Fórum Brasil-Coreia - Celso Peter

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Fórum Brasil-Coreia - Celso Peter

  1. 1. Unisinos SEMICONDUCTOR RESEARCH INSTITUTEOctober 19th, 2011
  2. 2. SemiconductorProduction Chain in Rio Grande do Sul DESIGN FRONT END BACK END CEITEC/SMDH CEITEC HT Micron UFRGS-PUC-UFSM UFRGS -------------
  3. 3. SemiconductorProduction Chain in Rio Grande do Sul and Brazil DESIGN FRONT END BACK END CEITEC/SMDH CEITEC HT Micron UFRGS/PUC UFRGS ------------- 22 Design Centers HT Micron 2 Training CEITEC Smart Centers & 6 Universities Commercial IC Brazil Scale Program
  4. 4. Fulfilling the Chain DESIGN FRONT END BACK END CEITEC/SMDH CEITEC HT Micron UFRGS/PUC UFRGS UNISINOS 22 Design Centers HT Micron 2 Training CEITEC Smart Centers & 6 Universities Commercial IC Brazil Scale Program
  5. 5. Why Packaging?• Ht Micron Plant at Unisinos• CEITEC installation in Porto Alegre• IC Brazil Program• Absence of Local Institution in R&D and Training• Relatively low risk• Federal Incentives (PADIS Law)• Possibility of developing research in next generation of packaging (Flip Chip,3D, TSV, PoP, ...)• Electronics market in Brazil is growing and represents about USD 35 billion
  6. 6. New Challenges:3D Stacking, TSV, Flip Chip, PoP ITRS Packaging Forecast
  7. 7. Main Objective• To create, in Rio Grande do Sul, a Centre of Excellence in R&D&I to support local Industry, focusing on semiconductors packaging and test .• Priorities - HR training - Technological Support - Research• Main characteristics – Environment for the generation, transfer and application of knowledge produced in universities and research centers in the area of semiconductor packaging and test (back end) – Integrated with the productive sector, creating a nuclear cluster of semiconductor companies – Promoter of sustainable development of a strategic industry
  8. 8. StrategyIn Brazil: Partners and Customers HT Micron Research Institutes & Universities Unisinos Semiconductor Institute CEITEC & Electro- Electronic IC Brazil Brazilian Program Companies
  9. 9. Strategy: The 2+2 Model Brazil-Korea S&T cooperation agreements S&T policies including government financial supportSouth Korea Brazil Research Institute / Research Institute / University University Private company Private company Partnership Internal / Global market
  10. 10. Strategy: The 2+2 Model Goal 1 ------------------------------------------ Semiconductor Back End Manufacturing Line HT Micron Altus (Parit) Hana Micron Brazilian Company Partnership Korean Company UNISINOS Korean Research Partnership Brazilian Research Institutes / Universities Institute / University (SKKU) Brazilian Science & Technology Policies Korean Government and Cooperation Agreements Government
  11. 11. Semiconductor InstituteModular Structure Long Term Graduate Techincal Courses Courses Design Short Term Technical Undergra- Courses HR Training duate Courses Software Proto- Drivers typing SMT Software, Electrica l Test Modeling & Test Photo- Electrical, voltaic Unisinos Mechanic Energy Semiconductor al and Thermal Institute Modeling Polymer Electro- nics Packa- Reliability ging & Failure Reliabi Analysis lity Flip MEMS Tests Chip IC Materials Failure Packaging Characte- Structur Analysis COB rization & Electrical al SiP Measurem Develop Charact ents ment erization Chemical, 6 topics Thermal Nano and materials Physical Charact.
  12. 12. UnisinosSemiconductor Institute Long Term Techincal Courses Graduate Courses Design Short Term Technical Undergra- Courses HR duate Training Courses Software Proto- Drivers typing SMT Software, Electrical Test Modeling Totals & Test Photo- Electrical, voltaic Energy •Area = 2,000 m² Unisinos Mechanic al and Semiconductor •Technicians Institute = 10 Thermal Modeling Polymer Electro- •Engineers = 14 nics Packa- •Professors/Researchers = 19 Reliability ging •Administrative = 2 & Failure • Total = 45 people Reliability Analysis Tests Flip MEMS Chip IC Materials Failure Packaging Characte- Analysis COB Structural Electrical SiP rization & Character Measurem Develop ization ents ment Chemical, Thermal Nano and materials Physical Charact.
  13. 13. UnisinosSemiconductor Institutesketch
  14. 14. UNISINOSResearch &Technological Centers
  15. 15. Priorities - 1 Long Term Graduate Techincal Courses Courses Design Short Term Undergra- Technical HR duate Courses Training Courses Software Proto- Drivers typing SMT Software, Electrica l Test Modeling & Test Photo- Electrical, voltaic Unisinos Mechanic Energy Semiconductor al and Thermal Institute Modeling Polymer Electro- nics Packa- Reliability ging & Failure Reliabili Analysis ty Flip Tests MEMS Chip IC Materials Failure Packaging Characte- Structur Analysis COB Electrical SiP rization & al Measurem Develop Character ents ization ment Chemical, Thermal Nano and materials Physical Charact.
  16. 16. Priorities - 2 Long Term Graduate Techincal Courses Courses PCB Short Design Term Undergra Technical HR Courses -duate Training Courses Software Proto- Drivers typing SMT Software, Electric Modeling al Test & Test Photo- Electrical, voltaic Unisinos Mechanic Energy Semiconductor al and Thermal Institute Modeling Polymer Electro- nics Packa- Reliability ging & Failure Reliabili Analysis ty Flip MEMS Tests Chip IC Packaging Materials Failure COB Characte- Structur Analysis SiP rization & Electrical al Measure Develop Charact ments ment erization Chemical, Thermal Nano and materials Physical Charact.
  17. 17. HR TrainingTraining Team Long Graduate Term Techincal Courses Courses• Engineers,• Professors/Researchers Short Undergra- Term HR duate Technical Courses Courses TrainingShort Term Courses• Focused on specific processes or Reliability and Failure Analysissteps (2011)•‘Hands on’ or ‘Informative’• < 80 h Materials and Processes:Ready to Start Packaging and SMTLong Term Courses Infraestructure and Semiconductors Process Control: and Electronic• Focused on managerial or technician Clean Rooms and SPC Technologytraining (2012)•~ 360 h
  18. 18. HR Training Long Term Graduate Techincal Courses Courses Short Undergra Term HR -duate Technical Courses Courses TrainingGraduate Courses• Changes on graduate curricula (2012) • Mechanical Engineering • Production Engineering • Applied Computing• New Master Program (2013) • Electrical/Electronics Engineering • Double certification (Brazil and Korea) Undergraduate Courses • Changes on undergraduate curricula (2012) • Electrical Engineering • Mechanical Engineering • Production Engineering • Automation Engineering • Environmental Engineering • Software Engineering • Computational Science
  19. 19. Reliability & Failure Analysis Area • Labs = 2 x 60 m2 • Research Offices = 2 x 40m2 Research Team • Technician = 2 Reliability Tests • Engineers = 2 • Professors/Researchers = 2 Reliability & Failure Analysis Failure Analysis & Electrical Measurem ents
  20. 20. Reliability & Failure AnalysisReliability Lab • Reliability Analysis tester Reliabili • Environmental test ty Tests • Thermal shock Reliability & Failure • Thermal cycling Analysis Electric • Burn in Measu- rements • HAST Analysis • Salt spray • Pressure Cooker • Mechanical test • Vibration (shaker)
  21. 21. Reliability & Failure Analysis Failure Analysis Lab. • Electrical Characterization Reliability Tests • Electrical Measurements Reliability • Failure Analysis & Failure • X Ray inspection tool Analysis Failure • Scanning Acoustic Microscopy Analysis
  22. 22. Materials Characterization &DevelopmentArea• Labs = 3 x 60 m2• Research Offices = 3 x 40 m2 + 1 x 50 m2Research Team Materials Characte- rization & Structur• Technician = 2 Development al• Engineers = 2 Charact erization• Professors/Researchers = 3 Chemical, Thermal Nano and materials Physical Charact.
  23. 23. Materials Characterization & Development Structural Analysis Lab. • Scanning Electron Microscope with EDX • Atomic Force Microscope • Metallographic Microscope • X-Ray Diffraction Materials Characte- Structur rization & al Develop Charact ment erization Chemical, Thermal Nano andmaterials Physical Charact. Support to Reliability & Failure Analysis
  24. 24. Materials Characterization &Development Chemical, Thermal and Mechanical Analysis • Chemical Hood • ICP (Inductively Coupled Plasma) • FRX (X-Ray Fluorescence) • TGA-ATD-DSC (Thermogravimetric Analysis) • DTA (Differential Thermal Analyser) • TMA/DMA (Thermal Mechanical Analysis) • FT-IR Materials Characte- rization & Structural Character Develop ization ment Chemical, Thermal Nano and materials Physical Charact.
  25. 25. Surface Mounted Technology Area Design • Labs = 1 x 60 m2 Proto- • Research Offices = 1 x 40 m2 + 1 x 50 m2 typing SMT Research Team • Technician = 1 • Engineers = 2 • Professors/Researchers = 2
  26. 26. Surface Mounted Technology Lab Design Design • PCB Design Proto- typing SMT Prototyping • SMT Product Prototypes • SMT Pilot Runs
  27. 27. Surface Mounted Technology Lab Equipment & Tools Design • PCB CAD Software • Quick PCB Prototyping Tool Proto- • Screen Printer typing • Solder Measurement Tool SMT • Pick and Place • Reflow Oven • Wave Soldering Machine • Rework Station • Inspection Tool/Microscope
  28. 28. Packaging Area • Labs = 5 x 60 m2 • Research Offices = 5 x 40 m2 + 1 x 50 m2 Research Team • Technician = 3 • Engineers = 3 Photo- voltaic • Professors/Researchers = 5 Energy Polymer Electro nics Packa- ging Flip MEMS Chip IC Packaging COB SiP
  29. 29. Packaging Lab COB, SiP • COB – Chip On Board Prototyping • Open cavity prototyping • Packaging Development Photo- voltaic Energy Polymer Electro nics Packa- ging Flip MEMS Chip IC Packaging COB SiP
  30. 30. Packaging Lab COB, SiP - equipment Photo- voltaic Energy •Die Attach Machine Polymer • Cure Oven Electro nics • Plasma Cleaning Packa- ging • Ball and Wedge Al/Au Wire Bonder • Dispense Molding Machine Flip Chip MEMS • Pull and Shear Test IC Packaging • Optical Microscope COB SiP •Single Wafer Back Grinding Machine • Wafer Saw
  31. 31. Embedded Software, Modeling & TestArea• Labs = 1 x 60 m2• Research Offices = 1 x 40 m2 + 1 x 50 m2Research Team Software Drivers• Technician = 1 Electrica• Engineers = 4 l Test• Professors/Researchers = 5 Software, Modeling & Test Electrical, Mechanic al and Thermal Modeling
  32. 32. Software, Modeling & Test Software Embedded Software Lab Drivers Electrical •Embedded Software Development Test for Electronic Modules Software, • Pendrives Modeling & Test Electrical, • SSDs Mechanic al and Thermal • SD cards Modeling • etc.
  33. 33. Software, Modeling & TestElectrical, Thermal & Mechanical Modeling Lab Software• Packaging Electrical Modeling Drivers• Packaging Thermal Modeling Electrical• Packaging Mechanical Modeling Test Software, ModelingTools & Test Electrical,• Mentor FloTHERM Mechanic al and Thermal• Abaqus Modeling• Spice• Matlab
  34. 34. Embedded Software & TestModules & IC Test Lab• Prototypes Test Software Drivers•Test Routines Optimization and Development• DFT Electrical Test Software,Equipment (future) Modeling Electrical, & Test Mechanic al and• Mixed Signal Tester (ATE) + Handlers Thermal Modeling
  35. 35. Packaging Photovoltaic Energy Lab. •Training • Cells and Modules Qualification • System design and application • R&D Photo- voltaic Energy Polymer Electro nics Packa- ging Flip MEMS Chip IC Packaging COB SiP
  36. 36. Packaging Photovoltaic Energy Lab Equipment • Piranometer and pyrheliometer • Spectroradiometer • Standard solar cells • Solar PV simulators • PV simulator power source • Spectral response equipment • Climatic and thermal chambers for solar panels • Thermographical camera • Power sources Photo- voltaic • Irradiance and temperature reference standards Energy • Electrical isolation tester Polymer • I-V curve tracers up to 100 kW Electro • Electric network simulator and oscilloscope nics Packa- • Battery bank, DC sources, variable loads ging Flip MEMS Chip IC Packaging COB SiP
  37. 37. Packaging Flip Chip Lab (future) • Flip Chip Prototyping • Flip Chip Process Development • Flip Chip Products Development Photo- voltaic Energy Polymer Electro nics Packa- ging Flip MEMS Chip IC Packaging COB SiP
  38. 38. Unisinos Semiconductor InstituteSpecialtiesPackaging Lab Flip Chip – equipment (future) • Flip Chip Bonding Machine • Cure Oven • Electroless Ni Plating • Sputtering (may share with MEMS) • Aligner/Stepper (share with MEMS) Photo- • Wafer Track (share with MEMS) voltaic EnergyPolymerElectro nics Packa- ging Flip MEMS Chip IC Packaging COB SiP
  39. 39. Unisinos Semiconductor InstituteSpecialtiesPackaging Lab Polymer Electronics (future) • Polymer Electronics R&D • Polymer Electronics Product Prototyping Photo- voltaic Energy Polymer Electro nics Packa- ging Flip MEMS Chip IC Packaging COB SiP
  40. 40. Packaging MEMS – Microelectromechanical Modules Lab. (future) • MEMS Design • MEMS Prototyping • MEMS Packaging Photo- voltaic Energy Polymer Electro nics Packa- ging Flip MEMS Chip IC Packaging COB SiP
  41. 41. Packaging MEMS Lab. equipment (future) • Chemical Hood – Chemical Clean/Etch • Plasma Deposition (PECVD) • Plasma Etcher • Sputtering • CSD – Spin On Track • CVD Photo- • Aligner / Stepper voltaic Energy • Wafer Track • Thin Films Measurement • Scanning Electrical Microscope Polymer Electro • Optical Microscope nics Packa- ging • X-Ray Diffraction Flip MEMS Chip IC Packaging COB SiP
  42. 42. 감사합니다!Obrigado!Thank you!

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