What is the Gowning Room? In order to protect the lab from impurities, a gowning protocol must be followed prior to entering the lab. Cleanroom gowning is specific to the cleanliness level of the cleanroom environment you are preparing to enter. The MNTC Cleanroom is rated cleanliness level class 100 in all bays and class 10 in the lithography room.MNTC Things you will find in the gowning room: Gowning Room Latex Gloves Safety glasses Hair Net – – Protection - Protection Protection against for your eyes against hair fingerprint contamination contamination Beard cover – Shoe Covers – Cleanroom Protection To maintain a Garments – against facial clean Designed to cover hair decontaminated your clothing and contamination floor inside the remaining lab exposed skin Sticky Mats – Telephone – Lab Sink - For Removes dirt For decontaminatio from shoe soles emergency n and safety calls procedures Fact : The maximum allowable contaminant particle volume for a Class 1 Cleanroom is 0.5 µm per cubic foot
What is the Thermal Bay? The thermal bay is the area inside the lab where thermal microfabrication processing occurs. Thermal oxidations and annealing for film growth are amongst the most common processes performed.MNTC Equipment you will find in the thermal bay: Thermal Bay The Bio MEMS Room The Lindberg The LPCVD are is a room used for furnaces are used for furnaces that are creating custom very high temperature capable of Low PDMS molds laboratory processes Pressure Chemical such as oxidation and Vapor Deposition. doping Safety Showers are The RTP uses high- The Thermal spinner located in every bay intensity visible bench is used for safety purposes. radiation to heat a primarily for single wafer for a application of spin-on short time at dopants and spin-on precisely controlled glass compound. temperatures and allows us to quickly grow oxides on wafers Fact : The RTP can heat up a wafer to 1000 C in 1 min
What is the Deposition Bay? The deposition bay is where we place down layers of metallic materials on a wafer of silicon or silicon oxide. The two basic methods for this is to evaporate the desired metal onto it or shooting plasma ions into the metal causing pieces of the metal to shoot out and land on the wafer. This is essential for the lift off process. The photoresist is then stripped off leaving behind the patterned area of metal.MNTC Equipment you will find in the Deposition bay: Deposition Bay The sputtering The thin film The Molecular Vapor system series is a deposition tool Deposition is set up thin film deposition featuring 3 sputter with chemical tool that uses a guns for the precursors leading sputter gun for the deposition of both either a hydrophobic deposition of both metals and or hydrophilic coating metals and dielectrics dielectrics The Plasma The TF-200 puts The E-beam Enhanced Chemical down layers of Evaporator is a Vapor Deposition material in multiple versatile thin film (PECVD) is a layers, each layer is deposition tool that process used to an atom thick. The fires super heated deposit thin films materials commonly metal onto a wafer from a gas state to a used are aluminum which forms a thin solid state on one oxide and silicon and near flat film on side of a substrate oxide the wafer. Fact : Why is technology expensive. Can you guess?
What is the Wet Etch Bay? The wet etch bay is the area where most chemistry work occurs, wet processes that are used in film manufacturing, chemical etching and general cleaning processes. Toxic fumes are eliminated via exhaust hoods on the wet benches.MNTC Things you will find in the Wet Etch Bay: Wet Etch Bay The Solvent s The Acid Hood is The Base Hood is hood is used used exclusively a hood used exclusively for for Acid exclusively for solvent processing Base Processing processing The Spin Rinse Dryer The Etch Hood is The Coway Megasonic (SRD) is used to clean used exclusively Cleaner is a megasonic off wafers by rotating for processing based wafer cleaning them at high rpms with certain tool that makes tiny which locks them in etchants bubbles with a 1.6Mhz place with centrifugal megasonic wave that force removes impurities Fact : The maximum allowable contaminant particle volume for a Class 1 Cleanroom is 0.5 µm per cubic foot
What is the Dry Etch Bay? The dry etch bay is the area where we use plasma to etch away materials on a wafer. The main method we use in this bay for etching through materials is to use reactive ions in a plasma to cause the material on wafers to vaporize and collect elsewhere.MNTC Things you will find in the Dry Etch Bay: Dry Etch Bay The Flip Chip Bonder is the direct electrical The KJL Ion Milling connection of The DRIE (Deep System is a two source face-down Reactive Ion Etcher) Ion beam based etching electronic copies a specific pattern system capable of components onto silicon wafers nanometer scale onto which is achieved etching of numerous substrates, circui through etching using materials t boards, or specific gases. carriers. The RIE is a Reactive The Zeiss The XeF2 Ion Etching device Zxiolmageer M2m System is a used to strip resist or microscope is a table top etcher etch patterns in high-end light that uses Xenon wafers after the microscope Di-fluoride photolithography featuring (XeF2) as the process reflectance and etching gas transmittance mode Fact : The maximum allowable contaminant particle volume for a Class 1 Cleanroom is 0.5 µm per cubic foot
What is the PhotolithographyBay 2?Photolithography is the process of making photomasks toeasily produce multiple wafer samples with the samestructures on them. This is done by using photoresiststhat react to UV exposure by ether strengthening orweakening its molecular structure. To weaken thephotomask, photoresist is knocked off the waferexposing what ever materials underneath. This materialwill either be etched in wet etch bay or have additionallayers be placed on top of it in deposition bay. Things you will find in the PhotolithographyMNTC Bay 2: Photolithography Bay 2 The SF-100 is an The Raith 150 e-beam easy to use micro lithography system is an patterning e-beam based system, which lithography tool capable allows users to of minimum feature fabricate micro sizes in the 10’s of devices quickly and nanometer range. easily The YES Polyimide The Heidelberg Curing Oven is a high DWL66FS performs temperature vacuum lithography by weakening oven capable of positive photoresist or operating at up to strengthening negative 550C with controllable photoresist on a wafer by atmosphere and exposing photoresist with pressure. high power UV laser Fact : The maximum allowable contaminant particle volume for a Class 1 Cleanroom is 0.5 µm per cubic foot
What is the PhotolithographyBay 1?Photolithography is the process of making photomasksto easily produce multiple wafer samples with the samestructures on them. This is done by using photoresiststhat react to UV exposure by ether strengthening orweakening its molecular structure. To weaken thephotomask, photoresist is knocked off the waferexposing what ever materials underneath. This materialwill either be etched in wet etch bay or have additionallayers be placed on top of it in deposition bay. Things you will find in the PhotolithographyMNTC Bay 1: Photolithography Bay 1 The CPK Spin Dev/Etch The ABM Aligner Bench is a spinner is used with based system for MF- photomasks to 319 based copy designs to a photolithographic substrate development and chromium etching The SUSS Mask Aligner The SUSS Wafer is used to align and/or Bonder is a exposure device for machine used to substrates used in bond multiple semiconductor and substrates together microsystem technology Fact : The maximum allowable contaminant particle volume for a Class 1 Cleanroom is 0.5 µm per cubic foot
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