3-D imaging by terahertz scanner

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With the recent development of improved 3D imaging, ARP’s terahertz scanner is now capable of “seeing” inside of wafers and image defects. Thus, in addition to quantifying the defect size, one is also able to visualize the defects on the nanometer scale.

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3-D imaging by terahertz scanner

  1. 1. Demonstration of sub-surface 3-D imaging capability Applied Research & Photonics, Inc. 470 Friendship Road, Suite 10 Harrisburg, PA 17111, USA http://arphotonics.net/ Phone: +1-717-220-1003 Email: info@arphotonics.net
  2. 2. Demonstration of sub-surface 3-D imaging capabilityWith the recent development of improved 3Dimaging, ARP’s terahertz scanner is nowcapable of “seeing” inside of wafers and otheropaque substrates. A scanning image isgenerated pinpointing location and size ofparticulate, void, and other defects. Inaddition, defect size is quantified by to-the-scale direct measurements. It can alsovisualize the defects on the nanometer scale.
  3. 3. Snap shot of patterns on a wafer Scanned surface image of a wafer. Total scan length is ~5 µm.
  4. 4. 360° inside view of the object360° view of a wafer. Color contrast represents objects of different size and material.
  5. 5. Scanner details• The terahertz sub-surface scanner from ARP is a user friendly, easy to use machine.• All operations are automated via included software.• The machine exhibits an unprecedented resolution of a few nanometers in 3 axial directions.• Yet scanning is fast
  6. 6. Scanner details (contd.)• Screen shot of measurement console shown in the next slide.• All parameters are entered by the front- end interface.• Measured data are accessible for further manipulations.
  7. 7. Measurement ConsoleScreen shot of measurement console. All parameters are enteredvia the front-end. Data are easily accessible.
  8. 8. Contact informationFor more information, please contact:Anis Rahman, PhDemail: info@arphotonics.netPhone: 717-623-8201
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