Cooperation for Technology Development  in Semiconductor Packaging Society 2011. 10. 18.  Kwang-Seong Choi Team Leader of ...
Technical Trends of Packaging Technologies
Core Technologies Electrical Mechanical Thermal Fluidic Wire Solder Encapsulant Substrate Die Attach Wire Bonding Encapsul...
Technical Challenges over History Materials Substrate, UBM, Solder ball, Underfill Simulation Electrical, Mechanical, Flui...
IC Package Market Trends Source: Yole Development
Technologies and Experience of ETRI 2012 March Foundation Inception of Enterprise Technology Transfer Core Technologies
 
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Fórum Brasil-Coreia - Kwang-Seong Choi

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Fórum Brasil-Coreia - Kwang-Seong Choi

  1. 1. Cooperation for Technology Development in Semiconductor Packaging Society 2011. 10. 18. Kwang-Seong Choi Team Leader of Package Research Team 1º FÓRUM BRASIL COREIA DO SUL EM CIÊNCIA, TECNOLOGIA E INOVAÇÃO: Oportunidades e Impactos do Desenvolvimento da Indústria de Semicondutores no Brasil 1st BRAZIL-SOUTH KOREA FORUM ON SCIENCE, TECHNOLOGY AND INNOVATION: Opportunities and impacts for the development of semiconductor industry in Brazil
  2. 2. Technical Trends of Packaging Technologies
  3. 3. Core Technologies Electrical Mechanical Thermal Fluidic Wire Solder Encapsulant Substrate Die Attach Wire Bonding Encapsulating Solder Ball Delamination Crack Void Solder Joint
  4. 4. Technical Challenges over History Materials Substrate, UBM, Solder ball, Underfill Simulation Electrical, Mechanical, Fluidic, Thermal Process Solder ball attach, Wire Bonding, Molding, Reliability Solder joint Process TSV formation, Cu Plating, Thin wafer handing, Stacking Simulation Electrical, Mechanical, Fluidic, Thermal Materials TBDB adhesive, Underfill, Substrate Reliability 1980 1990 2000 2010 Representative Technical Concerns Materials EMC, L/F, bonding wire, Die attach adhesive Process Wire Bonding, Molding, Trim and Form, Plating Reliability Moisture Resistance, Pop corn crack, delamination Simulation Electrical, Mechanical, Fluidic, Thermal Materials EMC, L/F, bonding wire, Die attach adhesive Process Wire Bonding, Molding, Trim and Form, Plating Reliability Pop corn crack,
  5. 5. IC Package Market Trends Source: Yole Development
  6. 6. Technologies and Experience of ETRI 2012 March Foundation Inception of Enterprise Technology Transfer Core Technologies

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