1º FÓRUM BRASIL COREIA DO SUL  EM CIÊNCIA, TECNOLOGIA E INOVAÇÃO: Oportunidades e Impactos do Desenvolvimento da Indústria...
Increased Efficiency in Electronic Packaging Hierarchy 35 ㎜ 20 ㎜ 15 ㎜ 10 ㎜ QFP TCP BGA CSP FC Package Not Exceeding 1.2x D...
SMT BGA MCM -BGA FC Peripherial lead device SMT Technology DIP device TH-Hole technology Bare Chip Mounting Technology <ul...
Trend in 3 Dimensional Packages The  1st Brazil-South Korea Forum on Science, Technology, and Innovation 3 Prof. Yongil Ki...
Why stacking chips in 3D? (Yole Development, Oct. 2007) The  1st Brazil-South Korea Forum on Science, Technology, and Inno...
Structure of E-BGA  (Two-tier product) Solder ball Plugging paste Adhesive Side wall plating Heat sink The structure of Mu...
L/S=8 µm/8 µm (16 µm pitch): Pattern Thickness: 12 µm  Cu Mapping SEM  Subtractive  -> Modified Semi-Additive Process New ...
Sungkyunkwan University School of Advanced Materials Science & Engineering I ntroduction to  M icro  E lectronic  P ackagi...
Collaboration with other facilities <ul><li>MEPRC: Micro Electronic Packaging Laboratory  </li></ul><ul><li>CCRF  : Cooper...
Research areas at MEPL Reliability MEPL <ul><li>Mechanical </li></ul><ul><li>Electrical </li></ul><ul><li>Environmental </...
①  High frequency characterization of E-packages Chip Quartz substrate FC interconnect Signal line Port1 Port2 ACF Signal ...
③  Flip chip bonding with various material issues FC bonding with adhesives ACF in COF module Pb-free solder joints Hermet...
Drop impact test & high speed shear test of E-packages ⑥  Conductive patterning with nano-ink & nano-paste RF characterist...
COF Module ⑦  Surface treatment for high reliability ⑧  Design & manufacture of test kit & module COG Module COB Module Io...
⑨  Development of LED Test Kits for high reliability Schematic diagrams of LED structure Without Heat Slug With Heat Slug ...
⑩  Development of Stretchable Printed Circuit Board Mechanical Reliability Test Stretchable PCB Stretchable PCB Design Fab...
The  1st Brazil-South Korea Forum on Science, Technology, and Innovation Some Research Results at MEPL Drop reliability  :...
The  1st Brazil-South Korea Forum on Science, Technology, and Innovation Some Research Results at MEPL Interface Reaction:...
The  1st Brazil-South Korea Forum on Science, Technology, and Innovation Some Research Results at MEPL 10 reflows 1 reflow...
The  1st Brazil-South Korea Forum on Science, Technology, and Innovation Some Research Results at MEPL Electro-migration T...
Thank you very much MEPL  in SKKU The  1st Brazil-South Korea Forum on Science, Technology, and Innovation 20 Prof. Yongil...
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Fórum Brasil-Coreia - Yongil kim

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Transcript of "Fórum Brasil-Coreia - Yongil kim"

  1. 1. 1º FÓRUM BRASIL COREIA DO SUL EM CIÊNCIA, TECNOLOGIA E INOVAÇÃO: Oportunidades e Impactos do Desenvolvimento da Indústria de Semicondutores no Brasil 1st BRAZIL-SOUTH KOREA FORUM ON SCIENCE, TECHNOLOGY AND INNOVATION: Opportunities and impacts for the development of semiconductor industry in Brazil
  2. 2. Increased Efficiency in Electronic Packaging Hierarchy 35 ㎜ 20 ㎜ 15 ㎜ 10 ㎜ QFP TCP BGA CSP FC Package Not Exceeding 1.2x Die Area Start of Volume Production Package Efficiency ~‘91 ‘ 94~‘96 ‘ 96~‘97 ‘ 98~‘02 ‘ 03~ *TCP : TAB Carrier Package ‘ 08~ The 1st Brazil-South Korea Forum on Science, Technology, and Innovation 1 Prof. Yongil Kim, MEPL (Micro Electronic Packaging Laboratory)
  3. 3. SMT BGA MCM -BGA FC Peripherial lead device SMT Technology DIP device TH-Hole technology Bare Chip Mounting Technology <ul><li>DIP : Dual-in-line package </li></ul><ul><li>PGA : Pin grid array </li></ul><ul><li>QFP : Quad flat package </li></ul><ul><li>SOJ : Small out line J-lead </li></ul><ul><li>P-BGA : Plastic ball grid array </li></ul><ul><li>TSOP : Thin Small out line package </li></ul><ul><li>CA-BGA : Chip array BGA </li></ul><ul><li>MCM : Multi chip module </li></ul>PCB Hole: ~Φ0.6 Line:~1LPC Thick.:1.6t/4L Hole: ~Φ0.5 Line:~3LPC(~6mil) Thick.:0.8t/4L Hole: Φ0.2~Φ0.07 Line:6~9LPC(2mil) Thick.:0.6t/8~10L Hole: Φ0.4~Φ0.3 Line: 3~5LPC(4mil) Thick.: 0.45t/4~6L Package Substrate PGA Flip Chip CSP Through-Hole PCB High-Density PCB / IVH Build-Up MLB (Chip Scale Package) ~’10 ~ ‘90 ~’97 ~’80 ~’98 ~’00 E-BGA (Enhanced - BGA) TE-BGA HP-BGA C-BGA Area array device SMT Technology QFP/TAB CSP <ul><li>C-BGA : Ceramic ball grid array </li></ul><ul><li>TE-BGA : Thermal Enhanced BGA </li></ul><ul><li>HP-BGA : High performance BGA </li></ul><ul><li>IVH :Interstitial VIA Hole </li></ul>Technological Trend in Electronic Device Packaging The 1st Brazil-South Korea Forum on Science, Technology, and Innovation 2 Prof. Yongil Kim, MEPL (Micro Electronic Packaging Laboratory) DIP QFP TSOP P-BGA SOJ μ-BGA MCM CA-BGA Wafer Scale
  4. 4. Trend in 3 Dimensional Packages The 1st Brazil-South Korea Forum on Science, Technology, and Innovation 3 Prof. Yongil Kim, MEPL (Micro Electronic Packaging Laboratory)
  5. 5. Why stacking chips in 3D? (Yole Development, Oct. 2007) The 1st Brazil-South Korea Forum on Science, Technology, and Innovation 4 Prof. Yongil Kim, MEPL (Micro Electronic Packaging Laboratory)
  6. 6. Structure of E-BGA (Two-tier product) Solder ball Plugging paste Adhesive Side wall plating Heat sink The structure of Multi-tier E-BGA The 1st Brazil-South Korea Forum on Science, Technology, and Innovation For dissipation of generated heat by a chip and high I/O, Thermally Enhanced Multi-level BGA was introduced with a heat sink on back side of PCB. 5 Prof. Yongil Kim, MEPL (Micro Electronic Packaging Laboratory)
  7. 7. L/S=8 µm/8 µm (16 µm pitch): Pattern Thickness: 12 µm Cu Mapping SEM Subtractive -> Modified Semi-Additive Process New Type of Copper Foil for Dimension Controlled Fine Pattern The 1st Brazil-South Korea Forum on Science, Technology, and Innovation Fine Pattern for More Dense Circuit Design 6 Prof. Yongil Kim, MEPL (Micro Electronic Packaging Laboratory) Mitsui Mining and Smelting Co., Ltd. Copper Foil Sector. Advanced Materials Development Dept.
  8. 8. Sungkyunkwan University School of Advanced Materials Science & Engineering I ntroduction to M icro E lectronic P ackaging Lab. The 1st Brazil-South Korea Forum on Science, Technology, and Innovation MEPL in SKKU 7 Prof. Yongil Kim, MEPL (Micro Electronic Packaging Laboratory)
  9. 9. Collaboration with other facilities <ul><li>MEPRC: Micro Electronic Packaging Laboratory </li></ul><ul><li>CCRF : Cooperative Center For Research Facilities in SKKU </li></ul><ul><li>RIC : Regional Innovation Center in SKKU </li></ul><ul><li>KMJA : Korea Micro Joining Association, participating in 60 companies </li></ul><ul><li>KPCA : Korea Printed Circuit Association, participating in 120 companies </li></ul><ul><li>KMEPS : The Korean Microelectronics and Packaging Society </li></ul>Fabrication of Si device Analysis of micro Structure, Material property, etc. MEPL RIC NCRC CCRF Associations Research center for nano material and display KMJA, KPCA, KMEPS, KCI, etc. The 1st Brazil-South Korea Forum on Science, Technology, and Innovation Collaboration is the key factor for successful R/D and its utilization for industries 8 Prof. Yongil Kim, MEPL (Micro Electronic Packaging Laboratory) UNISINOS
  10. 10. Research areas at MEPL Reliability MEPL <ul><li>Mechanical </li></ul><ul><li>Electrical </li></ul><ul><li>Environmental </li></ul><ul><li>Solder </li></ul><ul><li>Adhesive </li></ul><ul><li>Ultra-sonic </li></ul><ul><li>TSV process </li></ul><ul><li>3-D chip Stacking </li></ul><ul><li>3-D RF Module </li></ul><ul><li>Direct Printing </li></ul><ul><li>Stretchable and Flexible Electronics </li></ul>The 1st Brazil-South Korea Forum on Science, Technology, and Innovation 3D Packaging MEPL carries various R/D topics in Electronic Packaging areas 9 Prof. Yongil Kim, MEPL (Micro Electronic Packaging Laboratory) Display Flip-Chip Interconnection
  11. 11. ① High frequency characterization of E-packages Chip Quartz substrate FC interconnect Signal line Port1 Port2 ACF Signal line Module for RF signal flow CPW ② Ultrasonic bonding technology The 1st Brazil-South Korea Forum on Science, Technology, and Innovation Research areas at MEPL 10 Prof. Yongil Kim, MEPL (Micro Electronic Packaging Laboratory) S-parameter (S 11 ) S 11 -100 ㎛ (measurement) S 11 -100 ㎛ (modeling with HFSS) U/S generator Tool LSI Pad PWB B ump Pad PWB Tool LSI B ump <ul><li>E = k A R f </li></ul><ul><ul><li>E : Applied Energy </li></ul></ul><ul><ul><li>K : Constant </li></ul></ul><ul><ul><li>A : Frequency Width </li></ul></ul><ul><ul><li>R : Applied Load </li></ul></ul><ul><ul><li>F : Ultrasonic Frequency </li></ul></ul>
  12. 12. ③ Flip chip bonding with various material issues FC bonding with adhesives ACF in COF module Pb-free solder joints Hermetic sealing ④ Reliability evaluation of E-packages Thermal shock reliability Electromigration of solder joints Research areas at MEPL The 1st Brazil-South Korea Forum on Science, Technology, and Innovation 11 Prof. Yongil Kim, MEPL (Micro Electronic Packaging Laboratory)
  13. 13. Drop impact test & high speed shear test of E-packages ⑥ Conductive patterning with nano-ink & nano-paste RF characteristics Stretchable metal pattern ⑤ Standardization of drop & high-speed shear test method Research areas at MEPL The 1st Brazil-South Korea Forum on Science, Technology, and Innovation 12 Prof. Yongil Kim, MEPL (Micro Electronic Packaging Laboratory)
  14. 14. COF Module ⑦ Surface treatment for high reliability ⑧ Design & manufacture of test kit & module COG Module COB Module Ion migration Bondability of Pb-free solder joint Research areas at MEPL The 1st Brazil-South Korea Forum on Science, Technology, and Innovation 13 Prof. Yongil Kim, MEPL (Micro Electronic Packaging Laboratory)
  15. 15. ⑨ Development of LED Test Kits for high reliability Schematic diagrams of LED structure Without Heat Slug With Heat Slug Developed LED chip LED Chip Design LED Substrate Design Electrical Characteristic Evaluation Simulation Evaluation Research areas at MEPL The 1st Brazil-South Korea Forum on Science, Technology, and Innovation 14 Prof. Yongil Kim, MEPL (Micro Electronic Packaging Laboratory) LED package Lead Solder Substrate Cu pad
  16. 16. ⑩ Development of Stretchable Printed Circuit Board Mechanical Reliability Test Stretchable PCB Stretchable PCB Design Fabrication of Stretchable PCB Cu-Substrate Laminating DFR Laminating Lithography Developing & Etching Research areas at MEPL The 1st Brazil-South Korea Forum on Science, Technology, and Innovation 15 Prof. Yongil Kim, MEPL (Micro Electronic Packaging Laboratory)
  17. 17. The 1st Brazil-South Korea Forum on Science, Technology, and Innovation Some Research Results at MEPL Drop reliability : 0.10 ㎛ > 0.15 ㎛ > 0.05 ㎛ > 0 ㎛ Drop Test Results in ENEPIG Finished Samples 0.10 µm Pd specimen showed higher drop/shock reliability than 0.05 µm Pd specimen, about twofold, and even than 0.15 µm Pd specimen. - Cracks started from the edge to the center of the solders in all specimens. - Crack propagated along P-rich Ni/(Cu,Ni) 6 Sn 5 interfaces, through (Cu,Ni) 6 Sn 5 IMCs, or solder/(Cu,Ni) 6 Sn 5 interfaces. Crack Propagation after Drop Test (1~3) 16 Prof. Yongil Kim, MEPL (Micro Electronic Packaging Laboratory) Pd thickness ( ㎛ ) Number of drop Ni(P) (Cu,Ni) 6 Sn 5 Pd : 0.05 ㎛ Ni(P) (Cu,Ni) 6 Sn 5 (Cu,Ni) 6 Sn 5 Pd : 0.10 ㎛ Ni(P) (Cu,Ni) 6 Sn 5 (Cu,Ni) 6 Sn 5 Pd : 0.15 ㎛
  18. 18. The 1st Brazil-South Korea Forum on Science, Technology, and Innovation Some Research Results at MEPL Interface Reaction: EPMA Pd Mapping Ni EPMA Location 17 Prof. Yongil Kim, MEPL (Micro Electronic Packaging Laboratory) Ni Ni Ni Ni
  19. 19. The 1st Brazil-South Korea Forum on Science, Technology, and Innovation Some Research Results at MEPL 10 reflows 1 reflow ENIG - ENIG 1 reflow 10 reflows OSP - OSP Solder Joints of ENIG and OSP Surface Finishes Cu Cu Solder Ball Surface Treatment Sn-3.5Ag-0.7Cu IMC thickness IMC thickness 18 Prof. Yongil Kim, MEPL (Micro Electronic Packaging Laboratory) Cu Ni (Ni,Cu) 3 Sn 4 Solder Cu Ni Solder (Ni,Cu) 3 Sn 4 Cu Ni (Cu,Ni) 6 Sn 5 +(Ni,Cu) 3 Sn 4 Solder Cu Ni Solder (Cu,Ni) 6 Sn 5 +(Ni,Cu) 3 Sn 4 Cu Cu Solder Solder Cu 6 Sn 5 Cu 6 Sn 5 Cu Solder Solder Cu 6 Sn 5 Cu 6 Sn 5 Cu
  20. 20. The 1st Brazil-South Korea Forum on Science, Technology, and Innovation Some Research Results at MEPL Electro-migration Test in 3D Solder Joints 19 Prof. Yongil Kim, MEPL (Micro Electronic Packaging Laboratory) 1 st bump 2 nd bump 3 rd bump 1 st bump 3 rd bump 2 nd bump
  21. 21. Thank you very much MEPL in SKKU The 1st Brazil-South Korea Forum on Science, Technology, and Innovation 20 Prof. Yongil Kim, MEPL (Micro Electronic Packaging Laboratory)

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