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SST International Overview presentation SST International Overview presentation Presentation Transcript

  • SST International World Leader in Package Assembly
  • Company Overview
    • Formed in 1978, SST International has long been recognized as a world leader in package assembly
    • Quality of leadership is in the expertise with which we design and build vacuum/pressure furnaces for solder reflow assembly of high reliability microelectronic components
    • Our understanding of the systems and processes help create void-free solder joints in a flux-free environment
  • Company Overview
    • SST International provides a comprehensive “solution–directed approach” to the microelectronic and semiconductor industries worldwide
    • We partner with our customers to develop or customize the most ideal turnkey solutions for their microelectronic package assembly needs
  • What Our Systems Do
    • Eutectic Die Bonding
    • Solder Reflow
    • Component Assembly
    • Getter Activation
    • Glass Sealing
    • Wafer Bonding
    • Brazing
    • Solder Ball Bumping
  • What Our Systems Produce
    • Fiber Optics
    • Power Hybrids
    • Automotive Diodes
    • MEMS Devices
    • Crystals
    • MMIC’s
    • Saw Devices
    • Microwave Pkgs
    • BGA Packages
    • Infrared Sensors
    • Flip Chips
    • Fuses
    • Miniature Lamps
    • LED’s
    • Accelerometers
    • Surge Suppressors
    • Laser Diodes
    • Medical Devices
  •  
  •  
  • Model 1200 Table-Top Vacuum Solder Reflow Station
  • Model 1200 Table-Top Vacuum Solder Reflow Station
    • Many Uses Include:
    • Flux-Free Solder Process Development
    • University or Laboratory Research
    • Low Volume Assembly of Microelectronic Packages
    • Void-Free Eutectic Die Attach
    • Hybrid Microelectronic Circuit Assembly
    • Fiber Optic Package Assembly
    • Ceramic Package Sealing
  • MODEL 3130 Programmable Vacuum/Pressure Furnace
    • Typical Applications:
    • Flux-Free Soldering
    • Fiber Optic Package Assembly
    • MMIC Die Attach
    • Power Device Assembly
    • Hermetic Package Sealing
    • Hybrid Assembly
    • Glass-To-Metal Sealing
    • Medical Device Assembly
    • BGA Solder Ball Bumping
    • Die, Component and Substrate Solder Attach
    Model 3130 Programmable Vacuum/Pressure Furnace
  • Models 3140/3150 High Vacuum Furnace
  • Models 3140/3150
    • Key Uses and Applications:
    • Activate Getters and Seal MEMS Packages
    • Solder, Braze or Glass Seal Packages in High Vacuum Environment
    • Seal Packages with High Purity Gasses
    • Low Moisture Package Sealing
    • Laboratory and Production Tool
  • Models 3180/3190 Wafer Bonder
  • Methods of Wafer Bonding
    • Solder
      • Low Temperature
    • Anodic / Electrostatic
      • Glass to Silicon – High Voltage
    • Fusion
      • Silicon to Silicon – Very High Temperature
      • Glass to Silicon – Lower Temperatures
  • PF-2400 High Production Furnace
  • PF-2400 High Production Furnace
    • Vacuum and Thermal Capabilities Like 3130
    • Three Heated Platens – Each is 8 x 36 inches
    • About 20X Production Capacity as 3130
    • Maximum Temperature 500 °C
    • Vacuum System is 2-Stage Rotary Vane Pump with High Volume Roots Blower
    • Ultimate Vacuum Capability of 10 millitorr
  • For more information contact: SST International 9801 Everest Street Downey, CA 90242 USA Telephone; +1-562-803-3362 E-Mail; info@sstinterantional.com Web; www.sstinternational.com