About Sales, Marketing and Business Development of Semiconductor Packaging Products with New Innovative Technologies. Analytical problem-solver with demonstrated ability to manage projects from planning through execution and completion under the pressure of time-cost sensitive environments.
• Microelectronic Packaging and Manufacturing
• Process / Dispensing for Electronics Packaging & SMT
• BGA / CSP / Flip Chip Materials. 2.5/3D TSV Assembly
• FEA / FEM