Micro electromechanical system

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Micro electromechanical system

  1. 1. Micro-Electromechanical System (MEMS) K. Bharath Kanna, B.E Mech Project Associate, NITTTR Chennai.
  2. 2. Introduction  Micro-electromechanical systems (MEMS) are small integrated devices or systems that combine electrical and mechanical components.  They range in size from the sub micrometer level to the millimetres level.
  3. 3. The legs of a spider mite standing on gears from a micro-engine. A MEMS silicon motor together with a strand of human hair.
  4. 4. Different names for MEMS  USA: Micro- Electro Mechanical System.  Europe: Micro system Technology.  Japan: Micro machines.
  5. 5. MEMS Technology  Micro fabrication Technology.  The electronics are fabricated using integrated circuit (IC) process sequences.  The micromechanical components are fabricated using compatible "micromachining" processes
  6. 6. Material  Silicon  Polymer  Metals (gold, nickel, aluminum, chromium, titanium, tungsten, platinum and silver)
  7. 7. Micro fabrication There are three basic building blocks in MEMS technology.  Deposition: The ability to deposit thin film of material on substrate.  Lithography: To apply a patterned mask on top of the films by photolithographic imaging.  Etching: To etch the films selectively to the mask.
  8. 8. Deposition Technology Deposition technology can be classified into two groups: Deposition by Chemical Reaction:  Chemical Vapor Deposition.  Electro deposition.  Epitaxy  Thermal oxidation.
  9. 9. Deposition Technology Deposition by Physical Reaction:  Physical Vapor Deposition  Casting
  10. 10. Lithography Technology Lithography can be classified into two groups:  Pattern Transfer  Lithographic Module
  11. 11. Etching Technology There are two classifications for etching process:  Wet Etching: The material is dissolved in chemical solution.  Dry Etching: the material is sputtered or dissolved using reactive ions or vapour phase etchants.
  12. 12. Designing Process
  13. 13. Applications  Pressure Sensor  Accelerometers  Inertial Sensors  Micro engines
  14. 14. Commercial Application  Inkjet printers  Airbag Inflation system  Tire Pressure Sensor  Disposal Blood Pressure Sensor  Dynamic Stability Control in Cars  DMD chip in DLP Projectors
  15. 15. Advantages  Minimize energy and materials use in manufacturing  Cost/performance advantages  Improved reproducibility  Improved accuracy and reliability  Increased selectivity and sensitivity
  16. 16. Disadvantages  Farm establishment requires huge investments  Micro-components are Costly compare to macro-components  Design includes very much complex procedures  Prior knowledge is needed to integrate MEMS devices
  17. 17. Thank You

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