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  • 1. IMECAT A GLANCE
  • 2. HISTORY ▸ Established by state government of Flanders in 1984 ▸ Independent non-profit organization ▸ Worldwide reach ▸ Initial investment: 62M€ ▸ Initial staff: ~70 © IMEC 2012
  • 3. MISSION ▸ W ld l di research in World-leading hi nano-electronics ▸ Scientific knowledge with innovative power of global partnerships in ICT, healthcare and energy ▸ Industry-relevant technology solutions ▸ International top talent in a unique high-tech environment committed to provide building blocks for a better life in a sustainable society © IMEC 2012
  • 4. FULL ECO SYSTEM UniversitiesEurope IMEC Government Industry y
  • 5. FACTS & FIGURES ▸ Total revenue in 2011 of 300M€, a growth of 5% ▸ 1 773 publications R&D 1,773 related in 2011 ▸ 132 patents awarded & p 133 patents submitted in 2011 ▸ Collaboration with 600 companies & 208 universities ▸ 600 residents © IMEC 2012
  • 6. Top 5 foreign employees HEADCOUNT 1. 1 The Netherlands (# 159) 2. China (# 87) 3. France (# 86) May 2012: 4. India (# 76) 5. Japan (# 61) ▸ 1,077 Belgians ▸ 72 foreign nationalities 159160140120100 87 8680 76 59 6160 46 4340 30 31 28 25 16 1820 13 13 15 10 10 12 7 7 5 8 8 7 4 4 5 4 4 5 6 4 2 5 1 1 3 1 2 2 1 1 1 1 1 1 1 2 1 3 2 1 1 1 2 1 3 1 1 1 1 2 1 2 1 1 1 1 1 0
  • 7. IMEC IN THE WORLD The Netherlands Belgium Chinaoffice US office Japan Taiwan India
  • 8. Organic Silicon solar cell 200mm line NERF solar cell lab pilot line line Nano 300mmbiolabs pilot line 450mm ready STATE-OF-THE-ART RESEARCH FACILITIES
  • 9. 300mm PILOT LINEIMEC TOWER‣ Expansion of 14,208 m2 14 208‣ 16 floors – capacity of 450 people & lab space
  • 10. RESEARCH PROGRAMS FOR FULL ECO SYSTEMHuman++ Green Radio Imaging Sensor Energy BAN Low power Image sensors systems Photovoltaics Life Sciences wireless & vision systems for industrial Power devices communication applications LEDs Core CMOS CMORE Organic Lithography Devices Interconnects MEMS, Sensor electronics Photonics
  • 11. SCALING ‣ 1965: Lithography enabled scaling ‣ 2002-2003: ~ 90 nm 2002 2003: Materials enabled scaling ‣ ~ 14 nm: 3D enabled scaling © IMEC 2012
  • 12. FINFET ‣ 22nm – 14nm ‣ FinFET introduction at 22nm for high-end high end applications ‣ 14nm for foundry processes © IMEC 2012
  • 13. LOGIC ‣ High mobility channel ‣ 10 nm – 7nmGe © IMEC 2012
  • 14. LOGIC ‣ High mobility channel InGa As ‣ 10nm – 7nmGe InP GaAs Ge Si © IMEC 2012
  • 15. LOGICTunnel FET ‣ New device concepts Pinch-off FET ‣ Tunnel FET ‣ Pinch-off FET ‣ 7nm – 5nm © IMEC 2012
  • 16. ReRAM ‣ Resistive RAM ‣ Integration in a vertical concept ‣ In 2011: world’s smallest, fully-functional HfO2-based ReRAM cell, with an area of less than 10 x 10nm² © IMEC 2012
  • 17. DRAM ‣ STT RAM as stand alone and for embedded memory<20nm © IMEC 2012
  • 18. 3D INTEGRATION ‣ Reducing floor space – small form factor ‣ 3D stacking of memory on logic or RF on interposer © IMEC 2012
  • 19. OPTICAL I/O ‣ Extreme high bandwidth I/O in high performance computing ‣ Imec world-first sub- 100nm photonics components on 300mm Si technology with optical lithography li h h © IMEC 2012
  • 20. EUV ‣ ASML preproduction scanner NXE:3100 for extreme UV lithography © IMEC 2012
  • 21. LITHO POWER ‣ 16nm half pitch ‣ Phenomenal lithographic power can be achieved © IMEC 2012
  • 22. DIRECTED SELFASSEMBLY ‣ Extending optical g p lithography beyond its current limits ‣ Alternative patterning enabling frequency multiplication through use p g of block copolymers © IMEC 2012
  • 23. INSITE ‣ Technology insights for gy g SYSTEM DESIGN product roadmaps (Fabless - Fablite) INSITEPROCESS TECHNOLOGY (Foundry) © IMEC 2012
  • 24. INSITE Technology Option selection ‣ Linking process technology gp gy & system designPath-finding Technology- Test chips design g Design &co-exploration build Model Measure & characterize © IMEC 2012
  • 25. 300mm PILOT LINE ‣ Investment > 1B$ $ ‣ Unique lithography cluster centered around ASML equipment ‣ Advanced equipment and preproduction tools ‣ Ballroom type of cleanroom ‣ 4 800 ² class 1 000 area 4,800m² l 1,000 © IMEC 2012
  • 26. 300mm PILOT LINE300mm PILOT LINE:‣ Silicon pilot line for (sub-)22nm‣ Semi-industrial operation - 24/7, process monitoring, short cycle time
  • 27. PREPARING 450mm ‣ Funding Flemish g Government ‣ Towards Europe’s innovation engine © IMEC 2012
  • 28. GLOBAL NETWORK SYSTEM COMPANIESMEMORY IDM LOGIC IDM FOUNDRIES FABLITE FABLESS EQUIPMENT MATERIAL SOFTWARE SUPPLIERS SUPPLIERS SUPPLIERS
  • 29. GLOBAL NETWORKMemory IDM Logic IDM Foundries Fablite Fabless The image cannot be display ed. Your computer may not hav e enough memory to open the image, or the image may hav e been corrupted. Restart y our computer, and then open the file again. If the red x still appears, y ou may hav e to delete the image and then insert it again.
  • 30. CORE CMOS PARTNERS The image cannot be display ed. Your computer may not hav e enough memory to open the image, or the image may hav e been corrupted. Restart y our computer, and then open the file again. If the red x still appears, y ou may hav e to delete the image and then insert it again. Lam RESEARCH
  • 31. RESEARCH PROGRAMS FOR FULL ECO SYSTEMHuman++ Green Radio Imaging Sensor Energy BAN Low power Image sensors systems Photovoltaics Life Sciences wireless & vision systems for industrial Power devices communication applications LEDs Core CMOS CMORE Organic Lithography Devices Interconnects MEMS, Sensor electronics Photonics
  • 32. BODY AREANETWORKS
  • 33. internetdoctor BODY AREAhospital NETWORKS ▸ W Wearable h l h and bl health d comfort monitoring © IMEC 2012
  • 34. HEALTH PATCH ▸ M l i parameter: Multi - heartbeat - skin temperature - skin conductance - sweat analysis - chemical sensing g © IMEC 2012
  • 35. HEALTH PATCHECG PATCH ▸ Ul l Ultra-low power ECG patch ▸ Bluetooth low energy gy ▸ Embedded algorithm ▸ 30 days autonomy © IMEC 2012
  • 36. WIRELESS EEG Applications: A li i ▸ Improving traffic safety through drowsiness g monitoring ▸ Games that adapt to the player s player’s cognitive state ▸ E-learning that adapts to the user’s concentration ▸ Accurate EEG monitoring at home, e.g. epilepsy patients © IMEC 2012
  • 37. ULTRA LOWENERGY DESIGN ▸ Di i l system d i f Digital design for battery operated and harvested devices with 10-100 times less power consumption ▸ Reliable near-threshold near threshold design ▸ Ultra energy efficient biomedical processing bi di l i © IMEC 2012
  • 38. MOBILEDIAGNOSTICS ▸ Aff d bl Affordable ▸ Health monitoring to rural environments in developing countries © IMEC 2012
  • 39. CMUT4D RT imaging ▸ C Capacitive Mi i i Micromachined hi d Ultrasonic Transducers technology Mock up ▸ Towards mobile real-time 4D ultrasound ▸ More precise & faster ultrasound scans © IMEC 2012
  • 40. CMUT: BASED ONSiGe MEMS ▸ SiG MEMS on top of SiGe f CMOS ▸ Membranes integrated g with electronics ▸ More compact, faster, more sensitive, increasing sensitive pixel density © IMEC 2012
  • 41. LIFE SCIENCES:EARLY DIAGNOSTICS
  • 42. EARLYDETECTION ▸ E l d Early detection of cancer i f cells ▸ Secondary tumors are y main cause of most cancer deaths ▸ Challenge: detecting one in 5 billion cells © IMEC 2012
  • 43. INSPECTIONCIRCUITS ▸ Chi with thousands of Chip i h h d f parallel inspection circuits ▸ Each containingg electronics, microfluidics & imaging hardware ▸ Goal: inspect 20 million cells per second with high reliability © IMEC 2012
  • 44. LIFE SCIENCES:PERSONALIZED THERAPY
  • 45. STEM CELLS ▸ T Treat diabetes patients by di b i b replacing faulty pancreas cells with new pancreas cells ▸ Reprogrammed on the basis of own stem cells © IMEC 2012
  • 46. STEM CELLBIOREACTOR ▸ G Growing cells & tissues on i ll i chips ▸ Two-way communication y between electronics & cells ▸ Expertise in electrode arrays on active CMOS for cell recording of neurons & cardiac cells di ll © IMEC 2012
  • 47. PRECISEREPROGRAMMING ▸ Ch ll Challenge: a platform f l f for precise reprogramming and growth of stem cells ▸ Built on expertise in advanced semiconductor equipment & advanced metrology © IMEC 2012
  • 48. NERF LAB ▸ I Imec & VIB & KU Leuven L ▸ Unraveling the human brain ▸ Research interests: - sensory integration & processing i the i in h zebrafish brain - neural circuits & behavior - functional assembly of neural circuits l i it © IMEC 2012
  • 49. HUMAN++ PROGRAM PARTNERS
  • 50. RESEARCH PROGRAMS FOR FULL ECO SYSTEMHuman++ Green Radio Imaging Sensor Energy BAN Low power Image sensors systems Photovoltaics Life Sciences wireless & vision systems for industrial Power devices communication applications LEDs Core CMOS CMORE Organic Lithography Devices Interconnects MEMS, Sensor electronics Photonics
  • 51. WIRLESS SENSORS ▸ Improving connectedness ▸ Smarter world: - smart healthcare - smart buildings - smart phone - smart display © IMEC 2012
  • 52. WIRELESSCOMMUNICATION ▸ Innovative solutions for tomorrow’s wireless communication ▸ By combining advanced IC technology with innovative design strategies & smart software techniques ▸ Fully-integrated energy- efficient solutions with more performance & flexibility y © IMEC 2012
  • 53. RECONFIGURABLERADIOS ▸ Towards low cost & low low-cost low- power reconfigurable radios ▸ Enabling future 4G networks and digital video broadcasting ▸ Reconfigurable analog front- front end ▸ Reconfigurable digital baseband b b d ▸ Spectrum sensing ▸ Record breaking ADCs © IMEC 2012
  • 54. mmWAVESOLUTIONS ‣ Wireless solutions that exploit the bandwidth capacity available at 60GHz for h t 60GH f short-range Gigabit/s communication ‣ Radar & backhaul applications emerging © IMEC 2012
  • 55. ULTRA LOWULTRA-LOWPOWER RADIOS ‣ Radios for battery & energy harvested devices with power consumption that i 10 100 times l th t is 10-100 ti lower than conventional low- power systems © IMEC 2012
  • 56. PARTNERS W S WIRELESS TECHNOLOGY SS C O OG
  • 57. RESEARCH PROGRAMS FOR FULL ECO SYSTEMHuman++ Green Radio Imaging Sensor Energy BAN Low power Image sensors systems Photovoltaics Life Sciences wireless & vision systems for industrial Power devices communication applications LEDs Core CMOS CMORE Organic Lithography Devices Interconnects MEMS, Sensor electronics Photonics
  • 58. TARGET MARKETS ▸ Space p ▸ Instrumentation ▸ Machine vision ▸ Medical ▸ Biology © IMEC 2012
  • 59. SPECIALIZEDIMAGING ▸ Ultra fast ▸ Non-visible light ▸ Enhanced performance ▸ Hyperspectral ▸ Lensless © IMEC 2012
  • 60. ULTRA FASTIMAGING Challenge g ▸ Fast readout at low power consumption ▸ Towards million frames/sec Building on imec expertise: ▸ High speed ADCs ▸ Embedded CCD © IMEC 2012
  • 61. IMAGING NONVISIBLE LIGHT ▸ Fully qualified EUV sensors yq installed in customer’s product: ASML/3100 lithography tool - EUV Energy sensor to monitor EUV dose - 2 EUV position sensors to calibrate, align and focus lens systems © IMEC 2012
  • 62. ENHANCEDPERFORMANCE ▸ Backside illumination for: - High quantum efficiency - Broad spectral range from 193nm to 1μm © IMEC 2012
  • 63. HYPERSPECTRALIMAGING Advantages: g ▸ More spectral information (than RGB) ▸ Extreme miniaturization ▸ Low cost ▸ High speed ▸ Wafer-level filter integration © IMEC 2012
  • 64. LENSLESS Microscopic imaging over a p g g large area Biomedical applications: ▸ Cell sorting & monitoring (flow cytometry) ▸ Molecular diagnostics (biomarkers assays)150 µm ▸ DNA sequencing © IMEC 2012
  • 65. RESEARCH PROGRAMS FOR FULL ECO SYSTEMHuman++ Green Radio Imaging Sensor Energy BAN Low power Image sensors systems Photovoltaics Life Sciences wireless & vision systems for industrial Power devices communication applications LEDs Core CMOS CMORE Organic Lithography Devices Interconnects MEMS, Sensor electronics Photonics
  • 66. APPLICATIONS ‣ Smart buildings g ‣ Preventive maintenance ‣ Logistics ‣ Automotive ‣ Monitoring environmental parameters © IMEC 2012
  • 67. SENSOR SYSTEMS ‣ Long-time autonomy g y ‣ Ultra-low power wireless solutions: 10 – 100 times lower than conventional low-power systems p y © IMEC 2012
  • 68. MEMSHARVERSTER ‣ Piezoelectric harvesters ‣ MEMS harvester to power intelligent tire ‣ Record output of 489µW © IMEC 2012
  • 69. ETHYLENESENSOR ‣ Sensor in one single chip g p ‣ Monitor fruit ripening ‣ Low detection limits low limits, cost, low power consumption © IMEC 2012
  • 70. 2.3/2.4 GHZTRANSMITTER ‣ Multi-standard transceiver for sensor networks ‣ 2.3/2.4GHz transmitter for wireless sensor applications compliant with 4 wireless standards ‣ 3 to 5 times more power efficient than state-of-the- art Bl Bluetooth LE h © IMEC 2012
  • 71. RESEARCH PROGRAMS FOR FULL ECO SYSTEMHuman++ Green Radio Imaging Sensor Energy BAN Low power Image sensors systems Photovoltaics Life Sciences wireless & vision systems for industrial Power devices communication applications LEDs Core CMOS CMORE Organic Lithography Devices Interconnects MEMS, Sensor electronics Photonics
  • 72. ENERGYSTRATEGY ▸ Solar energy generation ▸ Switching energy ▸ Storing energy ▸ Saving energy © IMEC 2012
  • 73. SILICON PV
  • 74. COMBININGEXPERTISE ▸ Process steps ▸ Materials ▸ Device/module concepts p Towards world record performance © IMEC 2012
  • 75. SILVERREPLACEMENT ▸ 7% of all silver used in PV ▸ A major part of PV cell cost is silver ▸ Replacing silver by copper © IMEC 2012
  • 76. Cu PLATEDCu-PLATEDSi SOLAR CELL ▸ Copper electroplating ▸ >21% efficiency © IMEC 2012
  • 77. INTERDIGITATEDBACK-CONTACT SiSOLAR CELL ▸ > 23% efficiency © IMEC 2012
  • 78. I MODULEI-MODULE ▸ Cell integration of ultra ultra- thin wafers onto module glass ▸ Integrating additional electronics to module for p power conversion & load optimization © IMEC 2012
  • 79. Si-PV IIAP PARTNERS
  • 80. OPV
  • 81. ORGANIC CELLS ▸ Towards: - 10% efficiency - 10 years lifetime © IMEC 2012
  • 82. INVERTEDPOLYMER CELL ▸ World record efficiency 8,3% © IMEC 2012
  • 83. COMBININGEXPERTISE ▸ Materials and cell architectures ▸ Collaboration between world-class chemical companies, innovative developers & imec d l © IMEC 2012
  • 84. GaN on SiGaN-on-Si LEDs ▸ LED on 200mm GaN-on- Si wafers ▸ To make LEDs cheaper © IMEC 2012
  • 85. GaN on SiGaN-on-Si LEDs ▸ Process flow fully compatible with 200mm CMOS processing line © IMEC 2012
  • 86. GaN ON SiGaN-ON-Si powerdevices ▸ GaN power devices on 200mm Si substrates © IMEC 2012
  • 87. OLED ▸ New flexible OLED lighting program ▸ Economically scalable route to high-volume manufacturing ▸ Low power consumption, high resolution, large area, outdoor readability, flexibility & light weight © IMEC 2012
  • 88. GaN PARTNERS25 year solarcell research
  • 89. RESEARCH PROGRAMS FOR FULL ECO SYSTEMHuman++ Green Radio Imaging Sensor Energy BAN Low power Image sensors systems Photovoltaics Life Sciences wireless & vision systems for industrial Power devices communication applications LEDs Core CMOS CMORE Organic Lithography Devices Interconnects MEMS, Sensor electronics Photonics
  • 90. CMOREMEMS NANO-PHOTONICS ‣ Turn your silicon concept y p into a productSENSORS POWER-HIGH V-HBTBIO-INTERFACE GaN © IMEC 2012
  • 91. CMORE PRO STEP 1 STEP 4 OTOTYPIN - CONCEPT DESIGN - PROTOTYPING - LOW-VOLUME MANUFACTURING AT IMEC ‣ Turn your silicon concept y p NG LOPMENT into a product STEP 2 STEP 5 - PROCESS DEVELOPMENT - TRANSFER O-)DEVEL - PACKAGING - TESTING - RELIABILITY(CO STEP 3 STEP 6 PRODUCTION - PRODUCT - HIGH-VOLUME QUALIFICATION MANUFACTURING AT FOUNDRY PARTNER © IMEC 2012
  • 92. EUV SENSORS ‣ High-quality EUV sensors g q y for ASML’s next-generation lithography tools ‣ Main requirements: - superior lifetime - sensitivity to direct and y high doses of EUV irradiation ‣N Next generation: i - NXE:3100 - NXE: 3300 © IMEC 2012
  • 93. BIOSENSORS ‣ Biosensor chips for p Genalyte diagnostic & molecular detection equipment ‣ CMORE service making use of imec’s silicon photonic p technology © IMEC 2012
  • 94. CMORE PARTNERS
  • 95. RESEARCH PROGRAMS FOR FULL ECO SYSTEMHuman++ Green Radio Imaging Sensor Energy BAN Low power Image sensors systems Photovoltaics Life Sciences wireless & vision systems for industrial Power devices communication applications LEDs Core CMOS CMORE Organic Lithography Devices Interconnects MEMS, Sensor electronics Photonics
  • 96. SYSTEM ON FOIL Thin-film electronics on flexible plastic foils Applications: ▸ rollable displays for tablet computers or phones p p ▸ electronics printed on objects ▸ intelligent food packaging, or paper with integrated electronics © IMEC 2012
  • 97. MICROPROCESSOR ▸ First microprocessor p © IMEC 2012
  • 98. IMECWHAT WE OFFER
  • 99. BUSINESS MODELServices TrainingSpin-offs Transfer & licenses Joint R&D © IMEC 2012
  • 100. OPEN INNOVATION IP Risk Ri k Services Training Cost Talent Spin- Transfer & offs licenses Joint R&D Accelerated,cost-effective R&D ff © IMEC 2012
  • 101. OPEN Partner INNOVATION A Partner Partner E B Program Services Training Partner Partner Spin- Transfer & D C offs licenses Joint R&DImec i d t i l affiliation programI industrial ffili ti Customized programs © IMEC 2012
  • 102. RESEARCH PROGRAMS System Services Training Fabless Fablite Logic IDM Spin- Transfer &Memory IDM Foundries offs licenses Suppliers Joint Material Equipment R&D Suppliers Suppliers EDA SAT © IMEC 2012
  • 103. RESEARCH PROGRAMS FOR FULL INDUSTRY ECO SYSTEMMemory IDM Logic IDM Foundries Fablite Fabless The image cannot be display ed. Your computer may not hav e enough memory to open the image, or the image may hav e been corrupted. Restart y our computer, and then open the file again. If the red x still appears, y ou may hav e to delete the image and then insert it again.
  • 104. SERVICES▸ ASIC services: - Design - Prototyping to low-volume▸ CMORE platform: - Design Services Training - Process techn. development - Prototyping to low- Spin- Transfer & volume offs licenses▸ CAMS: - A unique set of reliability and q y Joint characterization services R&D © IMEC 2012
  • 105. TRAINING▸ Imec Academy y▸ Training for industry & academia on advanced concepts and technologies▸ Advanced training programs on IC technology Services Training and design and related▸ E-learning and web-based training▸ On-line knowledge exchange Spin- Transfer & offs licenses Joint R&D www.imec-academy.be © IMEC 2012
  • 106. SPIN OFFS SPIN-OFFS Services Training Spin- Transfer & offs licensesIntegrated in Synopsis Inc. Integrated in Cypress g yp Integrated in Agilent Technologies T h l i Joint R&D Integrated in ARM Belgium Integrated in Huawei Alphabit & UCB Electronics integrated in Agilent Technologies Cobrain integrated in Matrix Integrated Systems, Inc. © IMEC 2012
  • 107. TRANSFER & LICENSES▸ Process steps, modules, technologies: 65nm and 28nm CMOS platform▸ IP blocks: Services Training - ADCs - Software-defined radio - Reconfigurable processor Spin- Transfer & -… offs licenses Joint R&D © IMEC 2012
  • 108. IMECIN FLANDERS
  • 109. LEVERAGE TO FLANDERS With a dedicated team stimulating, initiating &coordinating cooperationwith Flemish companies & innovation actors Exploration, transfer & consolidation in Flanders Worldwide industrial network of top companies Build-up Build up of technology portfolio in generic R&D Programs
  • 110. COOPERATION WITH LOCAL COMPANIES / ACTORS Timely insight Participation in and inputs for LT/MT/ST LT research researchh 1 few Sharing Focussed added value Application of pp technological research results know-how Cooperation with Support forInforming about development of technological local new products d opportunities companies/actors and processes 1 many 1 1 Low threshold High threshold Generic added value Specific added value
  • 111. EXPANSION MODEL:MICROELECTRONICS FOR BENEFIT OF OTHER SECTORS Textile Automotive Biomedic Food alElectronic Design Construction Health & Wellness
  • 112. IMEC’S IMPACT ON THE LOCAL INDUSTRYEVOLUTION COLLABORATION LOCAL COMPANIES600 1984  2001:500 142 local companies 486 464 2002  2011: 447 344 extra local companies, 411400 >60% SME’s! 381 350 306300 261 222200 166 142 127 102 110 86100 74 57 45 26 32 0 1992 1993 1994 1995 1996 1997 1998 1999 2000 2001 2002 2003 2004 2005 2006 2007 2008 2009 2010 2011
  • 113. OUR PARTNERS 3 66 4 10 388 11 32 9 15 Hasselt 10 208 102 68 24 58 PARTNERS SPREAD OUT OVER FLANDERS
  • 114. A SAMPLE OF THE FLEMISH PARTNERS
  • 115. COOPERATION IN DIFFERENT SECTORS 2011 WITH LOCAL COMPANIES 22% 34% Microelectronics Non-ICT Textile Automotive Medical Food Graphics Wellness 26% Health H lth Chemical 18% Electronic prod.Construction ICT (others) Domotics