototyping as a means to validate designs rather than as a means to do design iterations and save a significant amount of hardware and test related costs. • Ensure that marketing requirements are satisfied before product specifications are committed to potential customers. TDMG Inc www.tdmginc.com
  • 3. MECHANICAL ENGINEERING CONSULTANTS ELECTRONICS COOLING & TESTING SERVICES How We Can Help You Achieve These Benefits Evaluation of concept design options for racks, shelves. Quick modeling capability provides accurate information about channel air flow, fan operating points, and system pressure drop, even at the early conceptual stages of the design. CONCEPT LEVEL ANALYSIS OF TELECOMMUNICATION SHELF T (Deg C) Component placement evaluation on PCBs 106.3 97.1 LAYOUT 1 LAYOUT 2 87.8 Board level analysis can assist in determining 78.6 the optimum component layout. 69.3 60.0 50.8 41.5 32.3 COMPONENT PLACEMENT ANALYSIS TDMG Inc www.tdmginc.com
  • 4. MECHANICAL ENGINEERING CONSULTANTS ELECTRONICS COOLING & TESTING SERVICES How We Can Help You Achieve These Benefits Detailed component modeling Detailed modeling allows us to accurately evaluate the component heat loads and establish accurate case and junction temperatures. The level of detail can be as fine as necessary depending on the actual situation. DETAILED COMPONENT ANALYSIS INCLUDES CONNECTORS, PCB VIAS, AIR GAPS, AND COPPER SLUG Two-resistor and Delphi models can be used to simulate the components. ICs and multi-component packages can be modeled in detail and characterized at the early stages of the design avoiding costly design iterations. DETAILED COMPONENT ANALYSIS INCLUDES DIE, DIE ATTACH, BOND WIRES, SUBSTRATE VIAS, SOLDER BALLS, ETC TDMG Inc www.tdmginc.com
  • 5. MECHANICAL ENGINEERING CONSULTANTS ELECTRONICS COOLING & TESTING SERVICES How We Can Help You Achieve These Benefits Heatsink optimization Heatsink optimization allows verification of performance under various conditions. The design of components or systems can be optimized for one specific environment, or in PEDESTAL HEATSINK OPTIMIZED FOR PLACEMENT some cases optimization is required such that ELLIPTICALLY SHAPED FINS OF DEVICE IN ANY POSITION ON PCB the heatsink can perform as well in various positions or orientation. THERMAL ANALYSIS FOR VGA FANSINK APPLICATION HEATSINK FINS OPTIMIZED FOR ORIENTATION IN VERTICAL OR 45º ORIENTATION TDMG Inc www.tdmginc.com
  • 6. MECHANICAL ENGINEERING CONSULTANTS ELECTRONICS COOLING & TESTING SERVICES How We Can Help You Achieve These Benefits System level analysis for racks, shelves. The system level modeling provides crucial information about the operating temperatures of boards and components. With this type of analysis, we can investigate the effects of fan-failed scenarios, establish fan-control points, investigate transient operation, operations at altitude conditions, impact of on-line replacement of cooling unit, etc. Our capabilities includes design of liquid cooled systems. New cards can easily be introduced into the existing shelf model for investigation of new hardware. TDMG Inc www.tdmginc.com
  • 7. MECHANICAL ENGINEERING CONSULTANTS ELECTRONICS COOLING & TESTING SERVICES How We Can Help You Achieve These Benefits Results presentation 0.8 0.7 0.6 0.5 IN. H2O 0.4 With our analysis tools, results can be clearly 0.3 0.2 presented to allow our customers to make the right 0.1 0 engineering decisions early in the design phase. 0 100 200 300 400 CFM 500 600 700 Results can be presented in the following forms to ensure that the data is properly communicated: Velocity vector plots Temperature plots Surface plots Flow animations Fan operating points Spreadsheet summary, etc TDMG Inc www.tdmginc.com
  • 8. MECHANICAL ENGINEERING CONSULTANTS ELECTRONICS COOLING & TESTING SERVICES How We Can Help You Achieve These Benefits Results presentation Spreadsheet format provides clear information regarding the status of all components of interest for different operating conditions. The sample spreadsheet below shows the pass/fail status for each component of interest for “all fans operating” and 2 different “fan failed” scenarios. Main Unit Air Filter Tamb(°C): 55 °C Tamb(°C): 40 °C Tamb(°C): 40 °C All Fans Operating Front Center Fan Failed Front Right Fan Failed Max Allowable Temp. Tj or Tc (deg Tj or Tc (deg Tj or Tc (deg Tj or Tc (deg Tj or Tc (deg Tj or Tc (deg Compact Model Power (W) 2 Resistor Model Pass/ Fail? Pass/ Fail? Pass/ Fail? (deg C) C) C) C) C) C) C) Max Allowable Temp. Tj at 23°C Tj at 55°C Tj at 23°C Tj at 40°C Tj at 23°C Tj at 40°C PD(W) (deg C) 2 Resistor Model Ambient Ambient Pass/ Fail? Ambient Ambient Pass/ Fail? Ambient Ambient Pass/ Fail? Data Card FPGA456 4 125 Theta JC = 8 120.00 152.00 FAIL 105.00 122.00 FAIL 120.00 137.00 FAIL OEM Theta JB = 23 -27 >5C 3 >5C -12 >5C Max Allowable Temp. Tj at 23°C Tj at 55°C Tj at 23°C Tj at 40°C Tj at 23°C Tj at 40°C PD(W) (deg C) 2 Resistor Model Ambient Ambient Pass/ Fail? Ambient Ambient Pass/ Fail? Ambient Ambient Pass/ Fail? Data Card FPBGA289 1 105 Theta JC = 6 65.00 97.00 Marginal 72.00 89.00 Pass 68.00 85.00 Pass OEM Theta JB = 20 8 >5C 16 >5C 20 >5C Max Allowable Temp. Tc at 23°C Tc at 55°C Tc at 23°C Tc at 40°C Tc at 23°C Tc at 40°C PD(W) (deg C) 2 Resistor Model Ambient Ambient Pass/ Fail? Ambient Ambient Pass/ Fail? Ambient Ambient Pass/ Fail? Data Card SFP 1 85 NA 45.00 77.00 Marginal 42.00 59.00 Pass 40.00 57.00 Pass OEM (T-case) 8 >5C 26 >5C 28 >5C TDMG Inc www.tdmginc.com
  • 9. MECHANICAL ENGINEERING CONSULTANTS ELECTRONICS COOLING & TESTING SERVICES How We Can Help You Achieve These Benefits Testing TDMG has an 850 sq ft test facility with windtunnel in order to perform validation testing of cooling solutions. It is often necessary to characterize components (cards, heatsinks, fan trays, ect) or to perform validation testing of the complete system. Our facilities allow us to test systems from a few CFM up to 1000 CFM. TDMG Inc www.tdmginc.com
  • 10. MECHANICAL ENGINEERING CONSULTANTS ELECTRONICS COOLING & TESTING SERVICES How We Can Help You Achieve These Benefits Custom Cooling Products TDMG provides custom cooling products of many of its customers. Our supplier base is international with access to both local and foreign manufacturing capabilities for prototype and production level systems. A few of the cooling systems developed are shown here: TDMG Inc www.tdmginc.com
  • 11. MECHANICAL ENGINEERING CONSULTANTS ELECTRONICS COOLING & TESTING SERVICES Capabilities TDMG has been performing Electronics Cooling analysis since 1999. Electronics cooling analysis represents a significant part of our work, however, TDMG has been performing other types of analyses as well. As an example, our capabilities have developed to include analysis of built systems (such as clean-room and data center analysis), hydrogen out gassing in battery cabinets, fire modeling and toxic gas concentrations, and other general CFD applications. In addition, over the last few years, we have been performing significantly more stress and vibration analysis, a capability that was always available in-house, but that we have been successfully expanding recently. For more information regarding our full suite of capabilities, please visit our website at www.tdmginc.com. TDMG Inc www.tdmginc.com
  • 12. MECHANICAL ENGINEERING CONSULTANTS ELECTRONICS COOLING & TESTING SERVICES Contact Us Please contact us for an informal review of your thermal issues. It will be our pleasure to discuss these with you and give you our initial feedback, including whether thermal and CFD simulation is even required. Bruno Zoccali TDMG Inc 100 Alexis Nihon, Suite 102 St Laurent, Quebec H4M 2N6 Tel: 514-381-9115 x.200 www.tdmginc.com TDMG Inc www.tdmginc.com

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