SST International World Leader in Package Assembly
Company Overview <ul><li>Formed in 1978, SST International has long been recognized as a world leader in package assembly ...
Company Overview <ul><li>SST International provides a comprehensive “solution–directed approach” to the microelectronic an...
What Our Systems Do <ul><li>Eutectic Die Bonding </li></ul><ul><li>Solder Reflow </li></ul><ul><li>Component Assembly  </l...
What Our Systems Produce <ul><li>Fiber Optics </li></ul><ul><li>Power Hybrids </li></ul><ul><li>Automotive Diodes </li></u...
 
 
Model 1200 Table-Top Vacuum Solder Reflow Station
Model 1200 Table-Top Vacuum Solder Reflow Station <ul><li>Many Uses Include: </li></ul><ul><li>Flux-Free Solder Process De...
MODEL 3130 Programmable Vacuum/Pressure Furnace
<ul><li>Typical Applications: </li></ul><ul><li>Flux-Free Soldering </li></ul><ul><li>Fiber Optic Package Assembly </li></...
Models 3140/3150 High Vacuum Furnace
Models 3140/3150 <ul><li>Key Uses and Applications: </li></ul><ul><li>Activate Getters and Seal MEMS Packages </li></ul><u...
Models 3180/3190 Wafer Bonder
Methods of Wafer Bonding <ul><li>Solder </li></ul><ul><ul><li>Low Temperature </li></ul></ul><ul><li>Anodic / Electrostati...
PF-2400 High Production Furnace
PF-2400 High Production Furnace <ul><li>Vacuum and Thermal Capabilities Like 3130 </li></ul><ul><li>Three Heated Platens –...
For more information contact: SST International 9801 Everest Street Downey, CA  90242  USA Telephone; +1-562-803-3362 E-Ma...
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SST International Overview presentation

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SST International Overview presentation

  1. 1. SST International World Leader in Package Assembly
  2. 2. Company Overview <ul><li>Formed in 1978, SST International has long been recognized as a world leader in package assembly </li></ul><ul><li>Quality of leadership is in the expertise with which we design and build vacuum/pressure furnaces for solder reflow assembly of high reliability microelectronic components </li></ul><ul><li>Our understanding of the systems and processes help create void-free solder joints in a flux-free environment </li></ul>
  3. 3. Company Overview <ul><li>SST International provides a comprehensive “solution–directed approach” to the microelectronic and semiconductor industries worldwide </li></ul><ul><li>We partner with our customers to develop or customize the most ideal turnkey solutions for their microelectronic package assembly needs </li></ul>
  4. 4. What Our Systems Do <ul><li>Eutectic Die Bonding </li></ul><ul><li>Solder Reflow </li></ul><ul><li>Component Assembly </li></ul><ul><li>Getter Activation </li></ul><ul><li>Glass Sealing </li></ul><ul><li>Wafer Bonding </li></ul><ul><li>Brazing </li></ul><ul><li>Solder Ball Bumping </li></ul>
  5. 5. What Our Systems Produce <ul><li>Fiber Optics </li></ul><ul><li>Power Hybrids </li></ul><ul><li>Automotive Diodes </li></ul><ul><li>MEMS Devices </li></ul><ul><li>Crystals </li></ul><ul><li>MMIC’s </li></ul><ul><li>Saw Devices </li></ul><ul><li>Microwave Pkgs </li></ul><ul><li>BGA Packages </li></ul><ul><li>Infrared Sensors </li></ul><ul><li>Flip Chips </li></ul><ul><li>Fuses </li></ul><ul><li>Miniature Lamps </li></ul><ul><li>LED’s </li></ul><ul><li>Accelerometers </li></ul><ul><li>Surge Suppressors </li></ul><ul><li>Laser Diodes </li></ul><ul><li>Medical Devices </li></ul>
  6. 8. Model 1200 Table-Top Vacuum Solder Reflow Station
  7. 9. Model 1200 Table-Top Vacuum Solder Reflow Station <ul><li>Many Uses Include: </li></ul><ul><li>Flux-Free Solder Process Development </li></ul><ul><li>University or Laboratory Research </li></ul><ul><li>Low Volume Assembly of Microelectronic Packages </li></ul><ul><li>Void-Free Eutectic Die Attach </li></ul><ul><li>Hybrid Microelectronic Circuit Assembly </li></ul><ul><li>Fiber Optic Package Assembly </li></ul><ul><li>Ceramic Package Sealing </li></ul>
  8. 10. MODEL 3130 Programmable Vacuum/Pressure Furnace
  9. 11. <ul><li>Typical Applications: </li></ul><ul><li>Flux-Free Soldering </li></ul><ul><li>Fiber Optic Package Assembly </li></ul><ul><li>MMIC Die Attach </li></ul><ul><li>Power Device Assembly </li></ul><ul><li>Hermetic Package Sealing </li></ul><ul><li>Hybrid Assembly </li></ul><ul><li>Glass-To-Metal Sealing </li></ul><ul><li>Medical Device Assembly </li></ul><ul><li>BGA Solder Ball Bumping </li></ul><ul><li>Die, Component and Substrate Solder Attach </li></ul>Model 3130 Programmable Vacuum/Pressure Furnace
  10. 12. Models 3140/3150 High Vacuum Furnace
  11. 13. Models 3140/3150 <ul><li>Key Uses and Applications: </li></ul><ul><li>Activate Getters and Seal MEMS Packages </li></ul><ul><li>Solder, Braze or Glass Seal Packages in High Vacuum Environment </li></ul><ul><li>Seal Packages with High Purity Gasses </li></ul><ul><li>Low Moisture Package Sealing </li></ul><ul><li>Laboratory and Production Tool </li></ul>
  12. 14. Models 3180/3190 Wafer Bonder
  13. 15. Methods of Wafer Bonding <ul><li>Solder </li></ul><ul><ul><li>Low Temperature </li></ul></ul><ul><li>Anodic / Electrostatic </li></ul><ul><ul><li>Glass to Silicon – High Voltage </li></ul></ul><ul><li>Fusion </li></ul><ul><ul><li>Silicon to Silicon – Very High Temperature </li></ul></ul><ul><ul><li>Glass to Silicon – Lower Temperatures </li></ul></ul>
  14. 16. PF-2400 High Production Furnace
  15. 17. PF-2400 High Production Furnace <ul><li>Vacuum and Thermal Capabilities Like 3130 </li></ul><ul><li>Three Heated Platens – Each is 8 x 36 inches </li></ul><ul><li>About 20X Production Capacity as 3130 </li></ul><ul><li>Maximum Temperature 500 °C </li></ul><ul><li>Vacuum System is 2-Stage Rotary Vane Pump with High Volume Roots Blower </li></ul><ul><li>Ultimate Vacuum Capability of 10 millitorr </li></ul>
  16. 18. For more information contact: SST International 9801 Everest Street Downey, CA 90242 USA Telephone; +1-562-803-3362 E-Mail; info@sstinterantional.com Web; www.sstinternational.com

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